Marvell Technology has announced plans to establish a world-class design center in Ho Chi Minh City. The facility will house advanced semiconductor engineering and will be a top technology...
Boasting favorable government policies, lower overall labor costs, burgeoning local semiconductor actors such as Viettel, Vingroup, and FPT, Vietnam is garnering more than mere attention...
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Despite automotive chip customer pull-in momentum reportedly weakening, IDMs in the US and Europe are still highly optimistic about market prospects for the chip segment whose supply...
In a recent TrendForce ranking of global top ten IC design houses, one can see that semiconductor sectoral performances vary greatly, even though the industry in general is going...
With semiconductor inventory woes intensifying at supply chains, even TSMC cannot withstand the subsequent order-cutting storm, as many of its top-10 clients have cut more orders...
Broadcom and Texas Instruments (TI) are the latest IC vendors to follow in TSMC's footsteps and raise their chip quotes, despite growing concerns over demand volatility, according...
Qualcomm and Marvell have both notified their customers about price increases that may come into effect as early as August, joining a few chip suppliers including Intel and TSMC looking...
Taiwan's first-tier IC design houses Novatek Microelectronics and Realtek Semiconductor are seeking more capacity support from foundry partners TSMC and UMC to fulfill new orders...
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
After a record-high start in the first quarter of 2021, semiconductor merger and acquisition announcements cool off a bit without the "megadeals" seen in 2020, according to IC Insi...
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
