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Jul 10

Huawei joins China Mobile, Baidu to build China's first NPO optical interconnect standard

Huawei has joined more than 20 Chinese technology companies and research bodies to launch OPEN NPO, the country's first multi-source agreement for near-packaged optics, in an effort to standardise high-speed optical interconnects for AI supernodes and large-scale computing clusters.

SK AI Summit postponed as SK eyes closer alignment with Nvidia GTC

Jul 10

Luxshare's weak HK debut highlights investor skepticism over AI transition

Jul 10

Meta bets on price to crack AI model market, testing whether frontier intelligence stays premium good

Jul 10

Meta readies Iris chip, locks in supply for push to 14 gigawatts

Jul 10

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IT COMPONENTS, PERIPHERALSApple reportedly accelerates AI chip roadmap as next-gen Macs prioritize neural processing

Jul 13, 10:54

Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen its position in the AI era.

AIWeekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

Jul 13, 10:48

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.

AIChina's Nvidia H200 pivot reveals why CUDA still rules AI

Jul 13, 10:46

China is preparing to allow a limited number of Nvidia H200 AI accelerators into the country, giving Alibaba, ByteDance, and DeepSeek access to advanced computing power while preserving Beijing's broader campaign for semiconductor self-reliance.

IT COMPONENTS, PERIPHERALSNvidia's HVDC shift could reshape data center power chains worldwide

Jul 13, 10:25

Nvidia's move toward high-voltage direct current (HVDC) power systems for artificial intelligence (AI) data centers could alter how global servers are built and powered. The shift aims to cut energy losses and improve efficiency, but it also raises questions about safety, design, and the supply chain that may determine which technologies gain the fastest adoption.

AIEurope, UK, and US financial sectors respond differently as advanced AI reshapes industry and regulation

Jul 13, 09:56

Advanced artificial intelligence (AI) is becoming a growing focus for financial regulators and technology companies across Europe, the UK, and the US, with authorities placing increasing attention on cybersecurity, consumer protection, and industry expansion.

PC, CEAcer posts 13-year second-quarter revenue high on PC and diversified growth

Jul 13, 08:06

Acer reported June consolidated revenue of NT$27.818 billion (US$864.8 million), up 6.3% from May, as the Taiwanese PC maker posted its strongest second-quarter revenue in 13 years. Second-quarter consolidated revenue reached NT$85.296 billion, rising 28.2% year on year, while first-half revenue climbed 23.3% to NT$157.727 billion.

ICT MANUFACTURINGIndia roundup: India's chip strategy tests its ability to build a competitive ecosystem

Jul 13, 07:54

India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.

ICT MANUFACTURINGSuperAlloy revenue climbs on recycled aluminum and semiconductor certification progress

Jul 13, 07:53

SuperAlloy Industrial posted June consolidated revenue of NT$749 million (US$23.36 million), up 17.93% from May and 21.46% from a year earlier. The Taiwan-based materials maker said the increase helped lift second-quarter 2026 revenue to NT$1.98 billion, a 15.45% rise from a year earlier, while first-half 2026 revenue reached NT$3.852 billion, up 6.02%.

IT COMPONENTS, PERIPHERALSAI buildouts accelerate MLCC shortages; Taiwan firms eye 2H26 spillover orders

Jul 13, 07:52

As AI server supply chains move into the component stocking phase, the market for high-end passive components has heated up sharply, with tight supply of multilayer ceramic capacitors (MLCCs) drawing close attention across the industry. Taiwan passive-component makers posted strong revenue in the second quarter of 2026, and with order backlogs at major MLCC suppliers in Japan and South Korea rising rapidly, Taiwan firms are expected to capture spillover orders from AI server applications in the second half of the year.

AISK Hynix hybrid bonding push signals next phase of HBM packaging race

Jul 13, 07:51

SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging density, thermal control, and tighter integration with AI accelerators.

IT COMPONENTS, PERIPHERALSLargan ramps variable aperture lens in 3Q as smartphone demand rebounds

Jul 13, 07:50

Optical leader Largan Precision said on July 9 that customer demand for new smartphones is picking up in the second half, while Chairman En-Ping Lin highlighted that strong technology and yield remain the decisive edge in a tougher market. He also said the company's high-end variable aperture lens will ramp in the third quarter, and periscope lens upgrades are set for 2027.

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Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process race to a materials race. Geckos chairman Shen Tsung-huan says that as chip manufacturing moves to 2nm and even more advanced nodes, gains in AI computing power are no longer just a chip design issue, but are increasingly constrained by the thermal conductivity and high-frequency signal transmission capabilities of materials.

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