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Tuesday 16 December 2025
Samsung Chairman Lee Jae-yong meets with Lisa Su and Elon Musk to discuss potential collaboration
Samsung Electronics Chairman Lee Jae-yong has returned to South Korea after a week-long business trip to the US. Lee reportedly met with Tesla CEO Elon Musk in Austin, Texas, with senior executives of Samsung's foundry division also present. It is also rumored that Lee met with AMD CEO Lisa Su to discuss HBM supply and foundry orders using advanced 2-nanometer process technology. These efforts are considered tactics to help Samsung regain leadership in AI semiconductors.
Tuesday 16 December 2025
Samsung nears deal to supply over 30% of Nvidia's HBM4 memory in 2026
Samsung Electronics is close to finalizing negotiations with Nvidia to supply more than 30% of its sixth-generation high-bandwidth memory (HBM4) for 2026, aiming to regain market share after setbacks with HBM3E.
Tuesday 16 December 2025
Samsung steadies 12-Layer HBM3E, eyes larger Google TPU orders
Samsung Electronics has reportedly stabilized the performance of its 12-layer high-bandwidth memory, a development that could allow the company to expand shipments to Google's artificial intelligence accelerators as competition intensifies in the market for advanced memory used in AI chips, according to South Korean media.
Tuesday 16 December 2025
China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US and its allies use stringent export controls to reshape the advanced node industry order, China's semiconductor industry is aggressively pursuing self-sufficiency across equipment, materials, and processes to mitigate reliance on foreign suppliers.
Tuesday 16 December 2025
Acer CEO urges firms to boost resilience amid memory price surge
Acer chairman and CEO Jason Chen has pointed out that soaring memory prices have triggered ripple effects across the market, driving up costs and retail prices, which in turn impact demand.
Tuesday 16 December 2025
Apple braces for DRAM cost surge as Korean suppliers reprice contracts
Apple is facing renewed cost pressure as its long-term DRAM supply contracts with South Korean memory makers approach expiry in January 2026, heightening concerns that higher component costs could spill over into its next generation of devices.
Tuesday 16 December 2025
Smartphone industry faces cost challenges in 2026 amid memory shortages and rising prices
The smartphone industry is facing considerable cost challenges in 2026 amid ongoing memory supply shortages and rising prices. This situation is expected to lead to a 1.6% decrease in annual shipments, a shift from the earlier forecast of 2.8% growth made in September, according to DIGITIMES analyst Luke Lin.
Tuesday 16 December 2025
Notebook market may see second consecutive year of seasonal demand distortion in 2026
The notebook market is expected to encounter an unusual shift in seasonal demand for a second consecutive year, with 2026 poised to replicate the disruption seen in 2025. While geopolitical tensions drove the initial reversal in 2025, industry insiders attribute the 2026 distortion mainly to rising memory prices, which are prompting enterprise buyers to accelerate purchases.
Monday 15 December 2025
SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations for HBM4, underscoring both the strategic importance of advanced packaging equipment and rising complexity in the TC bonder supply chain amid a patent dispute between South Korean rivals Hanmi Semiconductor and Hanwha Semitech. The move reflects SK Hynix's broader push to diversify critical equipment suppliers while aligning with Nvidia's next-generation AI roadmap.

Monday 15 December 2025
SK Hynix leads Samsung by 3-4 months, begins supplying paid HBM4 samples
Latest media reports state that SK Hynix has completed the final verification phase for customer samples of its 12-layer sixth-generation high-bandwidth memory (HBM4) prior to mass production. The Korea Herald reported that SK Hynix has effectively entered the mass production process for its 12-layer HBM4 products and is supplying customers with more than 20,000–30,000 paid HBM4 samples. After establishing a global 12-layer HBM4 mass production system in September 2025, SK Hynix finalized a 2026 HBM4 supply contract with Nvidia and has begun production, according to Deal Site and other South Korean media. Meanwhile, Samsung Electronics is approximately three to four months behind schedule.
Monday 15 December 2025
HDD prices see largest increase in eight quarters, with surging demand in China and US markets
The traditional hard disk drive (HDD) market experienced a rare sharp price surge in recent years. In contract price negotiations for the fourth quarter of 2025, HDD product prices were finalized with a quarter-over-quarter increase of approximately 4%, marking the highest growth rate in the past eight quarters.
Monday 15 December 2025
TSMC, Broadcom AI outlook signals strong growth for Samsung, SK Hynix in 2026
Analysts believe that the performance outlook for 2026 from Taiwan Semiconductor Manufacturing Company (TSMC) and Broadcom offers a glimpse into the expected performance of South Korea's two semiconductor leaders, Samsung Electronics and SK Hynix.
Monday 15 December 2025
Weekly news roundup: TSMC pauses Japan fab plans, Tesla Powerwall demand rises in Taiwan, Huawei flags AI oversupply risks
These are the most-read DIGITIMES Asia stories in the week of December 8 to December 14, 2025.
Monday 15 December 2025
NetApp unfazed by memory shortages as it projects strong 2026 growth

NetApp Taiwan general manager Peter Chu said the transition from early AI experimentation to agentic AI running mission-critical workloads is creating unprecedented demands on data complexity, scale, and security, while presenting significant opportunities for NetApp. He remains optimistic about the company's 2026 trajectory and noted that global memory shortages have not affected its operations.

