Nvidia has reportedly requested Samsung Electronics Co. to significantly expand its procurement of GDDR7 graphics memory, a move expected to enhance Samsung's memory business revenue. South Korean sources indicate that while Samsung currently trails in supplying fifth-generation high bandwidth memory (HBM3E), its exclusive GDDR7 supply and mass production capabilities could help secure its position in Nvidia's upcoming sixth-generation HBM (HBM4).
By September 2025, half-year earnings reports from 10 Chinese memory firms are in. Nine posted revenue growth, underscoring solid top-line momentum. Profitability, however, diverged sharply: companies could generate sales but struggled to convert them into lasting profits.
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON Taiwan 2025, the South Korean company debuted its "2.5D big-die TC/FC bonder," designed for AI chips and capable of packaging interposers up to 120mm x 120mm—over six times larger than conventional semiconductor sizes.
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to debut in early 2026.
Winbond Electronics has implemented significant price increases for its DDR4 DRAM products beginning in the third quarter of 2025, with contract prices for the fourth quarter finalized after cumulative hikes of 80% to 90% since the second quarter price bottom. The company anticipates its DDR4 operations will reach yearly peak performance in the fourth quarter of 2025, driven largely by strong demand for the DDR4 4Gb product variant.
Phison Electronics posted consolidated revenue of NT$5.934 billion (approx. US$195.7 million) for August 2025, marking a 4.3% increase from July and a 23% rise year-over-year, reaching a historical high for the month. The cumulative revenue from January to August 2025 hit NT$43.35 billion, also setting a new record.
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South Korean outlet Business Post reported that CXMT may start mass production of HBM3E as early as 2026, far ahead of expectations, underscoring how quickly the company is closing the gap with its South Korean competitors.
Recent reports indicate that Samsung Electronics is restarting construction on parts of its P4 and P5 fabs to accelerate advanced DRAM mass production. SK Hynix is also reportedly expanding DRAM production capacity in South Korea, with plans to complete its Cheongju plant by the fourth quarter of 2025.
AP Memory has announced that its new generation PSRAM, known as ApSRAM (Attached-pSRAM), has completed customer platform validation and is slated for mass production by the end of 2025. The company highlighted the product's suitability for edge computing and Internet of Things (IoT) applications.
Yangtze Memory Technologies (YMTC) officially registered its Phase III unit, Changcun Phase III (Wuhan) Integrated Circuit, on September 5. The company has not disclosed details on investment, technology roadmap, or capacity, but the move indicates YMTC is preparing for fresh expansion. Market speculation continues over whether the initiative signals a push into the DRAM segment.
YMTC, China's leading NAND flash producer, has unveiled a US$2.9 billion Phase III venture in Wuhan, signaling its determination to scale up capacity and sharpen its edge in next-generation memory chips. The move not only underscores Beijing's backing of a national champion but also raises the stakes in the intensifying global memory race.
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The three major memory manufacturers are treating advanced memory technologies as a primary battleground, with customized HBM emerging as a key strategic focus.
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position. Micron Technology reports its 2026 HBM output is already sold out, underscoring the company's confidence in its market position as demand intensifies.
Nvidia has reportedly placed an order with Samsung Electronics for GDDR7 graphics memory, with the supply volume doubling compared to previous orders. Samsung's GDDR7 was previously used in the China-market-specific AI accelerator B40, drawing significant attention to the ongoing collaboration between Samsung and Nvidia.
The US is proposing annual approvals for exports of chipmaking supplies to Samsung Electronics and SK Hynix's factories in China, a compromise aimed at preventing disruptions to the global electronics industry after Trump officials revoked Biden-era waivers that let the companies more easily get such shipments.
SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies across 4,100 booths. The event is projected to attract more than 100,000 visitors, setting a new record in scale.
Rebellions, a rising South Korean AI chipmaker, has become a focal point in the rivalry between Samsung Electronics and SK Hynix as the two giants compete for leadership in next-generation semiconductors, putting the startup's strategy under intense scrutiny.
Micron Technology is rumored to be significantly increasing its share of low-power DRAM supply for Samsung Electronics' Galaxy S series smartphones. South Korean industry insiders believe that if Micron becomes the largest DRAM supplier for the Galaxy S series, Samsung's own semiconductor and Device Solutions (DS) division will face reduced DRAM supply volume. This potential shift is raising concerns among market watchers.
South Korea's multi-chip packaging (MCP) exports continued to climb sharply in August 2025, with the share of high-bandwidth memory (HBM) exports to Taiwan steadily increasing.
SanDisk is spearheading a fresh round of NAND flash price hikes, issuing an exclusive notice of a 10% increase across all channels and consumer products starting September 4. The decision comes as supply tightens and demand from AI servers and enterprise storage accelerates. Industry sources told DIGITIMES Asia this marks the opening salvo in a new pricing cycle, with rival chipmakers widely expected to follow. SanDisk said further adjustments are under review for the coming quarters.
Broadcom CEO Hock Tan revealed the company has landed a US$10 billion order from a mystery customer, which insiders now identify as OpenAI. The two firms are developing OpenAI's first custom artificial intelligence (AI) processor, scheduled to enter mass production in 2026.
While geopolitical tensions push many companies away from China, South Korean chip equipment maker Nextin is doubling down with a new factory in Wuxi, betting big on a market that generates over 80% of its revenue.
