Driven by leading edge investment, global semiconductor equipment billings increased 38% year-over-year to US$26.8 billion in the third quarter of 2021, and an 8% rise from the prior...
ACM Research, a supplier of wafer cleaning technologies for advanced semiconductor devices, has had its Shanghai-based subsidiary start trading on the science and technology innovation...
TSMC's ecosystem partners, particularly equipment makers, are poised to embrace strong growth momentum, as the foundry will be expanding its fab capacities over the next three years,...
Foxconn (Hon Hai) Technology Group, through its NT$2.52 billion (US$90.67 million) acquisition of Macronix International's 6-inch wafer fab and equipment, will be able to meet a market...
Six-inch wafer fabs have become acquisition targets of automotive power semiconductor companies, as well as Foxconn Electronics (Hon Hai Precision Industry) and Tesla, both of which...
Tokyo Electron has announced the company will introduce its leading-edge Coater/Developer to the imec-ASML joint high NA EUV research laboratory (joint high NA lab) in Veldhoven,...
Japan-based semiconductor equipment vendor Tokyo Electron is reportedly eyeing the acquisition of a 6-inch wafer fab in Taiwan that has been put up on sale, while fellow companies...
Many international semiconductor equipment and materials suppliers have been stepping up investments or strengthening deployments in Taiwan seeking to better serve TSMC's ecosystem...
Mobile SoC specialist MediaTek has announced over NT$1 billion (US$35 million) worth of fab tools that the fabless chipmaker will spend for its chip production.
In addition to process technology which enhances the performance of semiconductor devices by scaling, 3D and heterogeneous integration has led to the development of various new structures...
China's homegrown semiconductor equipment makers are gearing up to develop diverse frontend and backend IC process equipment in line with the government efforts to boost self-sufficiency...
TSMC is firmly on track to move 5nm process technology to commercial production in the first half of 2020 and will kick off production of chips built using a newer 3nm process node...
TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...
The continuous process scaling and moving toward heterogeneous integration have enabled the vigorous innovation in the semiconductor industry in the post-Moore's Law era, which in...
The emergence and convergence of AI, IoT, cloud, and autonomous driving technologies have brought tremendous opportunities to the semiconductor industry. However, as the process technology...
