ASE Technology Holding is a provider of semiconductor assembling and test manufacturing services. Its business operations include front-end chip testing, processes from wafer probing to back-end packaging, as well as tests for materials and finished products. It is the world's largest semiconductor packaging and testing services provider. ASE Technology Holding provides a variety of advanced packaging and manufacturing technologies, such as the 2.5D & 3D technologies, fan-out packaging, heterogeneous integration, embedded packaging, micro-electro-mechanical systems and sensors packaging. The company's packaging services cover flip chip packaging, ball grid arrays, leadframe packaging, wafer level packaging and more.