Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...
ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...
Major Taiwan-based foundries and backend suppliers, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), Advanced Semiconductor...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues for February 2010 grew 1.1% sequentially to NT$4.67 billion (US$147 million). Meanwhile,...
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...
United Microelectronics Corporation (UMC) has teamed up with Integrated Technology Express (ITE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) to jointly...
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see revenues drop less than 5% sequentially in...
Spansion intends to enhance cooperation with its Taiwan-based partners such as Powertech Technology (PTI) and Siliconware Precision Industries (SPIL) in 2010, according to John Nation,...
Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...
The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...
