The Transport Department has given vehicle owners across Maharashtra one final window to upgrade their old number plates. Any car or bike registered before 1 April 2019 must display a High Security Registration Plate (HSRP) before 15 August 2025. From 16 August onward, authority teams may start the inspection across the state, and officials have made it clear that no further extensions will follow. The directive applies to roughly 2.10 crore vehicles, yet only about 23 lakh have switched so far. That gap is large enough for authorities to issue a firm warning that no further extensions will be issued. Read on to learn more about the compliance and the process.Why does HSRP matter?HSRP is more than just a new number plate. It carries built-in security elements that help curb fraud and theft.*Chromium hologram: A small Ashoka Chakra symbol in the top-left corner shatters if anyone tries to peel the plate away.*Laser-etched code: A unique string of numbers links the plate to the central vehicle register, making cloning extremely difficult.*Snap locks: Special rivets break on the first attempt at removal, so a swapped plate cannot be reused without visible damage.Extension timelineThe Transport Department has already relaxed the schedule three times. The order originally announced 31 March 2025 as the cut-off, then shifted to the end of April, later to the end of June, and now to 15 August 2025. Officials say this is the last extension for the HSRP Maharashtra. A confirmed booking made before the deadline counts as proof of intent even if the fitting slot falls afterwards, shielding you from penalties.Risks of Missing the 15 August Cut-offThe following may be the key consequences of negligence:*Fines or seizures under the Motor Vehicles Act, once inspections begin.*Insurance complications if the vehicle is stolen or damaged; some claims may be delayed or rejected.*Lower resale value because buyers may increasingly expect a legally compliant plate.Three-step HSRP booking through ACKOHere are the key steps you will need to follow while booking your HSRP number plate online through ACKO:*Enter your registration number: Visit ACKO's HSRP page and type in the vehicle number. The portal automatically directs you to the authorised supplier for your city or district.*Add key details: On the supplier's site, fill in the engine and chassis numbers from the Registration Certificate. Choose either a centre visit or, if offered, a doorstep installation slot.*Pay and confirm: Complete the online payment, pick a time slot, and keep the confirmation message. If your chosen slot falls after 15 August, that digital receipt may protect you from fines.Tips for a smooth installation of HSRPHere are key tips for a smooth process:*Book early: Appointments fill quickly as deadlines approach.*Carry essential documents. Bring the Registration Certificate and a photo ID on installation day.*Check before you leave: Make sure the hologram is intact, the laser code matches your papers, and the plate sits straight.*Store the receipt: Keep a digital copy on your phone and a printout in the glove box until the transport database updates.Why is getting an HSRP plate immediately important?Here are the key reasons why you should act now:*Avoid penalties: Timely compliance prevents fines, seizures, and needless hassle.*Deter theft: The secure plate lowers the risk of number cloning and illegal resale.*Better slot choice: Early birds may be able to pick convenient time slots and skip long queues.Final wordChanging to an HSRP is a one-time task that usually takes less than an hour, but the benefits last for the life of the vehicle. Maharashtra's Transport Department has drawn a clear line: 15 August 2025 is the final date, and inspections start the very next morning. Book through ACKO today, lock in your HSRP plate and drive with peace of mind when enforcement begins. Waiting only invites crowded centres, higher stress, and the real risk of penalties. The most straightforward path is open right now; use it before the window closes.