Monday 15 December 2025
Micron's DDR5 outsourcing ramp redraws memory packaging trajectories through 2026
Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output. This is fueling continued growth in outsourced packaging and testing (OSAT) and underpinning an unusually strong fourth quarter of 2025, with visibility now stretching well into the second half of 2026.
Monday 15 December 2025
SK Hynix reportedly eyes low-power DRAM foundry to fend off China memory surge
SK Hynix's rumored plan to enter low-power DRAM contract manufacturing for the first time is drawing industry attention, amid speculation that the move is driven by intensifying competition from China's fast-advancing memory suppliers. The shift could have ripple effects for Taiwanese foundries that currently handle much of South Korea's fabless memory output.
Friday 12 December 2025
Huawei and YMTC expand into South Korea’s consumer SSD market following Micron’s exit

Huawei is moving to capitalize on a tightening consumer solid-state drive (SSD) market in South Korea, introducing new products this month as established suppliers raise prices and Micron prepares to exit the segment. The shift, driven by surging demand for enterprise products supporting artificial intelligence (AI) data centers, is pushing South Korean PC makers to seek alternative suppliers, potentially opening the door for Chinese brands.

Friday 12 December 2025
Phison sets 3 supply strategies amid NAND shortage and wafer price surge
Cloud giants' aggressive procurement of high-capacity enterprise SSDs has triggered a structural shortage and price surge in the NAND Flash market. In China, spot prices for 512Gb and larger NAND chips rose more than 100% in fourth quarter 2025, with NAND manufacturers maintaining their stance on further price hikes.
Friday 12 December 2025
Advantest unveils next-gen memory handler for AI, targets customer rollout in 2Q26
Japanese semiconductor test equipment manufacturer Advantest has announced the launch of a next-generation memory handler, designed specifically for high-performance memory components used in artificial intelligence (AI) applications. The product has already attracted interest from several major memory makers and is slated to begin shipments in the second quarter of 2026, meeting customer demands for performance, automation, and cost efficiency.
Friday 12 December 2025
Huawei–SMIC chip hits milestone, still lags TSMC’s 5nm

China is accelerating its semiconductor capabilities through technical gains at Huawei and Semiconductor Manufacturing International Corp.(SMIC) while simultaneously mandating the use of domestic processors across state sectors to circumvent US export controls.

Friday 12 December 2025
Samsung reportedly accelerates Pyeongtaek expansion to ramp up HBM4 and 1c DRAM production

Samsung Electronics is reportedly accelerating construction at its Pyeongtaek semiconductor complex to expand production of next-generation high-bandwidth memory, aiming to secure supply for global cloud providers and AI chipmakers as demand intensifies. The company has reportedly approved plans to convert additional space in its P4 fab into dedicated 1c DRAM lines and has advanced completion dates for key production zones, according to Korean media reports.

Friday 12 December 2025
Samsung's TM Roh to reportedly hold surprise CES meeting with Micron CEO on DRAM supply
Samsung Electronics is reportedly preparing for urgent negotiations with Micron Technology at CES 2026 in Las Vegas, as surging mobile DRAM prices and tightening supply threaten to disrupt production plans for the upcoming Galaxy S26, according to South Korean media reports.
Thursday 11 December 2025
AI boom drives memory surge: squeezes Switch 2 margins, pushes up PC prices
Nintendo's stock price has fallen by 20% since reaching a recent peak in August 2025, mainly due to the artificial intelligence (AI) surge that pushed memory prices used in the Nintendo Switch 2 gaming console up by 40%, putting significant pressure on its profit margins. In response to the rapidly increasing semiconductor demand driven by AI infrastructure expansion, the electronics and home appliance supply chains have also started feeling noticeable impacts.
Thursday 11 December 2025
South Korea targets new fabs, HBM leadership, fabless revamp in US$468bn chip push
South Korea has unveiled an expansive semiconductor strategy to secure its lead in next-generation memory and revive weaker segments such as logic chips and the domestic fabless sector. President Lee Jae-myung chaired a high-level government meeting with Samsung Electronics, SK Hynix, and policymakers, underscoring the urgency of reinforcing national competitiveness as global demand for AI semiconductors surges.
Thursday 11 December 2025
SK Hynix reaps largest benefits from H200 export approval
US President Donald Trump has allowed Nvidia's H200 chips to be exported to China, benefiting Samsung Electronics and SK Hynix. iNews24 and IT Chosun reported that with the high likelihood that Chinese AI companies will see increased chip demand, the US easing of restrictions is expected to boost H200 shipments. SK Hynix is reportedly the primary supplier of the fifth-generation high-bandwidth memory (HBM3E) used in the H200, meaning its supply volume will inevitably rise, making it the biggest beneficiary.