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Friday 5 June 2026

Arm says Taiwan powers its rise as agentic AI lifts PC growth

Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI will trigger the biggest PC industry transformation in 40 years and could expand the global PC market by 10 times.

Friday 5 June 2026

TSMC says AI demand is straining the entire supply chain, not just chipmakers

TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment, and upstream suppliers.

Friday 5 June 2026

Hiwin targets logistics automation with Dexterity dual-arm robot

Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules, and system integration. The company also unveiled a dual-arm logistics robot developed in partnership with US logistics firm Dexterity for the first time.

Friday 5 June 2026

Local Chinese brands challenge dominant brands in AI glasses innovation; limitations hinder mass adoption

This year's Global Connect Show (GSC) in Shenzhen, China, has become a medium for local tech brands to showcase AI wearable innovation. Two leading brands at GCS, Rokid and INMO, demoed their feature-packed AI glasses. Many companies featured AI translation as their flagship capability, paired with lightweight hardware, hands-free controls, customizable designs, and flexible model support. While on-site demos proved these up-and-coming brands' AI glasses may outperform dominant players such as Meta and Apple, there are still lingering flaws, such as battery life and privacy ethics, that stand in the way of mainstream mass adoption.

Friday 5 June 2026

AI energy demand drives a shift to vertical power delivery and smaller modules

As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the "AI factories" of the future. This concern was the centerpiece of presentations by several industry figures at Computex in Taipei, where they presented solutions under development, from raw material innovations to shrinking component sizes.

Friday 5 June 2026

Foxconn says Nvidia's Vera Rubin AI products remain on track for 2026 shipment

Foxconn and Foxconn Industrial Internet (FII) said at Computex that production of Nvidia's next-generation AI products is progressing smoothly, with shipments expected before the end of the third quarter of 2026. The outlook matters globally because it signals faster AI hardware deployment, lower computing costs, and wider adoption across consumer, enterprise, and automotive markets.

Thursday 4 June 2026

Foxconn, SK Group eye deeper AI infrastructure ties in Asia

Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers, data centers, and energy solutions.

Thursday 4 June 2026

Tripo AI raises nearly US$200 million to expand 3D and world model research

Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.

Thursday 4 June 2026

Adlink ramps robotics and edge AI expansion as US market drives growth

Adlink Technologies said it pushed into a growth phase for robotics, edge AI, and vertical markets in 2026 as the US became its largest revenue engine, accounting for more than 30% of sales. The industrial PC maker reported broad-based demand across healthcare, transportation, defense, energy, and industrial automation and said design-in projects will start contributing shipments from 2026 into 2027.

Thursday 4 June 2026

Nvidia's Jensen Huang courts Korean giants in robotics expansion

Nvidia CEO Jensen Huang is visiting South Korea this week as the company seeks to expand its partnerships with major Korean conglomerates beyond semiconductors and into robotics, autonomous driving, and industrial automation, ETNews reported.

Thursday 4 June 2026

TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus

TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year in which the world's largest contract chipmaker converted the AI semiconductor boom into record-scale earnings.

Thursday 4 June 2026

Nvidia's RTX Spark reveals Jensen Huang's bigger AI agent fight with Apple and Google

Nvidia CEO Jensen Huang introduced RTX Spark, co-developed with MediaTek, at Nvidia GTC Taipei, with PC brands expected to launch products in the third quarter of 2026. While widely seen as Nvidia's return to Windows on Arm after a 15-year absence and a challenge to Qualcomm, RTX Spark points to a larger fight over AI-era endpoints.

Thursday 4 June 2026

Formosa Chemicals moves into AI data center materials and DUV photoresist precursors

Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The company said it has shipped a high-RTI flame-retardant polycarbonate material for backup battery modules and cooling fans since 2025, is developing deep ultraviolet photoresist precursor materials, and is advancing a high-purity low-carbon hydrogen project to support semiconductor fabs.

