China-based camera module maker Q Technology has reported strong results for first-half 2020 and is seeking to maintain its competitiveness by deepening its development for 3D ToF...

Amid decreasing demand for smartphones, especially high-end models, prices for high-end smartphone-use lens modules are expected to slip in third-quarter 2020, with price-cut competition...

Microsoft Taiwan COO Hedy Ho, at DevDay Asia 2020 Online, has announced the establishment of IoT Center of Excellence in Taiwan to provide an R&D field for 5G + AI + IoT and help...

Several Taiwan-based IC design houses and power semiconductor device suppliers have said their sales targets for 2020 remain unchanged despite recent reports indicating that Huawei...

Chinese smartphone brand Xiaomi will earmark CNY10 billion (US$1.444 billion) for R&D in 2020 focusing on developing AIoT devices, according to company chairman Lei Jun.

The mounting US trade sanctions are driving HiSilicon to the brink, and many engineers have left the Huawei IC design...

Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.

Chunghwa Telecom (CHT), ASE Technology Holding and Qualcomm Technologies will join forces to build Taiwan's first smart factory based on 5G mmWave designated enterprise networks in...

China-based Sunny Optical Technology is making efforts trying to become a supplier of lens modules for Apple, according to industry sources.

Huawei's chipmaking subsidiary HiSilicon has seen many of its staff in Taiwan leaving amid increasingly tough trade sanctions from the US on the Chinese tech group, according to industry...

Catcher Technology has announced it plans to sell two of its smartphone chassis plants and related facilities in China to Lens Technology, a Chinese firm which is reportedly a cover...

Pre-orders for Samsung's recently released Galaxy Note 20 devices have been stronger than expected in the Taiwan market, according to sources from local telecom channels.

Automation equipment specialist Kenmec Mechanical Engineering expects to gradually ramp up shipments of its newly developed thermal solution for server rooms in the months ahead.

IBM has revealed the next generation of its POWER central processing unit (CPU) family, designed for enterprise hybrid cloud computing.

The semiconductor industry may be watching closely TSMC's fast expansion of 12-inch fab capacity for advanced-node manufacturing, but supply at 8-inch fabs has been tight. As equipment...