The Biological Computing Co. (TBC), a San Francisco startup that grows living neurons in its lab to find ways to make AI models more efficient, launched its first publicly available product on October 30: mischief 1, an image-to-video model the company says generates video five times faster than the open-weight model it is built on. The release moves TBC's technology from an early-access program to self-serve developer marketplaces and puts a price on the company's argument that biology can be a source of AI efficiency distinct from the standard optimization toolkit.

Realtek Semiconductor quantified its AI business for the first time at an investor conference on October 29, setting a target for high-performance computing (HPC) and edge AI revenue—including automotive and robotics applications—to exceed 30% of total revenue by 2030. These businesses currently account for a high-single-digit percentage of revenue, as AI expands into infrastructure and edge devices.

Foxconn and Nvidia took center stage at Hon Hai Tech Day 2026 (HHTD 26) on October 30, showcasing their latest collaboration in AI infrastructure, including Nvidia's newly unveiled DSX Pod Compute Container and the Spectrum-X co-packaged optics (CPO) switch manufactured by Foxconn.

Google is deepening its strategic partnership with Foxconn to accelerate AI infrastructure deployment, aiming to cut the time from chip supply to data-center deployment from the traditional 12 to 18 months to about six months, said Rehan Sheikh, vice president of global silicon chip technology and manufacturing at Google Cloud, at Hon Hai Tech Day (HHTD 26) on October 30.

Thailand-based precision sheet-metal manufacturer Jinpao Precision has entered the supply chain of a leading Thailand-based power-management company on the strength of its resilient manufacturing capabilities and highly adaptable product layout strategy. The company is accelerating its expansion in Thailand to capture growing AI demand as it furthers its efforts in high-end power cabinets, backup battery unit (BBU) systems, and energy-storage components.

South Korean AI chip developers HyperAccel and Rebellions are moving beyond standalone accelerators to develop integrated data center systems, seeking to combine domestic processors, memory, and networking technologies into infrastructure capable of handling different AI workloads at lower cost.

The rapid development of AI robotics applications is driving a sharp increase in semiconductor computing requirements. According to DIGITIMES Intelligence, Nvidia is set to dominate the 2026 AI robotics computing IC market with a 69% share, far outpacing Intel (11%), Qualcomm (5%), and AMD (2%). Beyond raw computing power, Nvidia's comprehensive software ecosystem is the critical factor leaving competitors in its wake.

Nvidia is reportedly evaluating billions of dollars in credit support for UK neocloud provider Nscale to help cover power and construction costs for a data center in West Virginia. Nscale faces simultaneous pressure to accelerate the launch of the Nvidia chip-powered campus, which is expected to be used by AI startup Anthropic, while preparing for an initial public offering (IPO), underscoring how AI infrastructure competition is expanding from chip supply to financing and construction capabilities.

After The New York Times reported that a female executive at Singapore-based Megaspeed International was under investigation for allegedly conducting espionage activities for China, Nvidia CEO Jensen Huang said the company's dealings with Megaspeed were normal and involved no irregularities.

Passive component manufacturer Yageo said robust AI demand is driving shipments of multilayer ceramic capacitors (MLCCs) and tantalum capacitors, pushing AI-related applications to nearly 20% of its total revenue in the third quarter of 2026, up from 16% in the preceding quarter.

Oracle will offer cloud services powered by Cerebras' AI computing systems in its cloud data centers starting in 2027, giving the wafer-scale chipmaker another major cloud customer. Although the companies did not disclose Oracle's planned Cerebras hardware purchases, the deal highlights the shift toward diversified AI compute resources as inference demand accelerates.

Citing a grave threat to national security and the vulnerability of American critical infrastructure, President Donald J. Trump has directed the Secretary of Commerce and the US Trade Representative to initiate immediate trade negotiations regarding foreign imports of industrial machinery, robotics, and their components.

Doosan Enerbility is strengthening its position in the AI-driven power infrastructure market, backed by 12 gas turbine orders in the US and an expanding nuclear energy portfolio. At Smart Energy Plus (SEP) 2026 in South Korea, the company showcased technologies spanning gas turbines, large nuclear reactors, small modular reactors (SMRs), and offshore wind, highlighting delivery speed, manufacturing capacity, and long-term maintenance as increasingly critical competitive factors.

