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NEWS TAGGED SPIL
Monday 3 September 2012
Taiwan copper wirebonding production value to rise
The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.
Wednesday 8 August 2012
ASE, SPIL see small growth in July revenues
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), two Taiwan-based providers of IC packaging and testing service, saw consolidated revenues of...
Monday 6 August 2012
Major IC packagers step up 2012 capex
Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...
Tuesday 31 July 2012
ASE, SPIL make progress in transition to copper wire bonding
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...
Monday 30 July 2012
ASE, SPIL expect 3Q12 sales to rise
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both expect their third-quarter sales to register another sequential growth buoyed by rising demand...
Friday 27 July 2012
ASE, SPIL 2Q12 profits up
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their second-quarter net profits rise over 50% sequentially along with higher...
Tuesday 10 July 2012
ASE, SPIL post sales drops in June
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported decreases in June consolidated revenues from the previous month of 1.7% and 5.9%,...
Wednesday 4 July 2012
Most backend firms give positive 3Q12 outlook
With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.
Monday 2 July 2012
SPIL invests in Singapore-based MCT
Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging and testing services, will invest US$20.50 million for a 42.27% stake in Microcircuit Technology Pte...
Thursday 21 June 2012
ASE, SPIL gearing up for capacity expansion
IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both reiterated their commitment to expand capacity in 2012...
Wednesday 20 June 2012
SPIL steps up capacity expansion
IC packager Siliconware Precision Industries (SPIL) is stepping up capacity expansion efforts in 2012 with planned capital expenditure of a record NT$17.5 billion, chairman Bough...
Monday 11 June 2012
Major Taiwan IC backend firms to post over 5% sales growth in 2Q12
Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...
Thursday 7 June 2012
ASE, SPIL post sales growth in May
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their May revenues register single-digit growth.
Monday 4 June 2012
IC packagers reiterate sales guidance for 2Q12, says report
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reiterated their previous guidances for the second quarter of 2012, according to a Chinese-language...
Monday 28 May 2012
SPIL to expand packaging, testing capacity at China subsidiary
Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, will add investment of US$100 million in Siliconware Technology (Suzhou) to expand...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research