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Friday 2 January 2026

Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests

Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen the company's position in the race to supply memory for next-generation artificial intelligence accelerators.

Friday 2 January 2026

China's CXMT moves toward IPO with global DRAM share nearing 4%

China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass the 4% threshold in the near term, according to its IPO prospectus and market estimates. The move comes as the company accelerates capacity expansion and technology upgrades to close the gap with industry leaders Samsung Electronics, SK Hynix, and Micron Technology in a market dominated by a handful of suppliers.

Friday 2 January 2026

Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition

Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds that are approximately 30% faster than current mass-produced offerings. Industry observers believe Samsung aims to leverage higher-speed DRAM to meet customers' growing memory demands in servers, computers, and artificial intelligence (AI) environments, further solidifying its position as the world's leading DRAM supplier.

Friday 2 January 2026

Samsung aims for 2026 HBM4 mass production after customer validation

Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant seeks to reclaim its lead in the competitive artificial intelligence hardware market.

Friday 2 January 2026

Smartphones and notebook prices could increase as memory lead times extend

Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and SK Hynix, the supply of HBM for AI servers remains tight, and the demand from large chipmakers is difficult to satisfy immediately. IC distributors report that lead times from memory manufacturers have now extended to 52 weeks. With priority allocation given to large clients, almost no stock is available. Both distributors and customers must now pay upfront and wait in line for delivery.

Friday 2 January 2026

SanDisk, Micron vie for PSMC's Tongluo fab capacity

Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo, Taiwan. PSMC's fate for the facility is expected to be finalized soon as participants weigh their options.

Friday 2 January 2026

South Korea's semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies

South Korea's ruling and opposition parties have reached a preliminary consensus on the Semiconductor Special Act, though its passage may be delayed until 2026, and the law faces criticism for offering comparatively weak support measures against competing countries.

Friday 2 January 2026

2026 electronics industry outlook

As 2026 begins, DIGITIMES has conducted in-depth analyses of sectors within the electronics industry. The current landscape theme can be described as "one core, two keys, three drivers." The core, semiconductors, has two keys —the satellite industry and memory— and will be driven by three factors: AI servers, defense, and green energy. These areas will be critical to watch in 2026.

Friday 2 January 2026

Server ODMs remain bullish through the end of 2026 despite bubble concerns

Although AI bubble concerns persist, server ODMs remain optimistic about 2026. Nvidia's GB300 began shipping in the fourth quarter of 2025, and the new Vera Rubin architecture expected in 2026 should be able to take over smoothly. However, the Vera Rubin Ultra is slated to debut in 2027, which will involve a major overhaul of rack architecture and pose a significant challenge.

Friday 2 January 2026

Samsung raises 2025 bonuses for DS division amid memory boom

Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).

Wednesday 31 December 2025

Samsung reportedly poised to clear KRW20 trillion profit mark in 4Q25

Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial intelligence infrastructure lifts memory chip prices. The reports, compiled by South Korean outlets including Korea Economic Daily and EBN and citing industry sources, said Samsung's preliminary fourth-quarter operating profit is expected to exceed KRW20 trillion, a level that would mark the first time a South Korean company has crossed that threshold in a single quarter.

Wednesday 31 December 2025

China's CXMT eyes US$4.2B Shanghai IPO to fuel memory chip expansion

China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion) through an IPO in Shanghai, as it looks to upgrade production lines and expand development of advanced memory technologies.

Wednesday 31 December 2025

Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according to South Korean media outlet ET News, as the company secures key technical milestones with major AI customers.

Wednesday 31 December 2025

YMTC goes full speed toward HBF next

Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology. Their Xtacking architecture evolution supports integration with AI accelerators, addressing capacity and cost challenges beyond traditional HBM.

Wednesday 31 December 2025

Weblink bets on memory price surge and AI server boom for double-digit growth in 2026

Taiwan-based tech products distributor Weblink International is riding a surge in memory prices and robust demand for AI servers, positioning the company for strong growth in 2026. President Dave Lin said both segments continue to face supply constraints, but remain among Weblink's most promising growth drivers.

Wednesday 31 December 2025

Asustek announces price hike from January 5 amid soaring memory costs

Facing severe memory shortages and rapidly rising prices, global PC brands are implementing strategies to offset cost pressures, including price increases or maintaining prices with downgraded specifications. Channel partners point out that memory accounts for nearly 20% of a PC's total bill of materials (BOM), and recent sharp hikes in memory prices have forced many vendors to quietly adjust their PC pricing.

