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Friday 4 September 2026
Nvidia buys the front door to open AI with a US$12.93 billion Hugging Face deal
Nvidia's agreement to acquire Hugging Face for US$12.93 billion pushes the world's dominant AI chip supplier past silicon and into the layer where developers actually pick their models...
Friday 4 September 2026
China's GPU makers found scale as profit came from elsewhere
China's domestic GPU industry crossed a commercial threshold in the first half of 2026, but the interim filings of its six listed players show that revenue growth and earnings power...
Friday 4 September 2026
Young Liu urges 'Made with Taiwan' supply chain rethink

Foxconn chairman Young Liu on September 2 called on Taiwan's supply chain to shift from "Made in Taiwan" to "Made with Taiwan," saying...

Thursday 3 September 2026
Infineon sees AI data centers, physical AI as growth drivers
Infineon said the rapid buildout of AI data centers and emerging Physical AI applications could reshape semiconductor demand worldwide. The shift signals higher infrastructure spending,...
Thursday 3 September 2026
Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
Thursday 3 September 2026
Taiwan's supply chain is 'one of a kind,' MediaTek CEO says
MediaTek CEO Rick Tsai said Taiwan's supply-chain capabilities are unmatched as the technology industry moves into the AI and robotics era, while joking that the chip designer will...
Thursday 3 September 2026
Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
Thursday 3 September 2026
UniVista expands China EDA stack with AI agents, native 3DIC tools
Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic...
Thursday 3 September 2026
Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028
Broadcom used its third-quarter fiscal 2026 earnings call on September 2 to convert a quarter-by-quarter AI story into a dated, customer-by-customer deployment schedule running into...
Thursday 3 September 2026
Broadcom's custom AI silicon takes over the income statement as revenue climbs 86%
Broadcom's third quarter, ended August 2, 2026, is the point at which custom AI silicon stopped being an adjacent product line and became the shape of the company. Revenue reached...
Thursday 3 September 2026
SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing
The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON...
Thursday 3 September 2026
Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.
Wednesday 2 September 2026
Taiwan's semiconductor ecosystem has the UK taking notes
The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry...
Wednesday 2 September 2026
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
Wednesday 2 September 2026
Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership
Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...