Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor is scheduled to announce products at CES.

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically.

Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial intelligence infrastructure lifts memory chip prices. The reports, compiled by South Korean outlets including Korea Economic Daily and EBN and citing industry sources, said Samsung's preliminary fourth-quarter operating profit is expected to exceed KRW20 trillion, a level that would mark the first time a South Korean company has crossed that threshold in a single quarter.