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Thursday 29 May 2025
Memory price surge supports IC distribution in 2Q25; supply and inventory require cautious management
Despite the global semiconductor market currently being affected by exchange rates, inflation, and US tariff policies, there are no clear signs of recovery in the end-user market. However, in the memory sector, IC distributors have experienced a price increase in the second quarter of 2025. Coupled with short-term restocking momentum driven by impending tariff benefits expiration, this has triggered a wave of inventory buildup across the supply chain. Nevertheless, outlooks for the second half of the year remain conservative.
Thursday 29 May 2025
Winbond braces for persistent NTD appreciation with AI and security focus
Winbond Electronics chairman Arthur Yu-Cheng Chiao predicted a long-term, possibly lifelong, appreciation of the New Taiwan dollar (NTD), citing changes in global interest rate dynamics and Taiwan's growing economic strength. Speaking at the company's annual shareholders' meeting, Chiao warned that every NT$1 appreciation against the US dollar could reduce Winbond's profits by about NT$0.05, prompting a renewed strategic focus on secure memory, artificial intelligence, and environmental sustainability.
Wednesday 28 May 2025
Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles
In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to Nvidia by the end of 2025. But as its self-imposed deadline approaches, uncertainty lingers over whether Samsung can meet the rigorous performance standards set by its most critical customer.
Wednesday 28 May 2025
Hanmi engineers return to SK Hynix after US$30.7 million TCB order resolves dispute
The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor confirming the return of its engineering personnel to SK Hynix's facilities. This marks a significant thaw in the strained relationship between the two industry giants, following a month-long absence of Hanmi's engineers from SK Hynix's production lines.
Tuesday 27 May 2025
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing shortage is expected to trigger mid- to long-term disruptions in the substrate supply chain. Rising gold prices and extended lead times are already inflating costs across the NAND flash controller segment, potentially benefiting suppliers like Phison Electronics and Silicon Motion Technology through higher pricing leverage.
Tuesday 27 May 2025
CXMT to scrap DDR4 in policy-fueled pivot—DDR5 deluge may follow
ChangXin Memory Technologies (CXMT), China's top DRAM supplier, is reportedly preparing to phase out DDR4 products for server and PC use by mid-2026. As the company pivots to DDR5 and high-bandwidth memory (HBM), analysts warn the move could flood the market with next-gen DRAM, intensifying oversupply risks.
Monday 26 May 2025
Memory chip prices surge as supply constraints offset weak demand
Memory prices have climbed steadily despite sluggish end-user demand, with manufacturers expecting improved operations in the first half of 2025 and price stability through year-end as tariff exemptions drive urgent ordering.
Monday 26 May 2025
Samsung edges toward Nvidia HBM3E approval, but SK Hynix remains dominant

Samsung Electronics may clear Nvidia's certification for its 12-layer HBM3E memory, but industry sources say the achievement is unlikely to yield short-term financial gains. SK Hynix, having secured early qualification, has already locked in most of the orders and controls the supply chain.

Monday 26 May 2025
India roundup: Taiwan-India silicon ties and the global chip chessboard
Taiwan and India are deepening their industrial ties as Foxconn, Inventec, Phison, and Sino-American Silicon expand their India investments; however, TSMC had previously turned down India's offer to set up a wafer fab there.
Saturday 24 May 2025
Memory rally lifts 3Q; Team, Transcend turn to edge AI
Benefiting from tariffs and rising memory prices, customers have accelerated urgent order shipments, leading to optimistic operational growth for memory module manufacturers in the second quarter of 2025. Market prices are expected to continue climbing, with overall order visibility extending into the third quarter.
Friday 23 May 2025
Phison's aiDAPTIV+ aims to democratize AI at the edge

As the global AI boom moves from centralized cloud environments to the devices at the edge, Taiwan-based Phison Electronics — a leading supplier of NAND flash controllers — sees 2025 as the year for real-world deployment of edge AI. CEO Khein Seng Pua announced that the company's proprietary aiDAPTIV+ platform has already surpassed 200 proof-of-concept (PoC) projects, including successful pilots with all three of the world's major GPU manufacturers.

