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Friday 3 November 2017
Gowin, TSMC team up for 28nm FPGA chips
China-based Gowin Semiconductor has announced the development of its first 28nm FPGA product, the GW3AT-100, fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).
Thursday 21 September 2017
Google buys part of HTC smartphone team for US$1.1 billion
Google and HTC have announced a definitive agreement under which certain HTC employees - many of whom are already working with Google to develop Pixel smartphones - will join Google...
Tuesday 19 September 2017
SMIC, Brite and Synopsys team up for IoT platform
Semiconductor Manufacturing International (SMIC), Brite Semiconductor and Synopsys have teamed up to develop a platform that enables designers, system integrators and OEMs to accelerate...
Friday 8 September 2017
Ambiq Micro, TSMC team up to develop Huawei fitness wearables
Ambiq Micro announced recently that Huawei has selected the Apollo2 platform, built on TSMC's 40nm Near-Vt technology platform, to power its new line of lightweight fitness wearables...
Wednesday 2 August 2017
Qualcomm, Win Semi reportedly to team up for 5G mobile infrastructure
Qualcomm has recently approached GaAs IC foundry Win Semiconductors to cooperate in an infrastructure project for 5G mobile networks, according to market sources.
Thursday 27 July 2017
Samsung forms e-sport team for Taiwan gaming market
Samsung Electronics has established a professional e-sport team, Samsung TTP Esports, to compete in Taiwan's e-sport market.
Tuesday 25 July 2017
Foxconn R&D team unveils smart food ordering system
The Foxconn Group's software development team Dudoo has released its new smart food ordering system for restaurants in Taiwan.
Wednesday 31 May 2017
Gigabyte strengthening high-end gaming brand recognition by uniting Aorus marketing under one team
The gaming market has gradually grown to become a new battlefield among IT vendors thanks to related products' rising demand and high profitability. Many vendors have created a new...
Friday 19 May 2017
Google to team up with Asustek to launch new AR smartphone
Google will team up with Asustek Computer to roll out its second-generation AR-enabled smartphone expecting to launch the new phone in the third quarter of 2017 at the earliest, according...
Monday 27 March 2017
ALi, Alticast team up for pay TV
ALi, a Taiwan-based developer of set-top box chipsets, and Korea-based Alticast, which provides software used by the global pay-TV industry, have announced they will work together...
Monday 27 March 2017
Asustek plans to spin off AR development team, says paper
Asustek Computer plans to spin off its AR/VR development team to become an independent startup, according to a Chinese-language Commercial Times report.
Friday 3 February 2017
MediaTek, Pixart team up for 3D gesture controller
MediaTek has teamed up with CMOS image sensor supplier Pixart Imaging to roll out 3D tracking and gesture controller solutions utilizing MediaTek's MT8665-series SoC chip and Pixart's...
Thursday 2 February 2017
Panasonic, UMC team up for 40nm ReRAM
Panasonic Semiconductor Solutions (PSCS) announced recently it had reached an agreement with pure-play foundry United Microelectronics (UMC) on the joint development of mass production...
Tuesday 13 December 2016
Seagate, SK Hynix said to team up for enterprise SSDs
Seagate and SK Hynix will form a joint venture dedicated to developing SSDs for enterprise servers and data centers, according to industry sources.
Wednesday 9 November 2016
Dialog Semiconductor, Energous team to accelerate wireless charging adoption
Dialog Semiconductor, a provider of highly-integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth low energy (LE) technology, has announced...