Most Taiwan-based IC substrate makers including Kinsus Interconnect Technology, Unimicron Technology and Nanya Printed Circuit Board (NPC), have reported sequential revenue gains...
IC substrate maker Kinsus Interconnect Technology is expected to see its revenues grow 10-15% sequentially in the second quarter of 2013, while fellow companies Unimicron Technology...
Consolidated revenues at Taiwan-based PCB manufacturer Unimicron Technology registered decreases of 16.5% sequentially and 10.7% on year in the first quarter of 2013.
Share prices of Kinsus Interconnect Technology rallied NT$3 (US$0.1) or 3.2% to close at NT$97.5 on the Taiwan Stock Exchange (TSE) on February 18, after the company reported record-high...
Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...
The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...
Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...
Kinsus Interconnect Technology, a Taiwan-based maker of IC substrates, is expected to see revenues for the third quarter of 2012 grow up to 5% sequentially from NT$4.493 billion (US$150...
IC substrate supplier Kinsus Interconnect Technology has announced NT$2.8 billion (US$94.9 million) in net profits and an EPS of NT$6.28 for 2011. The firm's board of directors decided...
Taiwan-based IC substrate maker Kinsus Interconnect Technology reported 2011 total revenues of NT$16.871 billion (US$563 million), up 15.05% on year. Kinsus' fourth-quarter 2011 revenues...
Qualcomm, MediaTek, Nvidia and Spreadtrum Communications have all increased their wafer starts at Taiwan Semiconductor Manufacturing Company (TSMC) to meet anticipated demand for...
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...
Qualcomm has secured orders for baseband chips from Nokia and Samsung Electronics for their upcoming Windows Phone (Mango)-based smartphones with shipments kicking off in September,...
IC substrate maker Kinsus Interconnect Technology has announced revenues of NT$1.48 billion (US$50.95 million) for July, up 5.5% sequentially and 8.3% on year, according to a company...
