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Tuesday 31 December 2013
Genesis Photonics finds way to Blue Ocean through high-power, flip-chip LED technology
Genesis Photonics Inc. (GPI), which has been devoted to developing LED epitaxial wafer and chip technology for over 10 years, has made great strides in flip-chip packaging. GPI has...
Tuesday 2 April 2013
Demand for COB packaging used in high-power LED lighting to grow fast, says Lextar
As high-power LED lighting for commercial purposes is significantly on the rise, demand for COB (chip on board) packaging of high-power LED chips used in lighting will grow fast in...
Monday 12 December 2011
Chilisin in full throttle for smartphone market by launching high-power, energy-saving inductor products with high CP ratio
It is an era dominated by 3C products, and in almost all product categories there are flat panel devices. For such devices, a thin and light design is a common goal, and for mobile...
Friday 4 March 2011
LED packager Lustrous expects to ship 1 million high-voltage units in 2011
High-power LED packaging house Lustrous Technology expects shipments to reach one million units in 2011 as shipments are expected to increase significantly in the second half of the...
Friday 4 March 2011
Edison Opto posts record net EPS in 2010
High-power LED chip packaging house Edison Opto has reported net profits of NT$491 million (US$17 million) on revenues of NT$3 billion for 2010. The earnings translated into a net...
Wednesday 26 January 2011
Lumileds high-power LED capacity to reach 1 billion in 2011
Philips Lumileds expects its high-power LED capacity to reach one billion units in 2011 and aims to reach the level of 200 lumen per US$1 for the cold white LEDs at the end of 2011...
Friday 14 January 2011
LED lighting market to take-off in 3Q11
The LED lighting market is expected to see significant growth as early as the third quarter of 2011 as Taiwan-based LED chipmakers are expected to follow US-based Cree, who lowered...
Friday 26 November 2010
Edison launches new high-power customized LED lighting product
High-power LED chip packaging house Edison Opto has introduced a series of high-power LED lighting components, the EdiPower II, which offers customized solutions based on different...
Thursday 11 November 2010
Edison to list on TSE mainboard
High-power LED packaging house Edison Opto will list on the mainboard of the Taiwan Stock Exchange (TSE) on November 12.
Thursday 16 September 2010
Epistar and Toyoda Gosei sign cross license agreement on LED-related patents
Epistar and Toyoda Gosei have entered a cross license agreement, allowing the companies and their subsidiaries the use of each other's patents for specific technologies in Group III-V...
Tuesday 10 August 2010
Chip-resistor substrate supply to remain tight through year-end 2010
Supply of chip-resistor substrates, especially for large-size resistor parts and high-power ones, will likely remain tight through the end of 2010, according to sources at Taiwan-based...
Monday 19 July 2010
Taiwan LED chipmakers produce high-power chips for edge-type LED BLU to secure orders from Korea TV vendors
Taiwan-based LED chipmakers have begun producing high-power LED chips used in 40-inch LED-backlit LCD TV with edge-type backlight units (BLUs) for TV vendors Samsung Electronics and...
Friday 16 July 2010
LED chipmakers develop new substrates to improve heat dissipation
LED chipmakers are developing new substrates based on copper-tungsten, ceramic or diamond thin-film to replace sapphire substrates to improve heat dissipation amid the surging demand...
Friday 11 June 2010
Edison reports May revenues up
High-power LED packaging house Edison Opto posted revenues of NT$295 million (US$9.12 million) for May, up 127.92% on year. Revenues for January through May 2010 totaled NT$1.19 billion,...
Friday 9 October 2009
Lite-On, Bright LED and Harvatek see year-high revenues in September
LED packaging houses Lite-On Technology, Bright LED Electronics and Harvatek have all reported year-high revenues for September 2009.