A US push for additional Korean semiconductor manufacturing investment has entered bilateral negotiations just as the first project under South Korea's US$200 billion strategic-investment mechanism approaches selection.
Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from an earlier 12-high design, as rising memory costs put greater emphasis on bandwidth efficiency and overall system economics.
Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the Chinese interconnect chipmaker deeper in AI data center infrastructure.
The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for both conventional memory and high-bandwidth memory (HBM), while Chinese supplier ChangXin Memory Technologies (CXMT) rapidly increased its presence.
