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Saturday 17 May 2025
Current status of China's lithography equipment development: EUV
While China's Ministry of Industry and Information Technology (MIIT) recently announced updates on deep ultraviolet (DUV) lithography, Shanghai Micro Electronics Equipment (SMEE) also disclosed its 2023 patent applications related to extreme ultraviolet (EUV) technology, along with the publication of patents filed in September 2024.
Saturday 17 May 2025
From soy milk to silicon: the untold story of Taiwan's chip ascent

The documentary A Chip Odyssey, directed by Chu-Chen Hsiao and more than five years in the making, is set to premiere on June 13. The film is based on interviews with over 80 industry insiders and scholars, and had its media preview on May 13, attended by journalists as well as figures from academia, the arts, and tech.

Friday 16 May 2025
High-end MBs drive USB4 host controller chip shipments; ASMedia expects double-digit revenue growth in 2025
Benefiting from strong end-market demand for foundry products and early chipset procurement, coupled with a significant increase in demand from major customers for high-end motherboards, the shipment of USB4 host controller chips has surged. Asus subsidiary ASMedia delivered an impressive operational performance in the first quarter of 2025, achieving an earnings per share (EPS) of NT$16.39 (US$0.54), marking a record high for a single quarter.
Friday 16 May 2025
GlobalWafers opens advanced US silicon wafer plant, plans additional US$4bn investment
GlobalWafers has officially launched its US$3.5 billion silicon wafer manufacturing facility in Sherman, Texas, marking the first fully integrated 12-inch wafer production line built in the United States in over two decades. Chairman Doris Hsu announced plans for an additional US$4 billion expansion, bringing the company's total US investment to US$7.5 billion.
Friday 16 May 2025
Tata Elxsi selected by Mercedes-Benz India for software-defined vehicle development
According to a press release, Tata Elxsi announced on May 14, 2025, that it has been chosen by Mercedes-Benz Research and Development India (MBRDI) to support vehicle software engineering and the development of software-defined vehicles (SDVs). The collaboration is expected to accelerate innovation and improve software scalability across vehicle models.
Friday 16 May 2025
AI powers breakthrough in Micro LED manufacturing by Rayleigh Vision Intelligence
As Micro LED technology approaches mass production, high costs remain a major barrier to broader market adoption. However, a breakthrough from Taiwanese startup Rayleigh Vision Intelligence (RVI) could mark a turning point. The company has built the world's first AI-driven pilot line for Micro LED manufacturing, targeting four long-standing challenges: low yield, poor production efficiency, high costs, and the complexity of mass transfer and measurement.
Friday 16 May 2025
ASE maintains semiconductor packaging dominance despite Chinese surge
Taiwan's ASE Technology Holdings and US-based Amkor Technology maintain their positions atop the global outsourced semiconductor assembly and test (OSAT) market, though both face revenue declines in 2024 as Chinese competitors rapidly narrow the gap.
Friday 16 May 2025
Applied Materials looks beyond China, leans into AI and memory
Applied Materials sees 2Q25 strength amid China spending slowdown and rising competition from SiCarrier
Friday 16 May 2025
GlobalWafers to power Danish subsidiary with on-site solar plant
Topsil GlobalWafers A/S, the Danish subsidiary of GlobalWafers, is set to achieve RE100 by launching a self-built solar power plant in 2025, marking a milestone as the first semiconductor crystal growth facility in the world powered entirely by on-site renewable energy.
Friday 16 May 2025
India's IESA targets global ties, skills push for chip growth
The India Electronics and Semiconductor Association (IESA) is accelerating its multi-pronged strategy to develop the country's semiconductor value chain, expanding cross-border industry collaborations while advancing state-level partnerships and workforce development programs.
Thursday 15 May 2025
China's fallen chip czar and the bullet Taiwan dodged
Zhao Weiguo, the former chairman of China's Tsinghua Unigroup and once a high-profile figure in China's semiconductor ambitions, was sentenced on May 14, 2025, to death with a two-year reprieve by the Jilin Intermediate People's Court for embezzlement and abuse of power. The court also imposed a lifelong revocation of his political rights and the confiscation of all personal assets.
Thursday 15 May 2025
ASE to acquire AMPI in strategic bid to restructure 6-inch foundry ops, tap AI chip demand
ASE Holdings, a global leader in semiconductor packaging and testing, announced that its subsidiary ASE Test Limited will initiate a tender offer to acquire Advanced Microelectronic Products, Inc. (AMPI), a 6-inch wafer foundry based in Taiwan. The acquisition aims to restructure AMPI's operations and support the company's broader business overhaul.
Thursday 15 May 2025
ChipMOS prioritizes utilization boost: NOR Flash demand drives optimism for 2H25
Taiwan-based IC backend house ChipMOS Technologies reported a 23% drop in net profit for the first quarter of 2025, despite a slight increase in revenue. ChipMOS chairman Shih-Jye Cheng highlighted the continued uncertainty in the industry for the coming year and stressed that maximizing utilization rates will remain the company's top priority.
Thursday 15 May 2025
Current status of China's lithography equipment development: DUV
In the US-China trade war, the focus of US pressure has been on curbing the development of China's high-tech sectors—especially semiconductors, artificial intelligence (AI), and quantum computing, with the first two being closely intertwined.
Thursday 15 May 2025
Huawei's quiet IDM ambition: 11 shadow fabs across China under the spotlight
Huawei is now believed to operate at least 11 semiconductor fabrication plants across China, covering memory, logic, and foundry segments—underscoring its strategic shift toward becoming a fully integrated device manufacturer (IDM), similar to Intel or Samsung.
Thursday 15 May 2025
US poised to approve deal permitting UAE to import 500,000 Nvidia AI chips yearly

