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    Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP
    12min ago
    Nvidia's Taiwan headquarters plan hits land hurdles, but government pledges support
    28min ago
    Commentary: China's myriad of challenges in advancing semiconductor packaging through TGV
    Oct 8, 18:18
    TGV: China's edge to capture AI HPC packaging
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    Lessons from China's involution for Taiwanese industries
    Oct 8, 18:18
    NEWS TAGGED ORDER CUTS
    Thursday 21 September 2023
    AI bubble? Speculation arises about Microsoft cutting AI chip orders
    Speculation has emerged that Microsoft has scaled down its orders for Nvidia's H100 AI chips, which some industry sources believe could help other companies get their hands on more...
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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