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NEWS TAGGED PACKAGING AND TESTING
Tuesday 12 March 2024
Backend houses upbeat about orders for memory chips
With memory chipmakers ready to scale up output, industry sources indicated that backend houses are optimistic about orders from the memory sector beginning in the second quarter...
Wednesday 6 March 2024
KYEC upbeat about AI, HPC chip demand
According to King Yuan Electronics (KYEC), the IC testing specialist is bullish about the AI and HPC chip market. The company anticipates an increase in testing volume in the second...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research