Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) is likely to see revenues slip by less than 5% on month in November 2009, while Siliconware Precision Industries...
Chip packaging and testing house Siliconware Precision Industries (SPIL) has announced it will spend NT$1.78 billion (US$54.94 million) buying a factory with production equipment...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...
Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...
Market watchers have revised upward their revenue growth estimates for Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and expect the IC packaging...
Siliconware Precision Industries (SPIL) is expected to announce an upward revision of its projected capex for 2009 at its upcoming investors conference, according to industry sources...
IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw revenues for September 2009 grow on year, ending a streak...
Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...
MediaTek plans to leap to 45nm processing for 3G chips in the first quarter of 2010 despite that volume production of 65nm WCDMA chips is scheduled to begin in the fourth quarter...
Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$8.35 billion (US$254 million) for August, with the on-year decline narrowing to negative 4.9%. Rival...