The US has reached a preliminary agreement with the United Arab Emirates (UAE) that would allow the Gulf nation to import 500,000 advanced AI chips from Nvidia annually beginning in 2025, according to Reuters. The agreement is expected to support the UAE's push to build critical data centers essential for advancing AI model development. Sources familiar with the matter suggest the agreement is expected to last until at least 2027, with the potential for an extension through 2030.

Thursday 15 May 2025
MediaTek expands flagship smartphone chip line with Dimensity 9400e
MediaTek introduced the newest member of its Dimensity flagship smartphone chip series on May 14, 2025, named the Dimensity 9400e. This chip features MediaTek's advanced All Big Core architecture, which provides outstanding performance and energy efficiency for gaming, artificial intelligence, imaging, and connectivity for smartphone users. The first smartphones powered by the Dimensity 9400e are expected to launch later in May.
Thursday 15 May 2025
TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant
At the TSMC Technology Symposium 2025 on May 15 in Hsinchu, Taiwan, T.S. Chang, VP of Advanced Technology and Mask Engineering at TSMC, announced the company's accelerated fab expansion plans. Previously, TSMC built an average of three fabs annually from 2017 to 2020, which increased to five each year from 2021 to 2024. In 2025, TSMC aims to construct nine new facilities, consisting of eight wafer fabs and one advanced packaging plant.
Thursday 15 May 2025
Chips made in India: HCL-Foxconn semiconductor venture in Uttar Pradesh approved
India finally approved the chipmaking facility proposed by a joint venture between HCL and Foxconn, which will be the first such facility in Uttar Pradesh, as Foxconn continues to step up its semiconductor investments in India.
Thursday 15 May 2025
Automakers shift to hybrid domain-zonal architecture for next-gen vehicles
Global automotive manufacturers are converging on a hybrid domain-plus-zonal (D+Z) control architecture for next-generation vehicles, representing a significant evolution in electrification and electric (EE) architecture. This emerging standard, likely to appear in production vehicles between 2028-2029, is becoming evident at Computex 2025, where major information and communications technology (ICT) players are showcasing their automotive solutions.
Thursday 15 May 2025
Huawei cornered in Middle East: Trump, Nvidia redraw AI frontlines
The US-China tech conflict is intensifying even as leaders project a veneer of diplomacy. During trade talks in Geneva, President Donald Trump said the US was "not looking to hurt China," hinting at a tension pause. Yet, almost simultaneously, Washington imposed new export restrictions on AI chips, explicitly banning the global use of Huawei's Ascend processors.
Thursday 15 May 2025
SMIC and Hua Hong reportedly seek more orders from US IC design firms amid China foundry competition
Chinese foundries SMIC and Hua Hong Semiconductor are reportedly stepping up efforts to expand their American presence, not by building fabs there, but by securing orders from US-based IC design companies under the local-for-local, China-for-China strategy amid intense chipmaking competition in China.
Thursday 15 May 2025
Renesas expands in India with new offices and Meity-backed startup, academic partnerships
According to a press release on May 13, 2025, Renesas Electronics Corporation announced a partnership with India's Ministry of Electronics & Information Technology (MeitY) to support local startups and academic institutions in VLSI and embedded semiconductor systems. The company also opened and expanded offices in Bengaluru and Noida to accommodate its growing R&D teams, with inauguration ceremonies held on the same day.
Thursday 15 May 2025
AI computing power race continues amidst Trump tariff uncertainties
Global tech markets are closely monitoring AI server shipments and generative AI evolution as the industry enters a new phase of computing power competition. Economic uncertainties have intensified following Donald Trump's return to the White House in early 2025, creating challenges for market demand and global supply chains.
Thursday 15 May 2025
TM Robot expands North American presence with smart manufacturing push
As the global leader in AI collaborative robotics, Taiwan's Techman Robot (TM Robot) is celebrating its 10th anniversary by unveiling a suite of next-generation smart automation solutions at Automate 2025. From high-speed AI visual inspection to advanced semiconductor logistics and precision welding, TM Robot's latest innovations reflect a growing shift toward intelligent, flexible, and software-defined manufacturing.