Apple's recent bombshell of canceling its decade-long EV project, Titan, has sent shockwaves through the industry. However, amidst the fallout, a surge in acquisitions, research,...

In 2023, the worldwide semiconductor market faced challenging conditions. Amidst various uncertainties including geopolitics and the broader economy, DIGITIMES Research projects that...

Apple's bold move to scrap its decade-long car project in favor of a full-fledged pivot to AI development highlights the industry's evolving landscape. While Apple boasts numerous...

Periscope lenses are set to become the staple of high-end smartphones.

In a move highlighting the market's increasingly diversified demand for AI models, Microsoft recently announced its collaboration with Mistral AI, following in the footsteps of Google...

The Japan-based telecommunication company NTT Docomo and others are promoting the application of Open RAN technology in communication infrastructure, becoming one of the topics at...

At MWC 2024, the spotlight shines brightly on AI as the driving force behind innovation in the...

The development of next-generation communication technologies occurs approximately every 10 years. The international communication standards organization 3GPP has gradually initiated...

Micron Technology unveiled at MWC 2024 that the forthcoming flagship smartphones from Honor and Samsung will feature the company's Universal Flash Storage (UFS) 4.0 mobile flash storage...

Rumors persist that Apple is interested in investing in the development of the Apple Car. Recent speculations suggest that Project Titan, which has never been officially confirmed,...

Innovative Optical and Wireless Network (IOWN), an initiative for all-photonics communication infrastructure led by Japanese telecom company NTT, has gained the attention of Japan's...

As the 2024 Mobile World Congress (MWC) draws to a close, it is apparent that AI has dominated the show. Numerous generative AI applications were showcased, beyond the AI smartphones...

TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which...

The Taiwan Carbon Solution Exchange (TCX) is poised to unveil its second tranche of international carbon credits by March 2024, with keen interest surrounding offsets crucial...

Benefiting from the explosion of demand for AI and cloud applications, cloud server construction and the need for higher bandwidth transmission have accelerated the upgrading of high-speed...