Vietnam is changing fast. The country is attracting more foreign investment, especially in manufacturing and artificial intelligence (AI). Big companies from the US, Europe, and Asia are setting up factories and research centers here. This is not just about cheap labor anymore. It's about technology, skills, and new ideas.Foreign investment keeps risingIn the first five months of 2025, Vietnam pulled in over US$18 billion in foreign investment. That's a big jump from last year. Most of this money is going into factories, digital technology, and AI. Real estate is still important, but the focus is shifting. Investors want to build things, not just buy land.The government is making it easier for companies to set up shop. They're fixing rules, building better roads, and supporting new businesses. They want Vietnam to be a place where high-tech companies can grow. This is part of a bigger plan to boost the economy and create more jobs.Why companies are choosing VietnamVietnam's location helps. It's close to China, Japan, and other big markets. Labor costs are lower than in China. The country is part of several trade deals, so it's easier to export goods. These things make Vietnam attractive for companies that want to build electronics, semiconductors, and other tech products.Big names like Samsung, Intel, and Foxconn are already here. Apple is moving some of its manufacturing from China to Vietnam. Google and Meta are expanding too. Even SpaceX and the Trump Organization have announced big investments.But it's not just about foreign companies. Local firms like FPT are growing fast. They're working with global tech leaders like NVIDIA to build AI factories and train workers.AI is more than a buzzwordAI is not just a trend in Vietnam. It's becoming part of daily life and business. The government has set up a national AI strategy. They want to train more people, build research centers, and support startups. The goal is to make Vietnam a leader in AI in Southeast Asia.Vietnam now ranks 5th in ASEAN for AI readiness and 59th in the world. That's a big jump in just a few years. The country is investing in data infrastructure and encouraging universities to teach AI skills. FPT, for example, is working with NVIDIA to build an AI factory. They want 3-5% of the population working in AI in the future.Real-world AI applicationsAI is already making a difference in several areas:*Manufacturing: Factories use AI to manage supply chains, reduce waste, and improve quality. This helps them compete globally. *Healthcare: AI tools help doctors diagnose faster and more accurately. Startups are building AI systems for medical imaging and patient care. *Agriculture: Farmers use AI to monitor crops, predict weather, and manage resources. This boosts yields and cuts costs. *Education: Schools are using AI to personalize learning. Universities are launching new AI courses and research programs. *E-commerce: Online shopping is booming. AI helps companies manage logistics, recommend products, and serve customers better.The semiconductor pushSemiconductors are a big deal. Vietnam wants to be a hub for chip manufacturing, and the industry is expected to be worth over $20 billion by the end of 2025. Companies from the US, Japan, and other countries are building factories here, for example, Amkor just opened a $1.6 billion plant in Bac Ninh. The US and Vietnam have signed agreements to develop the chip industry together.Training workers is a priority. Vietnam aims to train 50,000 semiconductor professionals by 2030. FPT corporation, one of Vietnam's largest technology companies, plans to train 10,000 of them. They have set up new university programs and are working with partners from India and the UK.E-commerce and digital growthVietnam's e-commerce market is now one of the top three in Southeast Asia. In 2024, online sales are expected to hit $16 billion. More people are shopping online, using smartphones, and paying digitally. Big platforms dominate, but smaller websites and social media shops are growing too.AI is helping e-commerce companies run smoother. It's used for everything from managing warehouses to chatting with customers. Experts think AI could add up to $130 billion to Vietnam's economy by 2040, mostly through better productivity and new products.Challenges to watchVietnam's growth story is impressive, but there are real challenges.