If the first revolution in artificial intelligence (AI) data centers was the move from air cooling to liquid cooling, the second is now unfolding: equipping cooling distribution units (CDUs) with on-board intelligence.
China is pushing ahead with its semiconductor materials strategy. Shanghai, one of the country's leading cities, has included brain-computer interfaces (BCIs) and fourth-generation semiconductors among its priority future industries, signaling early preparation for a new materials era beyond third-generation semiconductors.
Generative AI (GenAI) is driving a surge in computing demand, pushing data center competition beyond server performance toward infrastructure efficiency and deployment density, with power architecture emerging as a central focus of the next upgrade cycle.
US export controls are accelerating China's localization of data-center AI chips, with shipment data now pointing to rapid commercial scaling. Across more than a dozen domestic brands, at least nine Chinese AI chip vendors have shipped or secured orders exceeding 10,000 units, spanning platforms backed by major technology groups and a growing group of startups.
