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Emerging tech, businesses news coverage
IN THE NEWS
Friday 4 August 2017
France, Canada, UK, Singapore governments pushing forward in AI R&D, says MOEA
The governments of France, Canada, the UK and Singapore have been making efforts to boost the R&D of AI technology and applications, according to overseas offices of the Ministry...
Monday 31 July 2017
Demand for high-speed transmissions surges
Emerging applications arising from IoT, cloud and artificial intelligence (AI) are demanding high-speed transmissions, while high-speed interfaces such as USB, PCI Express (PCIe)...
Wednesday 26 July 2017
Taiwan IC design service and IP firms land AI chip orders from China
Taiwan-based IC design service companies and silicon IP providers have started to land orders for artificial intelligence (AI) applications from China's IC industry and academia,...
Tuesday 25 July 2017
Taiwan to set up innovation service platform to integrate technology R&D forces
Taiwan's Ministry of Economic Affairs will spend NT$5 billion (US$170 million) in the next four years setting up an open innovation service platform (OISP) to facilitate cooperative...
Monday 24 July 2017
TSMC to expand CoWoS capacity to fill increasing AI chip packaging orders
Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill...
Monday 24 July 2017
China reveals AI development plans
China's State Council has revealed plans for development of AI technology and applications through 2030.
Friday 21 July 2017
Chip demand for data centers to boom in China
With China's local governments looking to set up data centers, chip demand for data centers locally is set to surge, according to industry sources.
Thursday 20 July 2017
Samsung increases production of 8GB HBM2
Samsung Electronics has increased the production volume of its 8GB high bandwidth memory-2 (HBM2) to meet growing market needs across a wide range of applications including AI, high-performance...
Wednesday 19 July 2017
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Tuesday 18 July 2017
Taiwan firms urged to develop integrated chips for AI systems
Taiwan should strive to become an exporter of AI (artificial intelligence) system products and to develop niche-type integrated smart system chips that could reach a production value...
Tuesday 18 July 2017
Macronix launches AEC-Q100 full compliant NAND flash memory
Macronix International has launched an AEC-Q100 Grade 2/3 compliant NAND flash memory product. The company added its NAND flash memory has passed all the stringent AEC-Q100 reliability...
Monday 17 July 2017
VIA announces Olami AI platform
VIA Technologies announced the start to beta testing for its Olami artificial intelligence (AI) platform on July 17. The platform is developed by VIA's AI team and features many cloud...
Monday 17 July 2017
Taiwan IT players to see opportunities from electric vehicle industry
Taiwan-based notebook component suppliers including chassis makers Catcher Technology, Waffer Technology and Ju Teng; cooling module makers Sunonwealth Electric Machine Industry and...
Friday 14 July 2017
Integration of robots, IoT, AI needed to maximize smart production synergy, says industry expert
Only through close integration of robots, Internet of Things (IoT) and artificial intelligence (AI) applications can the manufacturing sector manage to achieve maximum smart production...
Friday 14 July 2017
Compal reportedly to recruit ex-Inventec manager to lead server business
Compal Electronics reportedly has recruited an executive from Inventec to lead its server department and has also integrated its server team's resources, looking to land orders from...