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NEWS TAGGED SPIL
Friday 26 June 2009
SPIL to merge with wholly-owned investment subsidiary
Siliconware Precision Industries (SPIL) plans to merge with its 100%-owned subsidiary, Siliconware Investment Company, in order to simplify the group's structure and reduce its management...
Friday 12 June 2009
Driver IC testing, COF prices raised by 10-30%
IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...
Friday 12 June 2009
SPIL interested in Taiwan Memory investment
IC backend supplier Siliconware Precision Industries (SPIL) has expressed interest in investing in the government-led Taiwan Memory Company (TMC) project, which is seeking investment...
Thursday 11 June 2009
ASE and SPIL implementing capex plans for 2009
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have started implementing their capex plans for 2009, with each placing orders for 200 wire bonders...
Tuesday 9 June 2009
ASE, SPIL sales up 15% sequentially in May
Taiwan's major IC packaging and testing houses, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), have announced revenues for May 2009 increased...
Tuesday 2 June 2009
ASE, SPIL optimistic about 3Q09
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...
Thursday 7 May 2009
ASE and SPIL sales recovery continue in April
Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) saw sales continue improving in April, with narrower revenue drops...
Thursday 30 April 2009
ASE posts second straight quarterly loss, whereas SPIL swings to profit
Advanced Semiconductor Engineering (ASE) have announced its net loss for the first quarter of 2009 expanded to NT$1.57 billion (US$46.9 million), whereas Siliconware Precision Industries...
Monday 27 April 2009
ASE and SPIL 2Q09 revenues to grow over 30%
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely enjoy revenue growth of more than 30% sequentially in the second quarter of 2009,...
Thursday 23 April 2009
IC packaging firms ASE and SPIL gain shifted orders
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...
Monday 13 April 2009
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Wednesday 8 April 2009
ASE 1Q09 revenues beat guidance
Packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues of NT$5.5 billion (US$163 million) for March, up 28.2% on month. The company's first-quarter...
Monday 6 April 2009
Packaging firm SPIL revenues up 29% in March, likely to swing to profits in 1Q09
Siliconware Precision Industries (SPIL) has announced revenues of NT$3.87 billion (US$117 million) for March, an increase of 28.9% on month. However, its accumulated sales for the...
Friday 27 March 2009
ASE 1Q revenue drop expected to narrow from original forecast
With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...
Wednesday 25 March 2009
ASE, SPIL 2Q utilization to rebound
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) may see their packaging and testing utilization rates climb to 60% in the second quarter of 2009,...
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