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30 Jul 2003

WorldCom hires firm for internal probe

Japan's equipment B/B ratio hits 1.57, says report

Applied Materials says customers wary on spending

Infineon unit seeks automotive driver's seat

Leopard spots an opportunity in 'hybrid' chips

Tatung standardizes on Pixelworks ImageProcessor architecture for four new plasma televisions

ST Assembly edges closer to profit with small 2Q loss

Solaris gets open-source update

AMD drops chip prices

Court dismisses lawsuit against Intel

Red Hat releases high-end Linux beta

Hynix rolls out DDR500 SDRAM

Amkor reports loss despite higher sales

Toshiba invests in M-Systems, licenses IP (Jul 30)

Vodafone growing at a million new customers per month (Jul 30)

Sony hand-held PlayStation offers wireless network (Jul 30)

Nokia, chipmakers form alliance to speed design (Jul 30)

Will form Mobile Industry Processor Interface (MIPI) Alliance

29 Jul 2003

Telefonica surges into profit after costly restructuring (July 29)

India's mobile phone industry grows 51% (July 29)

TI, ST team up in mobile chip pact (July 29)

Loss of e-mail 'worse than divorce' (July 29)

WorldCom 'accused of dumping calls'

Taiwan's large-size LCD panel volume hits 8M in Q2 '03

Wall Street to Nose Up Before Data

TI says Japan market important for firm's further growth

TI says telecoms market to worsen, but rebound near

China to become Korea's largest export market (Jul 29)

Rambus chips net PCI Express win

IC inventories fall in 2Q over 1Q, says iSuppli

Semico revises foundry forecast for '03, '04

Dell announces fix for handheld glitch (Jul 28)

Hong Kong firm offers 'Chinese' CPU for Linux PCs

Nvidia cuts forecast, blames 130nm foundry costs

Intel threatens Broadcom stronghold (Jul 28)

Infineon announces billion-dollar 'back-end' plant

Race is on for mobile graphics

JEDEC to explore buffered DDR2 DIMM for servers

DRAM futures trading stages a comeback

TI sees US$15 million restructuring charge in 4Q

1427/1505 pages

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