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IN THE NEWS
Wednesday 5 February 2020
Aifian develops AI-based credit information app
Fintech startup business Aifian in 2019 launched its AI Chia Chia, an artificial intellignece-based app functioning as a broker for personal credit information, and has partnered...
Wednesday 5 February 2020
MLCC, resistor lead time significantly extended on tight supply
The supply of MLCC and resistor chips is getting increasingly tight with delivery lead time stretching significantly, which may soon push up quotes as major makers including Yageo...
Thursday 30 January 2020
How Foxconn-FCA JV might work in EV market
Foxconn Technology Group's plans to team up with Fiat Chrysler Automobiles (FCA) for the EV industry, which, together with its deployments in digital healthcare and robotics, will...
Thursday 30 January 2020
Sales of semiconductors performing AI functions set to triple by 2025, says IHS
The global market for memory and processing semiconductors used in artificial intelligence (AI) applications will soar to US$128.9 billion in 2025, three times the US$42.8 billion...
Wednesday 22 January 2020
IC substrate market increasingly dominated by leading makers
Driven by 5G and AI applications, the IC substrate sector is experiencing the fastest wave of tech advancement in 20 years, raising the entry threshold for newcomers and boosting...
Wednesday 22 January 2020
Taiwan ICT players set to gain from new AR/VR, AIoT applications
The just-concluded CES 2020 has witnessed diverse new tech innovations and applications, such as wearable devices focusing more on diverse health monitoring, AR/VR gears incorporating...
Tuesday 21 January 2020
ITRI uses AI to train collaborative robots
Computational Intelligence Technology Center under government-sponsored Industrial Technology Research Institute (ITRI) has developed an AI-based deep learning solution for use in...
Tuesday 21 January 2020
Inventec expects 10% revenue expansion in 2020
Taiwan-based ODM Inventec expects each of its three major product lines to register about 10% revenue expansion in 2020 and a higher growth in 2021, with plans to simultaneously expand...
Monday 20 January 2020
Xilinx keen on developing AI-based FPGA chips for automotive use
US FPGA chips specialist Xilinx will step up development of self-adaptive AI chips for automotive applications based on the emerging concepts of Mobility as a Service (MaaS) and Transportation...
Monday 20 January 2020
Huawei revs up cloud, AI as core business
China's telecom equipment giant Huawei has newly upgraded its Cloud & AI business unit as its fourth business group (BG) parallel in status to carrier, enterprise and consumer...
Monday 20 January 2020
Yangtze Memory building memory ecosystem with partners
Yangtze Memory Technology (YMTC) is ramping up its chip output for applications requiring embedded storage and SSD solutions in 2020, and has built partnerships with companies including...
Friday 17 January 2020
Next-generation EV SiC power modules highlighted at Automotive World 2020
Next-generation automotive power modules from exhibitors including Japan's Rohm Semiconductor, Taiwan's government-funded Industrial Technology Research Institute (ITRI) and Lite-On...
Friday 17 January 2020
Compal expects non-notebook shipments to surge in 2020
Compal Electronics expects its notebook shipments to register only flat growth on year in 2020, but shipments of its non-notebook products such as wearables, smart home devices, automotive...
Friday 17 January 2020
Taiwan needs to step up EDA development, says MOST
Taiwan's Ministry of Science and Technology (MOST) is urging the local industry and academy to devote more efforts to R&D on electronic design automation (EDA) to fill Taiwan's...
Thursday 16 January 2020
TSMC showcases InFO_PoP packaging tech at Nepcon Japan 2020
Nepcon Japan 2020 running January 15-17 in Tokyo saw its first-day semiconductor forum steal the show with heavyweight firms TSMC and Micron shedding light on latest packaging technologies...