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Wednesday 23 January 2013
Samsung reportedly replaces management team in Brazil market
Korea-based Samsung Electronics has reportedly replaced its management team in Brazil despite the team's efforts helping Samsung to become the largest vendor in the country, defeating...
Thursday 17 January 2013
MStar Semiconductor and Flingo Samba TV platform team up to provide smart TV solution
Smart TV app publisher Flingo has announced that Samba, its new interactive TV platform, will be integrated into MStar Semiconductor Smart TV solution to synchronize TV, tablet, phone...
Tuesday 20 November 2012
UMC restructures executive team
Foundry chipmaker United Microelectronics has announced the appointment of Po-Wen Yen to the position of CEO, effective immediately. Former CEO Shih-Wei Sun has been promoted to company...
Friday 7 September 2012
UMC, STMicro team up to develop BSI process for image sensors
United Microelectronics (UMC) has teamed up with STMicroelectronics to develop 65nm CMOS image sensor technology using backside illumination (BSI).
Thursday 30 August 2012
ALi, Panasonic team up for DVB-T2 chipset
ALi, a provider of set-top box (STB) system-on-chip (SoC) solutions, has announced that the company has teamed up with Panasonic's semiconductor business group to begin mass production...
Friday 17 August 2012
BOE eyes team up with Formosa Epitaxy, Unity Opto to set up LED epitaxial wafer plant
China-based LED firms have been producing low-priced LED chips causing oversupply in the upstream LED chip segment to continue. China-based panel maker BOE recently announced plans...
Thursday 2 August 2012
Foxconn refutes rumors about entering Taiwan cable TV channel market
Foxconn Electronics (Hon Hai Precision Industry), commenting on a recent rumor that the company is preparing to enter Taiwan's cable TV channel market, has said it is aiming to work...
Wednesday 1 August 2012
Fujitsu, DoCoMo and NEC team up for communications IC
Fujitsu has announced that the company has reached an agreement with NTT DoCoMo and NEC to form a joint venture, which will focus on the development and sales of semiconductors used...
Tuesday 24 July 2012
ARM, TSMC team up to deliver ARM cores on FinFET transistors
TSMC and ARM have announced a multi-year agreement extending their collaboration beyond 20nm technology to deliver ARM processors on FinFET transistors, enabling the fabless industry...
Monday 2 July 2012
UMC signs license deal with IBM to develop 20nm chips
United Microelectronics (UMC) announced recently that the company has signed a license agreement with IBM to expedite the development of its 20nm CMOS process with FinFET 3D transi...
Tuesday 26 June 2012
ECS passes 2011 finance report with growth of more than 7%
Elitegroup Computer Systems (ECS) hosted a shareholder meeting on June 25, passing its finance report for 2011 with consolidated revenues reaching NT$72.7 billion (US$2.43 billion),...
Friday 15 June 2012
Taiwan market: Yahoo! Kimo expanding marketing team for keyword search advertising
Yahoo! Kimo (Yahoo! Taiwan) has expanded its agent workforce for marketing its online keyword search advertising service in the Taiwan market to 38 sales partners and about 300 sales...
Thursday 7 June 2012
TI and Clientron team up to develop the DM8148 applications processor-based Thin Client Reference Design
Clientron Corp., a world-leading supplier of thin client and embedded systems, in collaboration with Texas Instruments Incorporated (TI), debuts it first TI SoC (System-on-Chip) based...
Wednesday 6 June 2012
Singapore IME, UMC team up to develop TSV for BSI sensors
Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...
Tuesday 3 April 2012
Spansion, SK Hynix team up for SLC NAND
Spansion has announced an alliance with SK Hynix to introduce SLC NAND products at the 4x, 3x, and 2x nodes. As part of the relationship, the pair will enter into a patent cross-licensing...