Strong demand for AI applications and cloud services is driving investment in high-performance computing chips and AI servers, prompting Taiwan manufacturers to expand capacity and borrow from banks while retaining cash. At the same time, banks' property-related loan balances continue to decline as credit resources flow into production and the real economy.

STMicroelectronics (ST) reported third-quarter 2026 revenue of US$3.76 billion, above the midpoint of its guidance, as AI data center and low Earth orbit (LEO) satellite demand lifted communication equipment and computer peripheral sales by 64% year-over-year. Gross margin reached 37.3%, up 410 basis points from a year earlier, and non-US GAAP earnings per share came in at US$0.37. Free cash flow was US$351 million.

Anthropic's "multi-platform resource pool" strategy, disclosed in its S-1 filing, is sending an important signal to the AI chip industry. The company uses Amazon Trainium, Google tensor processing units (TPUs), Nvidia GPUs, and Advanced Micro Devices (AMD) GPUs, integrating computing capacity from different partners into a unified resource pool through software and allocating it across chip platforms based on task requirements.

Power shortages and a shortage of high-voltage direct-current (HVDC) technicians in the US are slowing AI data center construction and making delivery schedules harder to predict, Delta Electronics chairman Ping Cheng said at an investor conference on October 29. Delta will continue developing HVDC and solid oxide fuel cell (SOFC) systems to pursue opportunities in data center power supply and energy efficiency.

As the US Drone Dominance Program (DDP) expands procurement, orders exceeding 10,000 units will generate significant economies of scale across the drone supply chain. The program's third phase, scheduled to begin in early 2027 and dubbed the industry's "final boss," will raise both procurement volumes and technical requirements, creating an opening for Taiwan suppliers to secure positions in the edge AI supply chain.

Delta Electronics expects fourth-quarter 2026 operations to improve from the third quarter, supported by artificial intelligence (AI) data center construction, said chairman Ping Cheng during an earnings call on October 29. However, material shortages are making customer construction and equipment delivery schedules harder to predict, prompting Delta to secure material supplies, maintain buffer inventory, and coordinate delivery plans with customers.

Amazon's third quarter showed its cloud expansion translating into stronger operating profitability, while the cash demands of building AI infrastructure kept rising. The result sharpens the company's central operating challenge: sustaining rapid AWS growth while bringing new capacity into service and maintaining the economics of its much larger retail business.

Silicon Motion Technology reported third-quarter 2026 revenue of about US$560 million, marking a record high for the fourth consecutive quarter. Revenue rose 24% quarter-over-quarter and surged 131% year-over-year, putting the company on track to achieve record full-year revenue in 2026, up more than 100% from 2025.

Chinese AI, robotics, and semiconductor stocks have suffered a steep sell-off in less than four months, casting a shadow over Beijing's push to achieve global technology leadership. According to Reuters, the Shanghai STAR 50 Index has fallen about 40% from its June peak, wiping out approximately US$480 billion in market value across AI and semiconductor components.

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific announced on October 28 that its board had approved a memorandum of understanding with global e-paper leader E Ink Holdings (EIH) to jointly develop AI high-speed connectivity materials. The partnership combines E Ink's expertise in base-material development and manufacturing with Taiflex's circuit-board material capabilities and industry experience to address demand for high-performance materials, mass-production capacity, and stable supply.

Elite Material Co. (EMC), a copper-clad laminate (CCL) maker, reported record third-quarter 2026 revenue of NT$60.88 billion (US$1.875 billion), driven by strong demand for high-end materials used in AI products and fully loaded production capacity. Revenue rose 28.8% quarter-over-quarter and 142% year-over-year.

Nvidia CEO Jensen Huang's visit to Kazakhstan highlights a widening contest over AI computing capacity, as Europe seeks alternatives to infrastructure concentrated in the US and Asia. Kazakhstan, with 21 million people, is developing data centers and pursuing Nvidia partnerships that could position it as a supplier to Europe.