SK Hynix is reducing its CIS and wafer foundry operations to prioritize high-margin HBM and AI memory products. It is also expanding into emerging technologies, including Compute...
The AI surge is fueling unprecedented demand for High Bandwidth Memory (HBM), prompting Winbond Electronics to focus on tailored AI memory solutions for end applications. The company...
With the rise of Chinese chip manufacturers in recent years, local customer development and technical support have become key factors in their globalization efforts. Hua Dong, president...
The automotive supply chain has been divided into two camps in recent years: the West, encompassing Europe and the US, and China. While near-term demand projections remain uncertain,...
Business opportunities for peripheral chips can only advance further when AI servers become more popularized. The industry believes that the first wave of growth may occur in 2025.
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11...
Unisoc, a leading Chinese chip design company, has secured CNY4 billion (US$548 million) in equity financing, primarily through state-backed platforms including Pudong Venture Capital,...
Vietnam has unveiled its semiconductor roadmap for 2025-2050, aiming to establish three fabs, 20 integrated circuit (IC) backend houses, and 300 IC design houses as part of its goal...
India's approval of one wafer fab and four integrated circuit (IC) backend projects has prompted semiconductor equipment providers from the US and Japan to expand their operations...
Reportedly, Samsung Electronics (Samsung) is investing in equipment for the GaN foundry market. South Korea-based reports say that Samsung's import scale is smaller this time, presumably...
ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing.
Following the recent revelation that IBM had closed the intranet access for employees in its Chinese research and development and testing departments, on the morning of August 26,...
