The best large-language models can already write like humans, especially if prompted properly. Photos and images can be faked at low cost. Yet-to-be-released href="https://openai.com/blog/navigating-the-challenges-and-opportunities-of-synthetic-voices"...
Ultium Cells, a battery joint venture between LG Energy Solution and General Motors, has started production at its second plant in Tennessee, the US. The first product has been delivered...
Foxconn (Hon Hai Technology Group) is on track to generate sequential and on-year revenue growth in the second quarter of 2024, according to the Taiwan-based contract electronics...
The landscape of Large Language Model (LLM) applications is still a blue-ocean market boasting wide-open opportunities, with OpenAI being just one of the players in the field, as...
In the past, it was the chip that created the user's needs, but when hardware has little room to expand for running Artificial Intelligence (AI) models while the difference between...
Neural Processing Units (NPU) are being introduced into all types of SoCs to improve the performance of AI applications in the new AI era, with leading SoC manufacturers and IDMs...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
Prices have dropped for nickel and lithium, key materials used in batteries for Electric Vehicles (EV), as growth in the EV market has slowed. Even as suppliers begin to reduce production,...
The rise of Artificial Intelligence (AI) has prompted Industrial PC (IPC) manufacturers to expedite the transformation and enhancement of their business models, with a keen focus...
After the 7.4 magnitude earthquake hit northeastern Taiwan, TSMC's speedy recovery to resume operation on the late evening of April 5 demonstrated the resilience and flexibility of...
Mega Networks, an Indian server solutions provider with almost 28 years of experience, is planning to bring out AI servers and enter the semiconductor packaging segment.
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