The European Commission, which in late May 2015 decided to launch an anti-circumvention investigation of Taiwan- and Malaysia-based solar cell and PV module makers as well as China-based...
Touch panel maker TPK Holding has reportedly recruited an LCM (LCD module) team from fellow maker Wintek in an attempt to extend product development and production to LCM assembly,...
Toshiba has announced the development of a flash memory embedded process based on 65nm logic process and a single-poly non-volatile memory (NVM) process based on 130nm logic and analog...
United Microelectronics (UMC) has announced that it is collaborating with ARM to tape out a process qualification vehicle (PQV) test chip on the foundry's 14nm FinFET technology to...
Taiwan-based InnoDisk, which develops and manufactures industrial-class storage products, has disclosed the company is partnering with NAND flash chip vendor Toshiba and Super Micro...
Qualcomm has followed in the footsteps of Intel, teaming up with China-based IC design houses to promote its entry-level and cost-effective platforms in the China market.
As one of the top vendors in the desktop motherboard industry, Gigabyte Technology has grown its business to reach shipments of around 20 million motherboards per year, most of which...
Advanced Semiconductor Engineering (ASE) and TDK have announced that the companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates...
Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...
Globalfoundries has announced a partnership with IMEC for joint research on future radio architectures and designs for highly-integrated mobile devices and IoT applications.
SK Hynix and Toshiba have announced they have struck a deal to jointly develop nanoimprint lithography (NIL), a candidate for the next-generation lithography technology.
A Taiwan team has announced SEMI-recognized international standards of performance measurement for dye-sensitized solar cells and organic solar cells, coded SEMI PV57-1214.
Enterprise software and service provider SAP is looking to sign a number of strategic alliance agreements with Taiwan-based cloud data centers in 2005, driven by growing demand for...
Micron Technology has partnered with Winbond Electronics to jointly develop serial NOR flash memory for automotive and Internet of Things (IoT) applications, according to the US memory...
