Japan's top-three semiconductor firms, Toshiba, Renesas Electronics, and Sony, saw on-year decreases in their fiscal 2012 (from April 2012 to March 2013) revenues, but profits impr...
Due to rising prices of NAND flash in the third quarter of 2012, Japan-based semiconductor firm Toshiba has reported fourth-quarter 2012 revenues of its semiconductor business unit...
Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...
As Intel started natively supporting USB 3.0 technology with its Ivy Bridge platform, third-party chipmakers including Renesas Electronics, ASMedia, Etron Technology and VIA Labs...
The high importance of GaN-on-Si technology for power conversion applications is by now evident, says Boris Petrov, managing director of the Petrov Group. It is driven by cost and...
Renesas Electronics is looking to shift its foundry orders for driver ICs used in Apple's iOS devices to Taiwan Semiconductor Manufacturing Company (TSMC), and will discontinue its...
Major Japan-based IDM companies including Renesas, Sony and Toshiba are set to increase outsourcing of backend processing for logic ICs, and have approached existing and potential...
Taiwan Semiconductor Manufacturing Company (TSMC) has no plans to take up Renesas Electronics' 12-inch fab in Tsuruoka, Yamagata prefecture, but will continue to maintain a close...
Japan-based chipmaker Renesas Electronics has unveiled measures to return to profitability, including plans to streamline its production facilities, and eliminate about 5,000 posit...
Renesas Electronics is mulling plans to sell or shutter 10 of its 19 wafer fabs in Japan, and shift its focus to more microcontroller (MCU) manufacturing, the Chinese-language Commercial...
Chipbond Technology reportedly has cut into the supply chain for Apple's iPhone 5 through providing backend services for the LCD driver ICs used in the upcoming iPhones with retina...
Renesas Electronics and TSMC on May 28 announced that they have signed an agreement to extend their microcontroller (MCU) technology collaboration to 40nm embedded flash (eFlash)...
Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...
Intel recently notified its partners about plans to postpone mass shipments of its upcoming Ivy Bridge processors. Despite that the company will still announce the new products and...
