Samsung Electronics on January 16 announced payout ratios for its 2025 excess profit performance incentive, with the Device Solutions (DS) division set to receive bonuses equivalent to 47% of annual base salary. The level represents a sharp rebound from 14% for 2024 and zero in 2023.
SK Hynix has reportedly finished converting its key DRAM production facility in Wuxi, China, to the fourth-generation 1a process. The company reached the manufacturing milestone despite US export controls that limit exports of advanced semiconductor equipment to China.
Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant to Micron Technology, confirming that the transaction is paired with a broader cooperation framework that includes prepaid reservations for high-bandwidth memory (HBM) back-end wafer manufacturing capacity.
Micron Technology and Powerchip Semiconductor Manufacturing Corporation have reached a preliminary agreement under which Micron will acquire PSMC's Tongluo fabrication assets for US$1.8bn.
Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing expansion even as executives warn that new capacity will take years to meaningfully ease tight conditions in the global memory market.
