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Wednesday 24 September 2025
Singapore gains ground in OSAT; KYEC reportedly boosts regional expansion
King Yuan Electronics Co. (KYEC), a top IC testing service provider, said it will inject SGD100 million into its Singapore unit, fueling speculation that the move is paving the way for overseas expansion.
Wednesday 24 September 2025
Taiwan's three major science parks report chip-driven record revenue in 1H25
The National Science and Technology Council's three major science parks achieved a combined revenue of NT$2.74 trillion (approximately US$90.6 billion) in the first half of 2025, marking a 26.74% increase year-over-year. This surge reflects the semiconductor sector's robust performance alongside expanding AI applications and investments in cloud services.
Wednesday 24 September 2025
Commentary: Analyzing Nvidia's crisis defusing strategy amid the AI bubble storm
Nvidia's recent major investments have shocked the market. However, there are widespread views that both Nvidia and its CEO Jensen Huang find themselves at the "center of the AI bubble storm." The question on many minds is: what exactly is Huang's strategic plan?
Wednesday 24 September 2025
Why your next PC or smartphone will cost more: chipmakers, suppliers raise prices amid AI frenzy
Escalating tariffs, high inflation, and a shift in supply chains to the US are driving up manufacturing costs, leaving little room for prices on consumer electronics and business technology to come down.
Wednesday 24 September 2025
South Korea urges US visa fee discounts amid H-1B cost hike
South Korean scholars have urged government support to reduce the new US$100,000 H-1B visa fees, suggesting a stabilization fund, tax incentives for small and medium-sized enterprises (SMEs), easier visa processes, and enhanced local talent training.
Wednesday 24 September 2025
Onsemi to acquire Aura Semiconductor's Vcore power technologies
Onsemi has announced an agreement to acquire rights to Aura Semiconductor's Vcore power technologies, including related intellectual property licenses. The acquisition, expected to close in the fourth quarter of 2025, will expand onsemi's power management portfolio for AI data center applications, with minimal impact on earnings in the first fiscal year.
Wednesday 24 September 2025
Analysis: Nvidia-Intel partnership to integrate x86 with GPU for AI growth
Nvidia and Intel are collaborating to enhance CPU-GPU integration, with Nvidia supplying GPUs for Intel PCs and acquiring customized CPUs, addressing Nvidia's x86 gap and opening new markets for Intel.
Wednesday 24 September 2025
MediaTek in talks with TSMC on Arizona production, rolls out new Dimensity 9500
Taiwan's MediaTek, the world's largest mobile chip supplier by shipments, is in discussions with TSMC to manufacture some of its semiconductors in Arizona. This potential move comes as the company unveils its most advanced 5G smartphone processor to date.
Wednesday 24 September 2025
Why Intel's US$16 billion lifeline won't solve its foundry crisis?
Intel, once the uncontested leader in PC and server chips, faces a turning point. Delays in advanced process technology and rising competition from AMD and Arm-based architectures have dented both performance and reputation. Recent capital infusions totaling around US$16 billion—from US government subsidies, SoftBank, and Nvidia—have brought attention to Intel's revival efforts, but analysts warn that funding alone cannot resolve long-standing structural weaknesses.
Wednesday 24 September 2025
Yole Group CEO interview (Part 2): Post-Moore's Law era sparks advanced packaging race
As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its CoWoS technology but also fosters a collaborative ecosystem involving OSAT players like ASE Holdings and Amkor.
Tuesday 23 September 2025
Hanwha Semitech reportedly courts Foxconn, ASE in OSAT race
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South Korean media. Analysts see the move as part of Hanwha's drive to showcase its assembly equipment and capture orders from Taiwan's rapidly growing OSAT sector.
Tuesday 23 September 2025
Tesla reportedly recruiting semiconductor talent to boost AI6 chip and 2nm Samsung collaboration
Tesla is actively recruiting semiconductor experts to enhance its next-generation chip development and mass production capabilities. Recent reports indicate that Samsung Electronics' foundry division secured the wafer fabrication order for Tesla's "AI6" chip. Consequently, this recruitment drive likely aims to improve AI6 yield rates and strengthen cooperation with Samsung.
Tuesday 23 September 2025
Samsung races to supply Nvidia with HBM3E, WAT results crucial
Despite previously facing overheating issues, Samsung Electronics is preparing to supply its fifth-generation high bandwidth memory (HBM3E) to Nvidia. However, opinions within the South Korean industry remain divided.