*Infrastructure: Some rural areas still lack good internet and tech access. This makes it hard for everyone to benefit from new technology. *Skills Gap: There aren't enough trained workers in AI and advanced manufacturing. More training and education are needed. *Regulation: The government is working on better rules for investment and data privacy. But it takes time to get it right. *Origin Fraud: Some companies use Vietnam as a stopover to avoid tariffs, especially from China. This can cause trade problems. The government is trying to crack down on this. *Environmental Concerns: Not all investments are good. Projects that pollute or don't meet safety standards are being watched more closely.What's next for Vietnam?Vietnam is not just a place for cheap assembly anymore. It's becoming a center for high-tech manufacturing and AI. The government, local companies, and foreign investors are all pushing in the same direction. They want to build a strong, modern economy that can compete globally.The country is setting up an international financial center to attract more investment. They are also working to make the business environment more transparent and reliable. This should help build trust and bring in more long-term partners.What Vietnam's growth means for youVietnam's rise in manufacturing and AI is real. The country is attracting more investment, building new factories, and training more people. AI is moving from buzzword to reality, with real impact in factories, hospitals, farms, and schools. The semiconductor industry is growing fast, and e-commerce is booming.But there are still hurdles. Infrastructure, skills, and regulation need more work. The government and businesses know this and are taking steps to fix it.Fusion Worldwide has an office right here in Vietnam. That means we are on the ground, ready to help you source what you need, navigate local markets, and make decisions that support your long-term goals. When you work with us, you are gaining a partner who understands the landscape, speaks the language and is invested in your success.The opportunity isn't just to react to change, but to shape your future supply chain and technology strategy. With the right support, you can turn Vietnam's momentum into your own advantage, today and for the long run.Tony Leong, Fusion Worldwide Senior Director of Business Development, Asia

With the ongoing evolution of automotive electrification and intelligence, functional safety has expanded from advanced ADAS platforms to every electronic control unit (ECU) and module component in the vehicle. Traditionally, these lower-level modules (such as lamp controllers, HVAC modules, seat adjustment modules, etc.) have not emphasized functional safety design due to cost sensitivity and relatively lower application risks.However, as vehicle manufacturers (OEMs) increasingly focus on the integration risks of entire vehicle systems, and Tier 1 suppliers gradually include ISO 26262 compliance as a key evaluation criterion during bidding, ECU and module products are facing unprecedented pressure to upgrade. Many products that were not originally designed with functional safety in mind are now required to provide evidence of safety design in order to be integrated into the overall vehicle safety architecture.For small and medium-sized module suppliers, this is both a challenge and an opportunity. Those who can quickly implement functional safety without significantly increasing development costs and timelines will be the first to gain market recognition.ISO 26262 is an international standard for the functional safety of electrical and electronic systems in road vehicles. Its primary goal is to ensure that automotive electronic and software systems do not lead to unacceptable risks in the event of a malfunction.Market Competition Shifts from Hardware to Software and Verification SupportCurrently, there is a growing number of memory modules on the market that emphasize support for functional safety. Most solutions highlight their hardware design compliance with ASIL-B or ASIL-D requirements, including built-in error correction mechanisms (ECC), redundancy design, data backup, and power-off protection.However, truly effective solutions that help developers lower the verification threshold and quickly integrate into main systems are rare.In practice, even if the memory hardware itself meets ISO 26262 safety design requirements, the overall system cannot smoothly complete functional safety verification without corresponding software support and certification documentation. This is the pain point most module developers encounter when introducing safety memory:*Lack of directly integrable software components and APIs*Inability to provide Safety Requirements Documents (SRD) and software verification reports*Software does not comply with ISO 26262 Part 6 development process requirementsIn other words, in the battlefield of functional safety, hardware alone is not enough—comprehensive software integration and verification resources are also needed to truly solve the problem.Winbond W77Q / W77T Safety Solution: A Comprehensive, Compliant Secure Flash Memory SolutionTo address the above market needs, Winbond has launched the W77Q/T secure flash memory solution for automotive ECU and module applications, providing comprehensive support from hardware, software, to verification processes, helping customers quickly achieve ISO 26262 compliance.Differentiator 1: Software Package Certified to ISO 26262 Part 6We offer not just hardware, but a software package that has been fully validated through the functional safety development process. This software suite includes:*Secure memory access drivers (including ECC and redundancy mechanisms)*API interface documentation and sample code*Software Safety Requirements Specification (SSR), design documents (SDD), and test reports*Complete