Thursday 4 June 2026

Southern Taiwan Science Park January-April 2026 revenue tops NT$1 trillion on AI boom

Driven by the booming semiconductor industry, the Southern Taiwan Science Park (STSP) posted revenue of nearly NT$1.1 trillion (approx. US$35.04 billion) for January to April 2026, up 21.3% compared with the same period in 2025, surpassing the NT$1 trillion mark. This performance not only underscores the park's strong expansion momentum but has also reinforced its position at the core of the global high-tech supply chain.

Thursday 4 June 2026

AI sparks tight supply warning for high-end passive components; MLCC rally eyes new super cycle

AI-driven demand for computing infrastructure has ended the passive components industry's inventory adjustment phase, with Taiwan-based leaders Yageo and Walsin Technology both seeing utilization rates return to high or full-capacity levels. The market is now showing signs of a renewed boom for the first time since the 2018 "super cycle."

Thursday 4 June 2026

Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore as the city-state becomes a more important manufacturing, logistics, and advanced-packaging hub for the US chip-equipment maker, Nikkei Asia reported.

Thursday 4 June 2026

The 'Wintel' of robotics? Nvidia allies with Unitree to standardize AI humanoid development

In a move set to reshape the global robotics landscape, Nvidia announced at GTC Taipei that it will partner with Chinese humanoid robot pioneer Unitree Robotics to launch the world's first open humanoid robot reference design. By deeply integrating advanced AI with physical hardware, the collaboration aims to drastically lower development barriers across the industry.

Thursday 4 June 2026

Kentec challenges traditional data centers with modular AI data center orders

Global AI computing demand is sweeping through the infrastructure market. Kentec, the AI data center (AIDC) system integrator and turnkey solution provider under Kenmec Mechanical Engineering, expects first-half 2026 revenue to rise more than 200% year on year, with the real surge concentrated in the second half of the year.

Thursday 4 June 2026

EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure

The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source software, and digital energy systems.

Thursday 4 June 2026

Qualcomm says Snapdragon C fills entry-level AI PC gap, not tied to Apple

Qualcomm's new entry-level Snapdragon C lineup is not directly tied to Apple, according to Kedar Kondap, senior vice president and general manager of compute and gaming at Qualcomm. The company launched the product line to fill a gap in its entry-level portfolio while maintaining its emphasis on low power consumption and high performance.

Thursday 4 June 2026

xMEMS tackles data center heat with chip-level cooling tech

Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related slowdowns are becoming a growing bottleneck for both computing performance and data-transfer efficiency.

Thursday 4 June 2026

MiTAC Computing confident in 2026 growth amid AI server expansion

MiTAC Computing Technology, a subsidiary of MiTAC Holdings, has no doubt that operations will grow in 2026, according to company president Rick Hwang. The company has two new US facilities scheduled to begin operations by the end of the third quarter of 2026, while a new plant in Vietnam started mass production in April.

Thursday 4 June 2026

Pegatron sees AI server expansion accelerating as organizational overhaul nears completion

Pegatron is betting that the AI server market will keep expanding, even though it entered later than some peers. The company said 2026 will mark the start of a full-speed push as generative AI shifts toward inference and both agentic and physical AI begin real-world deployment.

Thursday 4 June 2026

Broadcom says AI chip revenue on track to exceed US$100 billion in 2027, rules out rack business

At the earnings call on June 3, Broadcom said its AI semiconductor business continued to accelerate in the fiscal second quarter, with revenue reaching a record US$10.8 billion, up 143% from a year earlier, and bookings exceeding US$30 billion. CEO Hock Tan said demand for custom accelerators and networking remained "simply insatiable," adding that the company expects AI semiconductor revenue to double in the second half of fiscal 2026 from the first half.

Thursday 4 June 2026

Broadcom advances OpenAI custom chip program, expands Anthropic AI compute initiative

Broadcom said its AI semiconductor business remained in an "insatiable" demand environment on its second quarter of fiscal 2026 earnings call on June 3, as it outlined progress with its six core customers, including Google, OpenAI, Meta, Anthropic, and Apollo-backed programs. Chief Executive Hock Tan said the company's AI semiconductor revenue reached a record US$10.8 billion in the quarter, up 143% year on year, and added that networking made up almost 40% of AI revenue. He also said bookings topped US$30 billion, while shipments totaled US$10.8 billion.

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