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NEWS TAGGED SPIL
Thursday 9 February 2012
ASE, SPIL post sales drops in January
IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...
Thursday 12 January 2012
SPIL chairman sees chip market at bottom
The semiconductor market should hit bottom in the first quarter of 2012, and is expected to begin climbing out of the trough afterwards, according to Bough Lin, chairman for Siliconware...
Tuesday 10 January 2012
ChipMOS looks to higher capex in 2012
ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.
Tuesday 10 January 2012
ASE, SPIL, PTI, Sigurd see decrease in December revenues
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging...
Monday 9 January 2012
ASE, SPIL post slight drops in 4Q11 sales
Advanced Semiconductor Engineering (ASE) has announced that revenues of its core IC assembly test and material (ATM) business slid 2.1% sequentially in the fourth quarter of 2011,...
Friday 30 December 2011
SPIL steps into LED packaging
Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, has stepped into high-end packaging of multiple LED chips, according to company vice...
Friday 23 December 2011
Backend firms gearing up for new MediaTek solution
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and substrate makers Unimicron Technology and Kinsus Interconnect Technology are...
Wednesday 7 December 2011
ASE revenues down 5% in November
Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 billion (US$356 million) in November 2011, down...
Tuesday 6 December 2011
SPIL posts slight drop in November revenues
IC assembly and test service provider Silicon Precision Industries (SPIL) has announced consolidated revenues of NT$5.26 billion (US$174 million) for November 2011, down 1.7% on month...
Tuesday 29 November 2011
Copper pillar bump penetration of FC packaging to rise
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
Tuesday 8 November 2011
October revenues up slightly for IC packaging firms
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging/testing...
Thursday 27 October 2011
SPIL sees 4-8% decline in 4Q11 revenues on lower utilization
Semiconductor packaging and testing company Silicon Precision Industries (SPIL) has forecast revenues will decrease 4-8% sequentially in the fourth quarter of 2011, citing slowing...
Friday 21 October 2011
Packaging and testing firms see flat growth in 4Q11
The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues to feel the effects of the economic downturn,...
Tuesday 11 October 2011
SPIL outperforms fellow backend firms in 3Q11
Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...
Thursday 8 September 2011
SEMICON Taiwan 2011: Companies announce job openings
A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...