IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) both have reported sequential revenue gains for July. Revenues of ASE's core IC ATM (assembly...

Advanced Semiconductor Engineering (ASE) is expected to see sales of its ATM (assembly test and material) division increase about 2% sequentially in the third quarter of 2011, according...

Siliconware Precision Industries (SPIL) projects its third-quarter revenues will grow 2-6% sequentially with both the consumer electronics and wireless communications sectors playing...

Judging from Intel's revenue outlook, market watchers expect Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) to see revenue growth of up to 5%...

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers...

IC packaging and testing house Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$5.1 billion (US$176 million) for June, up 5.1% on month. Consolidated...

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

The Japan disaster in March prompted IDM and fabless companies to overbook chips, but the inventory build-up has not been consumed due to a slow second quarter, according to Bough...

Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division grew 1.8% sequentially to NT$10.95 billion (US$382 million) in May...

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

Chip packaging and testing firms Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential drops of 2.5% and 5.1%, respectively, in...

Siliconware Precision Industries (SPIL) chairman Bough Lin on April 27 confirmed that the company has been facing stretched lead times for its IC substrates due to limited availability...

IC packaging and testing firms including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to provide a cautious outlook for the second...