Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported slight decreases in consolidated revenues for April 2012. ASE announced consolidated...

Siliconware Precision Industries (SPIL), the world's third largest IC packaging and testing services provider, expects to post sales growth of 7-11% sequentially in the second quarter...

LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...

Consolidated revenues at Advanced Semiconductor Engineering (ASE) registered declines of 7.1% sequentially and 6.3% on year in the first quarter of 2012. Sales of its core IC assembly...

Consolidated revenues at Siliconware Precision Industries (SPIL) grew 18% on month to NT$5.54 billion (US$188 million) in March 2012 bringing its year-to-date sales to NT$14.08 billion...

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...

While the recent news that Taiwan Semiconductor Manufacturing Company (TSMC) is mulling an upward revision in 2012 capex has boosted market observers' confidence in the outlook for...

Advanced Semiconductor Engineering (ASE) saw sales of its core IC ATM (assembly test and material) business grow 3.9% on month to NT$9.49 billion (US$320 million) in February 2012...

Mobile phone makers Samsung and HTC both target 4G phone shipments in March to exceed one million units. Shipments in second-quarter 2012 are likely to reach 5-10 million units. Suppliers...

The global semiconductor market is expected to stage a quick recovery after hitting bottom in the first quarter of 2012, Silicon Precision Industries (SPIL) chairman Bough Lin said...

IC packager Silicon Precision Industries (SPIL) has reported NT$1.17 billion (US$39.7 million) in net profits for the fourth quarter of 2011, up 5.2% from a year earlier, with revenues...

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...

The semiconductor market should hit bottom in the first quarter of 2012, and is expected to begin climbing out of the trough afterwards, according to Bough Lin, chairman for Siliconware...

ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging...