DIGITIMES ICT news

Home Tech ICT

Sep 16

Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027

Wiwynn has officially kicked off mass production at its first US manufacturing facility. Departing from its previous strategy of leasing facilities in North America, the company is making a major investment to purchase land and build its own plants.

Why Wiwynn chose El Paso for its first US plant

Sep 16

Samsung backs Dutch AI chip startup Euclyd in US$230M funding round

Sep 16

Altera confidentially files for US IPO as AI chip demand fuels listing boom

Sep 16

Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030

Sep 16

MORE NEWS

SERVER, IPC, CLOUD COMPUTING, IOTHumanoid robots could reshape MEMS demand as physical AI advances

Sep 17, 14:20

Humanoid robots have not yet reached mass adoption, but their sensor needs are already reshaping supply-chain expectations worldwide. Analysts and industry players say the next wave of physical AI could lift demand for MEMS chips, edge computing, and advanced sensing, with broader implications for robotics makers, component suppliers, and global technology markets. Industry players say these systems need several times more sensors than conventional robots, creating a large opportunity for MEMS and sensor suppliers even if unit revenue per robot stays relatively modest.

AIArdentec, Sigurd race into silicon photonics TIA testing as US client books capacity

Sep 17, 14:15

The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance amplifier (TIA) testing as AI data-center networks shift toward faster optical interconnects. Ardentec and Sigurd are among the firms benefiting as a major US customer rushes to reserve capacity.

SERVER, IPC, CLOUD COMPUTING, IOTHuawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Sep 17, 13:49

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with a petabyte-scale key-value (KV) cache system designed for AI agents and long-context inference.

SERVER, IPC, CLOUD COMPUTING, IOTWiwynn sees strong AI demand offsetting US data center pushback

Sep 17, 13:14

Wiwynn's top executive said demand for artificial intelligence infrastructure is likely to keep the server maker on a strong growth path through the next several years, even as US opposition to data centers builds. The company is still expanding aggressively in North America, citing customer pressure, record revenue, and an improving margin profile.

PC, CEChina optical suppliers power smart glasses supply chain

Sep 17, 12:45

China's optical suppliers are playing a growing role in the global smart glasses, VR, and AR supply chain as AI glasses demand accelerates worldwide. Industry sources say more than 80% of smart glasses suppliers are from China, with Chinese vendors covering key areas from camera modules and light waveguides to microelectromechanical systems (MEMS) and batteries.

AIAI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Sep 17, 12:29

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.

ICT MANUFACTURINGWhy Taiwan's tech needs better storytelling to win global capital

Sep 17, 12:26

Taiwan has demonstrated its strong R&D and innovative capabilities in tech, but the challenge remains in propelling these technologies to global markets. In the opinion of Edison Awards CEO Frank Bonafilia, Taiwan is not lacking in innovation, but the real hurdles lie in securing capital and backing from major investment banks, and building partnerships with major global firms to commercialize and scale up Taiwan-developed technologies.

SERVER, IPC, CLOUD COMPUTING, IOTFoxconn Interconnect Technology targets the scaling challenge in AI optical interconnects

Sep 17, 12:13

Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September 16 under the theme "Light at Scale: The Next Frontier in Data Center Interconnects," bringing together global leaders from the optical communications, AI, and semiconductor industries to examine the next generation of AI connectivity across light sources, materials, photonics, network architecture, manufacturing, and the broader industry ecosystem.

AIHuawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet

Sep 17, 12:09

Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual accelerators. Huawei said the system is the industry's first supernode to adopt NPO and is designed to support large-scale training and inference for models with up to 10 trillion parameters.

PC, CEChina's LCD trio flexes newfound pricing power as Taiwan panel makers retreat

Sep 17, 11:59

China's top three liquid-crystal display (LCD) panel makers have sent written price-increase notices to customers for the first time, as Taiwan's leading panel makers sell factories and China tightens its grip on the global market. With South Korea and Japan already out of the thin-film-transistor LCD (TFT-LCD) market, China now controls more than 70% of LCD TV and monitor panel share, creating an effective oligopoly.

IT COMPONENTS, PERIPHERALSFIT ramps up optical interconnect push as AI race shifts to connectivity

Sep 17, 11:55

At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus is shifting from simply pursuing greater computing power to improving the overall efficiency of data centers. He said the key to the next 10 years of AI lies not only in chips and computing performance, but also in whether data can flow smoothly within data centers and across different systems through faster, more stable, and more efficient connectivity.

More coverage