A new wave of price hikes for high-end IC substrates, ranging from 20-40%, has emerged following a recent fire damaging a plant of Taiwan's Unimicron Technology, with clients rushing...
IC substrate maker Kinsus Interconnect Technology is set to see its revenues peak for 2020 in the fourth quarter, buoyed by shipments for new iPhones, according to market sources.
A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
TSMC as a top-choice foundry partner for HPC (high performance computing) chips vendors will significantly benefit Taiwan suppliers of ABF substrates for processing such chips, according...
Pegatron and Kinsus Interconnect Technology have issued respective company filings with the Taiwan Stock Exchange (TWSE) saying they expect no material impact from a fire hitting...
Taiwan's PCB equipment makers including C Sun and Symtek Automation Asia are poised to embrace strong growth momentum as many PCB and IC substrate makers are keenly expanding capacities...
IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology have reported impressive revenue increases for the third quarter of 2020 on strong shipments of diverse substrate...
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are being discouraged from making further investments in China by the...
Taiwan's PCB makers are expected to embrace a strongest-ever fourth quarter in 2020 thanks partly to orders for the year's new handsets concentrating in the quarter and partly to...
Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...
SiP substrates adopted for processing core processors and peripheral components for new Apple Watch models reportedly will be all supplied by three Taiwanese makers, Unimicron Technology,...
IC substrate maker Kinsus Interconnect Technology expects to post a revenue increase of 5-10% sequentially in the third quarter, followed by another 5-10% growth in the fourth.
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
IC substrate maker Kinsus Interconnect Technology will build ABF substrate production lines at a plant it recently acquired from the bankrupt Chunghwa Picture Tubes (CPT) in Yangmei,...
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
