With liquid cooling solutions becoming hot ticket items of late, thermal solution manufacturer Auras Technology has stepped up the expansion of its facilities in Thailand, producing...
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
HiSilicon (Shanghai) Technologies showcased new chip and terminal device solutions for smart homes, displays, and the Internet of Things (IoT) at the recent Appliance & Electronics...
Taiwan-based ODMs and contract device manufacturers including Hon Hai Technology Group (Foxconn), Quanta Computer, and Wistron have high expectations for AI server sales this year.
Qualcomm has revealed the Snapdragon 8s Gen 3 mobile SoC for AI smartphones, which will be used by key OEMs such as Honor, iQOO, Realme, Redmi, and Xiaomi. The first handset is likely...
In a world riven by great-power conflict, economic decoupling, high inflation, and worries that the interests of capital are being put ahead of workers, an obvious enemy can emerge:...
Amidst the surging cost of AI GPUs and data center setups NAND controller manufacturer Phison Electronics has partnered with supply chain partners MediaTek and Gigabyte to introduce...
Huawei's automotive business unit will likely become profitable earlier than expected. Richard Yu, chairman of Huawei's Intelligent Automotive Solutions (IAS), said on March 16 that...
A Foxconn subsidiary is reportedly discussing investing in India, as an increasing number of smartphone suppliers are clustering in southern parts of the country.
South Korea-based Sebang Global Battery, which focuses on automotive and industrial lead-acid batteries, has grown its revenue and profits as it scales up the absorbent glass mat...
China-based EV makers have expanded overseas aggressively as demand slows down globally. However, automotive suppliers said the Chinese EV's momentum will likely end soon as its smart...
Rapidus is trying the revolutionary single-wafer processing procedure to significantly reduce cycle time for chipmaking on its way to mass-produce 2nm chips.
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