Tuesday 23 September 2025
Nvidia-Intel alliance to boost long-term demand for ABF substrates
Nvidia and Intel have announced a rare partnership to jointly develop next-generation AI data center and PC platform chips. Despite predominantly negative market interpretations, the industry remains optimistic that this "powerful collaboration" will promote closer integration of GPU and CPU designs, thereby driving increased demand for high-end ABF substrates. Leading suppliers closely working with both companies are expected to be the biggest beneficiaries.
Tuesday 23 September 2025
Commentary: Why Intel is joining Nvidia's NVLink camp and what it means for AI chips
Nvidia's US$5 billion move to acquire a 4% stake in Intel isn't about the money — it's about survival strategy. The real issue is how Intel, struggling to regain relevance in AI, can leverage this partnership with the GPU powerhouse to sharpen its AI play.
Tuesday 23 September 2025
Commentary: How did Intel go from AMD ally to Nvidia partner?
On September 18, 2025, local time in the US, Intel announced a US$5 billion investment from Nvidia and the start of deep collaboration between the two companies. Shortly after, Intel CEO Lip-Bu Tan stated on social media that he would be joining Nvidia CEO Jensen Huang for a joint live broadcast to clarify details about their partnership.
Tuesday 23 September 2025
TSMC extends lead in foundry market as Samsung loses ground
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls further behind, according to new industry data.
Tuesday 23 September 2025
12-inch SiC substrates poised for two-phase entry onto CoWoS packaging
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips. Industry sources say 12-inch SiC substrates are being explored for use in TSMC's CoWoS (chip-on-wafer-on-substrate) system, potentially opening a higher-value market beyond electric vehicles and solar power.
Tuesday 23 September 2025
Yole Group CEO interview (Part 1): TSMC dominates AI era as supply chain dynamics undergo massive shifts
The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries between design, manufacturing, and supply chains are crumbling as AI accelerates innovation from advanced process nodes to next-generation packaging. Yet this revolution comes with consequences—bottlenecks in upstream equipment and materials are forcing a complete reconfiguration of the ecosystem.
Tuesday 23 September 2025
Nvidia-Intel alliance deepens US-China tech divide
Nvidia said it will invest US$5 billion in Intel and broaden cooperation in semiconductor design and development. The deal does not include chip fabrication but is viewed as a key step that aligns with US President Donald Trump's drive to revive Intel. By adding Intel's CPUs to its lineup, Nvidia is aiming to expand its presence across computing markets.
Tuesday 23 September 2025
Episil bets on SiC and GaN for Q4 rebound as compound semiconductor market bottoms out

Episil and its epitaxy-focused subsidiary Episil Precision, spanning both silicon (Si) and wide-bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN), told investors on Sept. 17 that its SiC and GaN businesses sank to a low point in the first half of 2025. The company expects recovery only by the fourth quarter.

Monday 22 September 2025
Nvidia invests in Intel; Acer founder says TSMC still far ahead in foundry sector
Nvidia's investment of US$5 billion in Intel sent shockwaves through the semiconductor industry. Stan Shih, founder of Acer, commented that while the US requires a healthier industry with more diversified suppliers, the more significant factor lies in Nvidia's integration with the x86 ecosystem, which will profoundly influence the future trajectory of artificial intelligence (AI) development.
Monday 22 September 2025
MediaTek unveils Dimensity 9500 with dual-core NPU architecture for major performance leap
MediaTek has officially launched its new smartphone system-on-chip (SoC), the Dimensity 9500. Built on TSMC's advanced N3P process technology, it currently offers the best balance between performance and power efficiency.
Monday 22 September 2025
MediaTek aims to boost smartphone market share to 40% with sew flagship chips
MediaTek this week unveiled its flagship Dimensity 9500 SoC. After the launch event in Taiwan, senior executives outlined their outlook for the company's mobile business.
Monday 22 September 2025
Samsung secures IBM chip orders, taps China clients as advanced node struggles linger
Samsung Electronics has reportedly won IBM's foundry order for its next-generation Power11 data center CPU, produced on an enhanced 7nm (7LPP) process. The node, the world's first to adopt EUV lithography, enables finer circuit patterns with up to 23% better performance and 45% lower power consumption than earlier technologies.