Unitech Printed Circuit Board president Hsu Cheng-hung has stepped down to take responsibility of a fatal accident that occurred at its Yilan plant in June 2017, according to the Taiwan-based...

Synopsys has announced the successful tape-out of a broad portfolio of DesignWare Foundation and Interface PHY IP for TSMC's 7nm process technology, including logic libraries, embedded...

The supply of NAND flash memory is expected to remain tight through the end of 2017, according to Khein Seng Pua, chairman of flash device controller supplier Phison Electronics.

Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...

Edom Technology, which distributes products for chip vendors such as Nvidia and Skyworks, is expected to report over 20% revenue growth sequentially for the third quarter of 2017,...

In response to the growing global gaming market, Innolux will showcase a series of gaming notebook/monitor panels at the upcoming Taiwan Touch 2017 to be held at the Nangang Exhibition...

Semiconductor Manufacturing International (SMIC), Brite Semiconductor and Synopsys have teamed up to develop a platform that enables designers, system integrators and OEMs to accelerate...

China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2 billion...

Artificial intelligence (AI) processors will constitute a new opportunity for development in China, as AI applications are emerging rapidly to trigger a new round of demand in AI processors,...

The most critical key to achieving a breakthrough in the development of China's semiconductor industry rests with talent, instead of funds, markets or government policy support, according...

MediaTek is expected to complete development of its 5G prototype chip by the end of 2017, and is gearing up for trials of its 5G solutions in 2018, according to industry sources.

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

After scoring impressive achievements at the end of its first implementation year in early September 2017, the Taiwan government's Asia Silicon Valley Development Plan (ASVDP) is moving...

CEVA, a licensor of signal processing IP for smart connected devices, has announced that Nextchip, a fabless company specializing in embedded vision applications for ADAS systems,...

A number of new features that come along with Apple's newly released iPhone X such as 3D sensing are likely to become new standards for next-generation smartphones launched by Android-based...