Friday 23 May 2025
Samsung launches Dual-Site 1c DRAM expansion to bolster HBM4 leadership
Samsung Electronics is doubling down on its leadership in advanced memory technology. Following its latest developments at the Pyeongtaek facility, industry sources report that Samsung also plans to establish a mass production line for sixth-generation 1c DRAM at its Hwaseong campus. Investments are slated to commence as early as the end of 2025. Industry analysts in South Korea interpret this move as a clear signal of Samsung's growing confidence in its yield improvement capabilities.
Thursday 22 May 2025
Adata and Phison join Nvidia's AI ecosystem as Computex unfolds
As the AI wave accelerates demand for advanced storage solutions, the global memory supply chain is mobilizing at full speed. Major players are preparing to debut a host of new AI-related products at Computex 2025 in Taipei, underscoring the sector's critical role in powering the future of AI.
Thursday 22 May 2025
WPG Holdings turns to LaaS to drive growth beyond chip distribution

As shifting tariffs and geopolitical tensions reshape the global tech landscape, Taiwan-based WPG Holdings — Asia's largest semiconductor distributor — is adapting by rebalancing its traditional business model. In response to clients' urgent inventory buildup and manufacturing migration out of China, the company is simultaneously accelerating its transformation into a tech-enabled logistics provider through its "Logistics-as-a-Service" (LaaS) platform.

Thursday 22 May 2025
Nvidia CEO shows support for SK Hynix, praises 'beautiful' HBM4 at Computex 2025
Nvidia CEO Jensen Huang made a special visit to the SK Hynix booth at Computex 2025, leaving messages of support and showing the close cooperative relationship between the two companies.
Thursday 22 May 2025
From volume to value: Samsung retreats from legacy DRAM facing Chinese price war
Samsung Electronics has sharply reduced its memory chip production—by more than 100 billion units in a year—raising eyebrows across South Korea's tech industry. The unexpected drop, revealed in the company's latest quarterly report, signals a strategic pivot amid intensifying price competition from Chinese rivals.
Thursday 22 May 2025
YMTC participates virtually at Computex after visa setback

Yangtze Memory Technologies Co. (YMTC), China's leading NAND flash memory manufacturer, was poised to make its debut appearance at Computex 2025. However, plans were disrupted when Taiwan's Ministry of Foreign Affairs denied visa applications for YMTC personnel, forcing the company to participate virtually through the official Computex online platform.

Tuesday 20 May 2025
SK Hynix places orders for HBM equipment with Hanwha Semitech and Hanmi Semiconductor amid patent disputes
South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor, signaling a strategic push to expand its high-bandwidth memory (HBM) manufacturing capabilities.
Tuesday 20 May 2025
Apple reportedly eyes major iPhone overhaul by 2027 as pressure of innovation grows
As Apple marks the 20th anniversary of the iPhone in 2025, the tech giant is preparing for sweeping technological upgrades to its flagship product—some of which may not fully arrive until 2027 as the company is now under increasing pressure to reinvent the iPhone and reclaim its innovation edge.
Tuesday 20 May 2025
DRAM prices surge in AI Boom; Samsung and SK Hynix set to benefit

The global surge in DRAM prices, combined with the increasing momentum of artificial intelligence (AI) development in the Middle East, positions South Korea's memory chip giants—Samsung Electronics and SK Hynix—to benefit significantly from the renewed growth in the semiconductor sector. With both companies at the forefront of this market shift, they are set to capitalize on the rising demand for advanced memory solutions driven by AI innovations and broader technological trends.

Monday 19 May 2025
Phison builds NAND stockpile, accelerates three-pronged AI storage push in SEA and India
Phison Electronics Corp. expects robust growth in the second half of 2025, driven by tighter NAND flash supply and surging demand for its controller chips. The easing of US-China trade tensions and recent tariff reductions between the world's two largest economies have spurred system vendors to accelerate orders and shipments, particularly in May and June.
Monday 19 May 2025
South Korea intercepts SK Hynix HBM China-bound tech leak
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory (HBM) packaging technology to China. The suspect, identified as Mr. Kim, was apprehended moments before boarding his flight.
Monday 19 May 2025
Middle East key to extending cloud AI peripheral chip market growth by two years
US President Donald Trump recently led a large delegation of American companies to the Middle East for various political and business cooperation agreements. Reports indicate that Nvidia CEO Jensen Huang, who was originally scheduled to arrive in Taiwan a week early to prepare for Computex 2025, instead accompanied Trump's investment delegation to Saudi Arabia, where they secured a significant new order for AI chips.
Monday 19 May 2025
AI windfall lifts Kioxia to record highs, but NAND headwinds loom into 2025
Japanese NAND flash memory maker Kioxia reported a sharp earnings rebound for fiscal 2024 (April 2024 to March 2025), recording a net profit of JPY272.3 billion (approx. USD 1.9 billion) after a net loss of JPY243.73 billion the year prior.
Sunday 18 May 2025
Western Digital, Foxconn launch high-density TOR switch with embedded NVMe storage
Western Digital and Ingrasys Technology, a Foxconn subsidiary, unveiled a strategic partnership on May 15 to debut a next-generation top-of-rack (TOR) switch featuring embedded storage. The new TOR Ethernet Bunch of Flash (EBOF) system delivers distributed storage at the network edge, helping cut latency, reduce dependency on standalone storage networks, and ease traffic from centralized storage arrays.
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