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Monday 29 April 2019
TSMC expands OIP cloud alliance
TSMC has announced the expansion of its open innovation platform (OIP) cloud alliance, with Mentor Graphics joining inaugural members Amazon Web Services (AWS), Cadence, Microsoft...
Tuesday 16 April 2019
Samsung announces 5nm EUV development
Samsung Electronics has announced that its 5nm FinFET process technology is complete in its development and is ready for customers' samples.
Tuesday 16 April 2019
Google actively expanding cloud service deployments in APAC
Google is gearing up expansion of its cloud service infrastructure constructions in Asia- Pacific to build a more extensive cloud ecosystem in the area, but the web giant has no plan...
Monday 15 April 2019
Shennan Circuits posts strong 1Q19 results on 5G PCB shipments
China-based PCB maker Shennan Circuits has reported revenues of CNY2.163 billion (US$322.49 million) and net earnings of CNY187 million) for the first quarter of 2019, shooting up...
Monday 8 April 2019
TSMC and OIP ecosystem partners deliver complete design infrastructure for 5nm process
TSMC has announced delivery of the complete version of its 5nm design infrastructure within the Open Innovation Platform (OIP). This full release enables 5nm systems-on-chip (SoC)...
Monday 8 April 2019
PCB makers lack new growth momentum in transition to 5G
Taiwan PCB makers lack new growth momentum to spur demand during the transition to the 5G era, according to industry sources.
Friday 29 March 2019
GaAs foundry Win Semi expects pick-up in capacity utilization
GaAs foundry Win Semiconductors expects to see its capacity utilization rate recover starting the second quarter, thanks to a ramp-up of orders for new smartphones rolled out by Asia-based...
Monday 18 March 2019
Iteq posts over 40% profit increase in 2018
Copper-clad laminate (CCL) firm Iteq has reported net profits surged 42.6% to NT$1.78 billion (US$57.6 million) in 2018, when consolidated revenues increased 5.6% on year to NT$22.4...
Friday 8 March 2019
IDMs revving up production of GaN, SiC devices for 5G applications
High-performance RF components and power devices made of third-generation compound semiconductor materials with wide band-gap, such as GaN and SiC, are expected to be increasingly...
Thursday 7 March 2019
Palo Alto expects cloud, 5G to boost network security business
Palo Alto Networks, a specialist in gateway security, expects the rapid development of cloud computing and 5G technologies to drive up demand for network security solutions, thus...
Wednesday 6 March 2019
Win Semi lands orders for satellite communications components
Taiwan's leading compound semiconductor foundry Win Semiconductors has reportedly tapped into the satellite communications supply chains of US aerospace firms by providing mmWave...
Tuesday 5 March 2019
China PCB maker Shennan lands orders for 5G applications
China PCB maker Shennan Circuits Company has reportedly landed orders from network equipment vendors such as ZTE and Ericsson for 5G base station applications, indicating its efforts...
Monday 25 February 2019
Quanta shipping 5G x86 servers to new Japan telecom operator
Taiwan DOM Quanta Computer has reportedly kicked off shipments of servers adopting Intel x86 processors to Japan's new telecom operator Rakuten Mobile Network (RMN), marking a successful...
Friday 15 February 2019
Win Semi looks to 3D sensing, 5G for growth
GaAs IC foundry Win Semiconductors expects robust demand for 3D sensing and 5G related applications to drive its mid- and long-term business growth.
Monday 11 February 2019
Smart cities without infrastructure
A large proportion of the cost, disruption, pollution and exposure to natural disasters in a city would be eliminated if there were no infrastructure. Imagine no sewage or gas pipes,...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research