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Wednesday 22 July 2026
Nvidia's Huang to meet Samsung, SK and Naver chiefs in Silicon Valley, reports say
Samsung Electronics executive chairman Lee Jae-yong, SK Group chairman Chey Tae-won and Naver founder and board chairman Lee Hae-jin are reportedly preparing to meet Nvidia CEO Jensen Huang near Silicon Valley, with a roundtable tentatively planned for July 24.
Wednesday 22 July 2026
GigaDevice injects another CNY500M into DRAM subsidiary as memory market boom lifts performance

Chinese chip designer GigaDevice is investing another CNY500 million (approx. US$73.9 million) into its wholly owned subsidiary to support its DRAM research and industrialization project, continuing a series of capital injections aimed at expanding its memory business.

Wednesday 22 July 2026
SK Hynix denies report it is pursuing deal for Intel's Ohio fab

SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor site in New Albany, Ohio, denying a JoongAng Ilbo report that the companies were negotiating over the campus.

Wednesday 22 July 2026
Memory price surge may soften 2026 smartphone shipment declines

Rising memory prices and higher costs for other key upstream components are forcing smartphone brands to reduce mid- and low-end models this year, but handset makers said the demand hit may not be as severe as expected. Industry players said global smartphone shipments could still fall in 2026, though the decline may narrow to a single-digit percentage as higher average selling prices lift total sales value.

Wednesday 22 July 2026
Xiaomi raises 2026 phone target as memory prices strain brands
China's smartphone market is seeing a shift in demand trends. Xiaomi has reportedly raised its full-year 2026 smartphone shipment target from about 90 million units to 110 million, a roughly 16% increase, as the company expects consumer memory prices to be near a sustainable peak and close to reversing.
Wednesday 22 July 2026
Samsung expands Nvidia ties as AI inference drives NAND demand
Samsung Electronics is expanding its Nvidia relationship into NAND flash as AI inference creates demand for high-capacity enterprise storage.
Wednesday 22 July 2026
Memory shortage to worsen in 2027 as AI inference strains supply, Silicon Motion CEO says
The global memory shortage will worsen in 2027 and may not begin to ease until the second half of 2028, with prices likely to remain elevated for the next two to three years, according to Wallace Kou, president and CEO of Silicon Motion.
Tuesday 21 July 2026
Goldkey secures NT$3.6 billion loan to expand AI server memory business
Goldkey Technology has completed and signed a three-year syndicated loan worth NT$3.6 billion (US$111.3 million) to support inventory growth and working capital needs tied to AI servers and other high-demand markets. The Taiwan memory module maker said the financing will also back materials purchases as it prepares to expand its high-end RDIMM business in the second half of 2026.
Tuesday 21 July 2026
Power and water constraints cast doubt on South Korea's Honam memory cluster, experts say
South Korea's plan to develop a semiconductor cluster in the Honam region (Jeolla Province) is facing mounting scrutiny over whether the area can support the enormous energy and infrastructure requirements of advanced memory manufacturing.
Tuesday 21 July 2026
Samsung, SK Hynix and Micron pull back on in-house CXL controller plans

Samsung Electronics, SK Hynix and Micron Technology are reportedly scaling back or shelving plans to commercialize internally developed Compute Express Link (CXL) controller chips, shifting more controller work to specialist fabless suppliers while continuing to develop CXL-based memory products.

Tuesday 21 July 2026
DDR5 module spot prices hit record highs as China-made dies narrow price gap
The pace of memory contract price increases has begun to slow in the second half of 2026, but DDR5 spot prices continue to climb as AI and server applications absorb available supply, according to industry sources.
Tuesday 21 July 2026
Phone prices to surge in 2H26 as low-end models fade

As the AI boom keeps memory shortages running hot, steep price hikes for smartphones in the second half of 2026 are coming into view. Global market researchers have issued increasingly bleak forecasts, warning that "chipflation" could last through 2027 and that surging memory prices are already lifting the cost of consumer devices.

Tuesday 21 July 2026
Niche demand drives SLC NAND prices up nearly tenfold, opening further gains for Taiwan suppliers
Memory price increases have begun to diverge in the second half of 2026, but persistent capacity shortfalls continue to constrain supply and sustain upward momentum in contract prices.
Tuesday 21 July 2026
Memory shortage could turn into a glut by 2028 as chipmakers expand

A powerful rally in memory-chip stocks has stalled as investors reconsider whether record spending on AI data centers could eventually push the DRAM market back into oversupply.

Tuesday 21 July 2026
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other conventional memory products while maintaining high-bandwidth memory (HBM) volumes already committed to customers.

Tuesday 21 July 2026
Samsung could overtake SK Hynix in the HBM market by 2027
Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money Today and Financial News.
Monday 20 July 2026
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major memory makers over stable mass production and supply. Industry sources say the next wave of high-capacity HBM will be decided by one core issue: how effectively vendors solve heat dissipation.
Monday 20 July 2026
Samsung to cut over 800 US jobs amid market headwinds

Samsung Electronics is cutting over 800 jobs in the US from its smartphone, display, and consumer electronics business units. The division, part of Samsung Group, is facing a challenging market this year, in contrast to the soaring performance of its chip unit.

Monday 20 July 2026
Memory is becoming a national security priority, SK chair warns

The global scramble for AI memory is fast becoming a matter of national economic security, with governments intervening in supply and Chinese newcomers such as ChangXin Memory Technologies (CXMT) emerging as a credible alternative to incumbent leaders.

Monday 20 July 2026
Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved China can manufacture DRAM, the memory chip maker must now compete directly with Samsung Electronics, SK Hynix, and Micron in the global memory market.

Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory capacity while raising a broader question about what is driving one of the industry's most aggressive fab expansion strategies.

Monday 20 July 2026
Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access, with governments and suppliers tightening control across the stack. Below are the most-read DIGITIMES stories from the week of July 13-19, 2026.

Monday 20 July 2026
Networking demand remains resilient, but component shortages threaten shipment schedules

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry enters the second half of 2026, supplies of key components—including memory, printed circuit boards (PCBs) and passive components—remain tight, with lead times extending significantly.

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing network following its A-share subscription on July 16. The moves have placed its capacity expansion and next-generation memory roadmap under closer scrutiny from the industry.

Monday 20 July 2026
Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon wafers and critical materials. Micron and GlobalWafers recently announced a 10-year agreement, with Micron also providing US$500 million in support, marking the longest and potentially largest long-term supply agreement in GlobalWafers' history.