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Wednesday 10 January 2018
Intel, Tsinghua Unigroup may team up to develop China NAND flash market
Intel is expected to enhance its presence in China's NAND flash market, with plans to ramp up the capacity of its 12-inch fab in Dalian and possibly to license its technology to Tsinghua...
Wednesday 13 December 2017
Lite-On, Tsinghua Unigroup team up to tap China storage market
Taiwan-based Lite-On Technology will team up with China's Tsinghua Unigroup to jointly develop the China market for storage products such as solid state drives (SSD), with the latter...
Monday 11 December 2017
Quanta Cloud to team up with Intel, RedHat to develop 5G cloud solutions
Quanta Cloud Technology (QCT), a datacenter solution subsidiary of Quanta Computer, will team up with Intel and RedHat to set up a telecom solution laboratory in the Silicon Valley...
Thursday 16 November 2017
Globalfoundries, Fudan to deliver next generation dual interface smart card
Globalfoundries (GF) and Fudan Microelectronics Group have announced they have produced a next generation dual interface CPU card, using GF's 55nm low power extended (55LPx) technology...
Friday 3 November 2017
Gowin, TSMC team up for 28nm FPGA chips
China-based Gowin Semiconductor has announced the development of its first 28nm FPGA product, the GW3AT-100, fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).
Thursday 21 September 2017
Google buys part of HTC smartphone team for US$1.1 billion
Google and HTC have announced a definitive agreement under which certain HTC employees - many of whom are already working with Google to develop Pixel smartphones - will join Google...
Tuesday 19 September 2017
SMIC, Brite and Synopsys team up for IoT platform
Semiconductor Manufacturing International (SMIC), Brite Semiconductor and Synopsys have teamed up to develop a platform that enables designers, system integrators and OEMs to accelerate...
Friday 8 September 2017
Ambiq Micro, TSMC team up to develop Huawei fitness wearables
Ambiq Micro announced recently that Huawei has selected the Apollo2 platform, built on TSMC's 40nm Near-Vt technology platform, to power its new line of lightweight fitness wearables...
Wednesday 2 August 2017
Qualcomm, Win Semi reportedly to team up for 5G mobile infrastructure
Qualcomm has recently approached GaAs IC foundry Win Semiconductors to cooperate in an infrastructure project for 5G mobile networks, according to market sources.
Thursday 27 July 2017
Samsung forms e-sport team for Taiwan gaming market
Samsung Electronics has established a professional e-sport team, Samsung TTP Esports, to compete in Taiwan's e-sport market.
Tuesday 25 July 2017
Foxconn R&D team unveils smart food ordering system
The Foxconn Group's software development team Dudoo has released its new smart food ordering system for restaurants in Taiwan.
Wednesday 31 May 2017
Gigabyte strengthening high-end gaming brand recognition by uniting Aorus marketing under one team
The gaming market has gradually grown to become a new battlefield among IT vendors thanks to related products' rising demand and high profitability. Many vendors have created a new...
Friday 19 May 2017
Google to team up with Asustek to launch new AR smartphone
Google will team up with Asustek Computer to roll out its second-generation AR-enabled smartphone expecting to launch the new phone in the third quarter of 2017 at the earliest, according...
Monday 27 March 2017
ALi, Alticast team up for pay TV
ALi, a Taiwan-based developer of set-top box chipsets, and Korea-based Alticast, which provides software used by the global pay-TV industry, have announced they will work together...
Monday 27 March 2017
Asustek plans to spin off AR development team, says paper
Asustek Computer plans to spin off its AR/VR development team to become an independent startup, according to a Chinese-language Commercial Times report.