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NEWS TAGGED SPIL
Wednesday 28 July 2010
SPIL 2Q10 earnings below expectation
Chip packaging and testing company Siliconware Precision Industries (SPIL) saw second-quarter consolidated revenues grow by only 4.5% sequentially, missing market watchers' estimates...
Thursday 15 July 2010
IC packaging and testing houses turn conservative over 3Q10 outlook
Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...
Wednesday 7 July 2010
ASE posts monthly sales record in June
Chip packager Advanced Semiconductor Engineering (ASE) posted consolidated revenues of NT$16.26 billion (US$504.65 million) in June 2010, up 4.9% sequentially and hitting a new monthly...
Monday 5 July 2010
ASE, SPIL to feel constrained by capacity crunch
Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) are likely to see constraints in fab capacity limit their abilities to support strong revenue growth...
Friday 25 June 2010
SPIL approves NT$21 billion for 2010 capex
The board of directors of Siliconware Precision Industries (SPIL) has approved plans to budget NT$21 billion (US$652 million) in capex for 2010, according to a company filing with...
Tuesday 22 June 2010
SPIL declines to comment on reported order for AMD CPUs
Chip packaging and testing service provider Siliconware Precision Industries (SPIL) has declined to comment on reports that it has received a large order from AMD for CPUs, according...
Thursday 17 June 2010
SPIL to raise 2010 capex budget for copper wire bonding equipment procurement
Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...
Tuesday 8 June 2010
ASE, SPIL May revenues up on month
Chip packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) saw their consolidated revenues for May 2010 grow 5.7% and 2.9%...
Wednesday 19 May 2010
Chip packagers reportedly to raise quotes on gold costs
Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...
Tuesday 18 May 2010
Backend supplier UTAC says sales of copper wirebonding process growing
United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
Thursday 13 May 2010
AMD said to use bulk 40nm at TSMC for Fusion chips
AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology,...
Monday 10 May 2010
ASE, SPIL see sequential revenue drops in April
Chip packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced consolidated revenues for April 2010 totaled NT$14.66 billion (US$465.6 million), down 7.5%...
Friday 30 April 2010
ASE 1Q10 earnings beat market expectations
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...
Thursday 29 April 2010
SPIL posts weaker-than-expected 1Q10 results
Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...
Monday 26 April 2010
Market watchers upbeat on TSMC, UMC 2Q10
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to guide for mid to high single-digit revenue growth sequentially in the...
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