CONNECT WITH US
Tuesday 14 July 2026
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneously bets on AI compute and storage.

Tuesday 14 July 2026
AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples
All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an industry-wide upcycle rather than gains concentrated in a single segment.
Tuesday 14 July 2026
GigaDevice director maps memory's next three years: capacity, AI demand, and the race for new applications

AI computing demand continues to fuel growth in the global memory market, but the industry's attention is shifting beyond short-term price movements. Increasingly, the focus is on longer-term variables, including the pace of capacity expansion, the sustainability of AI-driven demand, and whether emerging AI applications can achieve commercial scale.

Tuesday 14 July 2026
Aurotek posts record first-half revenue on semiconductor automation demand
Aurotek Corp. said revenue in the second quarter and first half of 2026 reached record highs as demand from semiconductors and smart automation accelerated. The Taiwanese automation supplier said growth was driven by rising orders for subsystem integration, equipment and robotics tied to global foundry and advanced packaging expansion.
Tuesday 14 July 2026
Analysis: Why Meta's AI strategy sparked a market misread

Reports that Meta is considering leasing out idle AI computing capacity have rattled investors. But treating Meta's predicament as a warning sign for the entire AI industry is a classic case of overgeneralization.

Tuesday 14 July 2026
US chases AI talent abroad as China strengthens its homegrown pipeline

The US can no longer close its artificial-intelligence talent gap with China through visa curbs or export controls alone, a new Hoover Institution and Stanford study argues, because China is now producing frontier-model researchers who never trained, worked, or published abroad, even as it also reclaims talent that spent years in American institutions.

Tuesday 14 July 2026
US-funded researchers barred from working with blacklisted Chinese entities from 2027

The US National Science Foundation will prohibit the researchers it funds from collaborating with organizations on Washington's restricted-party lists, a roster heavily populated by Chinese firms and institutions, under a Dear Colleague Letter dated July 8, 2026. The agency said it intends to implement the prohibition in fiscal 2027.

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.
Tuesday 14 July 2026
Column: Physical AI's rivalry shifts from companies to states

At the Humanoids Summit in Tokyo at the end of May 2026, a conference that had originally focused on technology and commercialization also set aside a stage for government delegates and policy watchers. An executive at a major US robotics company said bluntly at the event: "Government intervention is no longer optional."

Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.

Monday 13 July 2026
Trump admin reportedly urged Apple to procure chips from Intel in exchange for dropping tariffs

Reports have emerged that Apple may have managed to avoid 100% tariffs imposed by US President Donald Trump, partly by agreeing to partner with Intel to manufacture its chips. While Apple could benefit from expanding its chip suppliers, the episode also shows the power of Intel's government backing as the US seeks to reshore its semiconductor industry.

Monday 13 July 2026
Pegatron June revenue rose 15.9% on server shipments and AI expansion
Pegatron reported June revenue of NT$91.296 billion (US$28.43 billion), up 15.9% year over year and down 4.9% from May, as shipments increased on the gradual rollout of its new server business. The Taiwan-based electronics manufacturer said the business mix shift had helped deliver double-digit annual growth for two straight months, while management expects AI-related revenue to keep rising steadily in 2026.
Monday 13 July 2026
TSMC June 2026 revenue surges 68% as AI demand continues to fuel growth
TSMC reported another month of strong revenue growth, underscoring continued demand for advanced chips used in AI applications. According to the company's June revenue report, consolidated revenue reached NT$442.68 billion (approx. US$13.8 billion) in June, up 6.2% month-over-month and 67.9% year-over-year. For the first six months of 2026, revenue totaled NT$2.4 trillion, representing a 35.6% year-over-year increase.
Monday 13 July 2026
Tencent seeks control of Manus after China blocks Meta's US$2 billion AI deal

Tencent is in talks to become the largest shareholder in Manus, leading a proposed buyback of the AI agent startup after Chinese regulators ordered Meta Platforms to unwind its US$2 billion acquisition.

Monday 13 July 2026
MiniMax bets US$2 billion on AI infrastructure as lock-up selloff deepens its split with Z.ai
Chinese artificial-intelligence developer MiniMax is raising HK$16 billion (approx. US$2.04 billion) through a share placement and convertible bonds to accelerate spending on AI infrastructure and large-model development, pressing ahead with its most capital-intensive phase even as its Hong Kong-listed stock slides and a lock-up expiry unleashes fresh selling. The move underscores how far MiniMax's fortunes have diverged from those of rival Zhipu, the other big Chinese AI name to list in Hong Kong this year.
Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.

Monday 13 July 2026
China's Nvidia H200 pivot reveals why CUDA still rules AI

China is preparing to allow a limited number of Nvidia H200 AI accelerators into the country, giving Alibaba, ByteDance, and DeepSeek access to advanced computing power while preserving Beijing's broader campaign for semiconductor self-reliance.

Monday 13 July 2026
Europe, UK, and US financial sectors respond differently as advanced AI reshapes industry and regulation
Advanced artificial intelligence (AI) is becoming a growing focus for financial regulators and technology companies across Europe, the UK, and the US, with authorities placing increasing attention on cybersecurity, consumer protection, and industry expansion.
Monday 13 July 2026
AI buildouts accelerate MLCC shortages; Taiwan firms eye 2H26 spillover orders
As AI server supply chains move into the component stocking phase, the market for high-end passive components has heated up sharply, with tight supply of multilayer ceramic capacitors (MLCCs) drawing close attention across the industry. Taiwan passive-component makers posted strong revenue in the second quarter of 2026, and with order backlogs at major MLCC suppliers in Japan and South Korea rising rapidly, Taiwan firms are expected to capture spillover orders from AI server applications in the second half of the year.
Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging density, thermal control, and tighter integration with AI accelerators.
Monday 13 July 2026
AI shifts toward 'slow thinking' as agent era approaches, says Google DeepMind's VP of research
Ed Chi, vice president of research at Google DeepMind, said AI's next milestone will be its evolution from the fast, pattern-recognition-oriented thinking associated with System 1 toward the deeper reasoning capabilities of System 2. As large language models evolve into large reasoning models, the industry is now entering a new era of AI agents.
Monday 13 July 2026
Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs
GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory (HBM), advanced packaging, and liquid-cooled server racks. As the industry races to expand computing capacity, GPUs have largely defined the conversation. That dynamic, however, may be beginning to change as CPUs diverge from the rims of AI narration, and increasingly emerge as a critical component of AI infrastructure.
Monday 13 July 2026
Egis sells part of iCatch stake as ASMedia becomes largest shareholder
Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was intended to improve capital efficiency and optimize its ownership structure, while Egis remained an important shareholder with about 12% of iCatch after the transaction.
Monday 13 July 2026
AI era accelerates Foxconn's shift to global 24-hour cybersecurity coverage

Foxconn is using AI and coordinated security teams across Asia, Europe and the Americas to defend against cyberattacks as enterprises increasingly adopt AI. Chief Information Security Officer Wei-Bin Lee said that the company's global footprint makes it a prime target.