Linde LienHwa, a joint venture between the Germany-based Linde Group and Taiwan-based LienHwa Industrial, is a manufacturer of bulk and electronic specialty gases used during the...
With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Gigabyte Technology is expected to see its motherboard shipments fall under 13 million units in 2017 from 16-17 million units in 2016, and could struggle to maintain the 10 million...
Acer has recently formed a partnership with a virtual reality (VR) theme park in Dubai, the UAE with the construction to be completed by the end of 2017 or in early 2018, according...
EPD (electrophoretic display) e-paper startup Linfiny, a joint venture between E Ink Holdings (EIH) and Sony Semiconductor Solutions, will officially kick off its operations in the...
Compal Electronics has started to relocate its executives at LCFC (Hefei) Electronics Technology - the notebook manufacturing joint venture between the ODM and Lenovo - back to the...
Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...
Toshiba has been ordered by a US court to resume Western Digital's access to certain Toshiba's databases, but this order will not affect the operations of its memory chip unit - Toshiba...
Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
Contract chipmaker Powerchip Technology has announced net profits increased 17.6% on year to NT$3.63 billion (US$119.7 million) in the first half of 2017. EPS for the six-month period...
Backend house ChipMOS Technologies will enter production for 3D sensing components for new consumer electronics devices in the third quarter of 2017, according to a report by Taiwan's...
Pure-play compound semiconductor wafer foundry Global Communication Semiconductors (GCS) has expressed optimism about gallium arsenide (GaAs) demand for vertical cavity surface-emitting...
ChipMOS Technologies has obtained backend orders for touch display driver ICs (TDDI) from Novatek Microelectronics, with shipments set to kick off in the fourth quarter of 2017, according...
ChipMOS Technologies (Shanghai), a joint venture between Taiwan-based ChipMOS and Tsinghua Unigroup, has obtained backend orders for NOR flash memory from Wuhan Xinxin Semiconductor...
