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Tuesday 25 November 2014
Soitec, SK Innovation team up for semiconductor materials
France-based Soitec and SK Innovation of Korea have signed an agreement to establish an alliance focused on accelerating innovation in the area of semiconductor materials for information...
Tuesday 11 November 2014
Indium Corporation expands Malaysia technical support, adds team members
Indium Corporation celebrated the grand opening of its newest tech hub and the expansion of its technical support team in Penang, Malaysia, with customers and officials on Monday,...
Monday 1 September 2014
Eon reportedly to team up with China Sigma to develop NAND flash chips
Taiwan-based flash chip supplier Eon Silicon Solution reportedly will team up with China Sigma to form a NAND flash joint venture in China, according to industry sources.
Tuesday 1 July 2014
Samsung/Globalfoundries team reportedly lands 14nm orders from Qualcomm, Apple
The Samsung Electronics and Globalfoundries team reportedly has landed orders for its 14nm FinFET process from Qualcomm and Apple, with related foundry services to begin in early...
Tuesday 3 June 2014
HABOOK launches a new concept of TEAM Model Smarter Classroom 2.0 in 2014 Computex
2014 COMPUTEX Taipei, i.e., Taipei International Information Technology Show, Asia's largest and the world's second largest B2B professional computer expo, will take place in Taipei...
Tuesday 27 May 2014
Notebook brand vendors to start RFQ in June; ODMs may see order reshuffling
Notebook brand vendors will start their request for quotation (RFQ) processes for notebook orders for 2015 in June and ODMs are already preparing for the event, according to sources...
Thursday 3 April 2014
NXP strengthens China team with appointment of Li Zheng as SVP Sales & Marketing, Greater China and Country Manager, China
NXP Semiconductors N.V. announced the appointment of Li Zheng as Senior Vice President Sales & Marketing, Greater China and Country Manager for China. Zheng, who will be based...
Thursday 27 February 2014
Toshiba, Canon team up for 15nm NAND flash, says report
Toshiba, the world's second-largest maker of NAND flash memory behind Samsung Electronics, will work with fab-tool maker Canon to develop 15nm NAND chips with volume production slated...
Wednesday 4 December 2013
Movea, Nuvoton team up to deliver motion-enabled embedded controllers for Windows 8.1 and Android devices
Nuvoton Technology, a specialist in embedded controllers for the PC market, has incorporated Movea's SmartMotion technology into its NPCF204U stand-alone sensor hub family and the...
Monday 18 November 2013
Qualcomm reportedly hopes Samsung and Globalfoundries can team up, sources say
Qualcomm reportedly hopes Samsung Electronics and Globalfoundries can form an alliance, as the fabless IC vendor seeks to reduce its reliance on Taiwan Semiconductor Manufacturing...
Wednesday 13 November 2013
Globalfoundries, Samsung said to team up to vie for Apple chip orders
Rumors have been circulated in the IC industry claiming that Globalfoundries and Samsung Electronics will team up to vie for A9-series chip orders from Apple. Under the reported tie-up,...
Tuesday 12 November 2013
Dialog, Richtek team up for power management ICs
Taiwan-based Richtek Technology has signed a cooperation agreement with Dialog Semiconductor for the development of power management ICs targeting the tablet and smartphone chipset...
Thursday 7 November 2013
ASE, Infineon team up for assembly of auto products
Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...
Tuesday 5 November 2013
Alchip, KnCMiner team up for Bitcoin mining machine with 28nm ASIC
KnCMiner, a provider of Bitcoin mining devices, and fabless ASIC company Alchip Technologies, have announced the availability of what the companies claim is the world's first 28nm...
Wednesday 4 September 2013
Imagination, MediaTek team up for heterogeneous multi-processing SoCs
Imagination Technologies has recognized MediaTek for its deployment of heterogeneous processing. The new MediaTek MT8135 chip is a mobile SoC enabling heterogeneous multi-processing...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research