Wednesday 31 December 2025

US ITC opens patent probe into advanced memory

The US International Trade Commission (ITC) has formally launched a Section 337 investigation into alleged patent infringement involving advanced memory products, naming Samsung Electronics, Google, and Supermicro among the respondents in a case that could have significant implications for the global DRAM and AI server supply chain.

Wednesday 31 December 2025

YMTC pushes for equipment localization despite elusive profitability

As China's leading 3D NAND maker, Yangtze Memory Technologies (YMTC) has recently been regarded as the most aggressive company in promoting the adoption of domestic equipment. Its Phase III fab is even striving to build a purely all-domestic-equipment wafer production line.

Wednesday 31 December 2025

The chip industry in 2025: Boom, rivalry, and a fragile new order

In 2025, generative AI investments are reshaping the global semiconductor industry. Nvidia, TSMC, and their supply chains emerge as the biggest winners. But the boom brings new challenges. Rising competition in AI chips threatens a market bubble. Meanwhile, China accelerates its push for self-reliance as US export restrictions tighten. The DIGITIMES news team highlights the year's defining trends.

Wednesday 31 December 2025

Samsung faces scrutiny over Taiwan probe, denies memory market ties

Samsung Electronics has expanded an internal investigation into alleged employee misconduct at its Taiwan subsidiary, a move the company characterizes as an isolated matter despite its timing amid a global tightening of memory chip supplies. The probe, which stems from a routine internal audit, focuses on suspected kickbacks involving a limited number of staff and predates the current first quarter of the 2025 fiscal year, according to reporting from DIGITIMES and industry sources in South Korea.

Tuesday 30 December 2025

Top tech topics in 2025 (1): a year of strategic realignment for global semiconductors

As 2025 draws to a close, the global semiconductor industry has undergone a fundamental transformation marked by heightened geopolitical tensions, supply chain restructuring, and an unprecedented surge in AI-driven demand. What distinguishes this year from previous cycles is the shift from aspirational roadmaps to hard-edged execution, where manufacturers must deliver not just technological advancement but reliable, scalable production under increasingly complex constraints.

Tuesday 30 December 2025

South Korea charts road to 0.2nm chips by 2040

The global semiconductor industry is poised to enter the "angstrom era" by 2040 as circuit dimensions shrink to one-tenth of current levels, according to a long-term technology roadmap from the Korean Institute of Semiconductor Engineers. The report suggests that transistor dimensions will push far beyond today's nm scale, forcing fundamental shifts in chip design as traditional scaling reaches its physical limits.

Tuesday 30 December 2025

DDR4 spot prices surge 18-fold in a year; December demand cools but impact limited

Memory chip spot prices have witnessed unprecedented increases over the past year, driven by continuing shortages and supply chain adjustments. DDR4 16Gb modules have surged 18 times in price since the end of 2024, marking one of the steepest rises in recent memory market. Despite a modest cooling in buying activity toward the end of 2025, market observers anticipate that the strong upward pricing trend will persist well into 2026.

Tuesday 30 December 2025

Four major companies get priority from memory suppliers as shortage hits PC brands

Memory prices are soaring as much as four to five times year-over-year. PC brand vendors that were originally expected to gradually finalize supply contracts with memory makers by the end of the third quarter of 2025 have, as of year-end, not had a single contract fully signed. Suppliers are tight on supply and unwilling to sign, and prices are also lacking consensus. Memory makers still have capacity, but demand far exceeds supply. Therefore, brand vendors must rely on their own capabilities. In facing this tough situation, the supply chain reports that memory makers are giving priority to Apple, Lenovo, Asus, and Dell.

Monday 29 December 2025

Taiwan quake hits chip fabs, but Nanya says operations largely unaffected

A magnitude-7.0 earthquake struck offshore Yilan late on December 27, 2025, rattling northern Taiwan. The quake prompted precautionary shutdowns across Hsinchu Science Park. Several chipmakers activated emergency protocols. But Nanya Technology Corporation said on December 29, 2025, that the impact on its operations and finances was minimal. The update eased concerns over potential memory supply disruptions.

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