Heat sink manufacturers continue to benefit from the surge in AI-driven server growth, with Asia Vital Components (AVC), Auras, and Jentech all posting record-high revenues in March 2026. Liquid cooling solutions are the main driver behind this momentum. Industry players note that liquid cooling units command average prices several times higher than air-cooling modules. As 2026 is set to be the inaugural year for widespread liquid cooling adoption, its share will keep rising, ensuring strong growth momentum throughout 2026.
Anthropic has launched a new cybersecurity initiative, Project Glasswing, giving select technology partners early access to a powerful yet-to-be-released AI model as concerns grow over AI-driven cyberattacks. According to Bloomberg, the program is designed to help companies prepare for potential risks before the model is made more widely available.
As US and Chinese leaders prepared for a mid-May summit, proposed US export controls on semiconductor equipment under the MATCH Act and China's sharp state-media rebuttal signaled heightened tech tensions with far-reaching global supply-chain implications. Analysts have characterized the moves as pre-summit leverage that could reshape chip manufacturing and trade flows.
China's leading AI and cloud companies are shifting toward domestically produced AI chips, a move with global implications for supply chains, technology competition, and cloud services. The trend could reduce demand for foreign semiconductors while accelerating China's practical deployment of AI on homegrown platforms, affecting international vendors and developers alike.
According to the latest report submitted by Taiwan's National Security Bureau to the Legislative Yuan, China is increasingly targeting Taiwan in an effort to circumvent international technological restrictions. Beijing has set its sights on Taiwan's high-tech sectors—particularly artificial intelligence (AI), semiconductors, and precision machinery—seeking to lure companies to establish operations or maintain a presence in China under the framework of its 15th Five-Year Plan.
Chinese enterprise SSD (eSSD) maker DapuStor entered its IPO subscription phase in early April 2026, driven by rapid expansion in AI infrastructure. The company recently observed multiple downstream customers significantly revising their order forecasts upwards after the Lunar New Year holidays. DapuStor highlighted that QLC SSDs are becoming a key trend for North American and Chinese cloud service providers (CSPs) to ease cost and capacity pressures. Its 245TB product has officially reached customer sampling stages.
US ride-hailing platform Uber has announced a partnership with Amazon Web Services (AWS) to deploy its in-house custom chips, aiming to improve the speed and efficiency of artificial intelligence (AI) model training and inference. The move is expected to strengthen Uber's real-time computing capabilities across ride-hailing and delivery services, while highlighting a broader push by cloud providers to capture AI infrastructure demand through proprietary silicon.
China's AgiBot Innovation (Shanghai) Technology has shipped its 10,000th humanoid robot, the Agibot Expedition A3, signalling early mass production at scale. Output doubled from 5,000 units at the end of 2025 within three months. While Tesla's Optimus timeline remains under scrutiny, China's humanoid robot push is already scaling, led by AgiBot, Unitree Robotics, and Ubtech Robotics in an emerging three-player structure.
As AI servers grow more complex and bandwidth demands surge, components once considered peripheral—connectors and high-speed cables—are emerging as critical determinants of system performance.
As the industry enters the second quarter of 2026, Apple plans to significantly shift its shipment schedule for iPhones and other consumer electronics, with a base iPhone model possibly debuting early in the quarter. Despite varying views on Apple's AI progress, the company's core strategy for 2026 remains consistent with 2025: aggressively pursuing market share by attracting new users through strong price-performance ratios across smartphones and PCs.
Corning will present materials and connectivity innovations at Touch Taiwan 2026 in support of global AI infrastructure, semiconductor packaging, and consumer electronics supply chains, signaling potential shifts in how data centers, displays, and automotive interiors are designed and manufactured in the years ahead.
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