safety case documentationAll these materials are developed and validated according to ISO 26262-6 standards and can be directly referenced by system developers in their main system functional safety documentation. In practice, customers do not need to conduct their own functional safety analysis for the memory module; simply integrating our documentation and software supports the product verification process, greatly saving costs and time.Differentiator 2: Modular Hardware Design for New and Legacy SystemsTo address the characteristics of the module market, W77Q / W77T supports the following application features:*Drop-in replacement for existing modules: Can directly replace existing flash components without modifying the PCB or driver architecture, enabling seamless upgrades.*Support for scalable architectures: Modules can be selected for ASIL-C or ASIL-D levels, meeting different module application needs (e.g., power control vs. lighting control).*Automatic power-off backup and independent safety processing unit (Safety Island): Enhances the module's ability to maintain minimum safety functions in the event of unexpected situations.This dual support design for "legacy system upgrades + new system acceleration" is especially suitable for module suppliers undergoing functional safety transformation.One-Stop Compliance Support Opens New Channels for Module MarketsOverall, the W77Q/ W77T secure flash solution is not just a component, but a complete "functional safety compliance accelerator."Credit: CompanyFor module and ECU developers, such a solution not only reduces the burden on internal functional safety engineers but also enables rapid completion of customer-required functional safety reports, accelerating product adoption by OEMs. This truly achieves a transition from compliance to competitiveness.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on TSMC's N5 process for integration with the TSMC SoIC-X technology. Targeted for AI, HPC, xPU, and networking applications, the IP achieves a breakthrough 36Gbps performance with Adaptive Voltage Scaling (AVS), delivering 2× better power efficiency at the required data rate. This solution offers an industry-leading bandwidth density of 1.5TB/s per mm of die edge. The chip was assembled using TSMC's advanced SoIC-X and CoWoS (Chip-on-Wafer-on-Substrate) packaging technologies.Earlier this year, GUC demonstrated UCIe-32G silicon on the TSMC N3P process at the TSMC 2025 North America Technology Symposium. In 2024, GUC also taped out its UCIe LP (Low Power) solution featuring AVS on the TSMC N5 process, aimed at meeting the growing bandwidth demands of multi-die integration in AI, HPC, and networking applications. Leveraging extensive experience in 3D interface IP and SoIC design, GUC developed a Face-Up version of UCIe LP IP, enabling robust die-to-die interconnect for the bottom die of SoIC-X configurations. Looking ahead, GUC is actively developing UCIe 64G IP, with plans to tape out by the end of 2025, addressing the ever-growing need for higher bandwidth in next-generation chiplet-based systems.To reduce PHY power consumption, all GUC UCIe LP IPs incorporate Adaptive Voltage Scaling (AVS), optimizing supply voltage and driving strength to improve power efficiency by up to 2x. A training algorithm dynamically selects minimal voltage and drive strength to meet eye margin criteria, ensuring reliable operation under varying voltage and temperature conditions. Additionally, the IP integrates proteanTecs' I/O signal quality monitors, allowing real-time performance monitoring without the need for re-training or data transfer interruption.For easy integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low latency, and low power, with efficient end-to-end flow control, facilitating a seamless transition from single-chip NoC architectures to chiplet-based systems. They support Dynamic Voltage and Frequency Scaling (DVFS), enabling on-the-fly changes in digital supply voltage and bus frequency while maintaining uninterrupted data flow."With industry-leading UCIe solutions now available on the TSMC N5 and N3P technologies, we are excited to introduce the brand new UCIe Face-Up IP for SoIC-X, supporting 36Gbps with twice the power efficiency," said Aditya Raina, CMO of GUC. "We've built a complete, silicon-proven 2.5D/3D chiplet IP portfolio across TSMC's 7nm, 5nm, and 3nm process technologies. Combined with our expertise in design, package integration, electrical and thermal simulation, DFT, and production testing, we deliver a comprehensive solution that accelerates development cycles and product ramp-up for AI, HPC, xPU, and networking customers.""Our mission is to provide the fastest and lowest-power 2.5D/3D chiplet interface IPs, enabling a smooth transition from monolithic SoCs to modular chiplet architectures," added Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging, leveraging HBM3/4, UCIe, and GLink-3D interfaces, paves the way for highly modular processors that exceed traditional reticle limits."GUC UCIe LP Face-up IP HighlightsTo learn more about GUC's UCIe IP portfolio and TSMC's CoWoS and SoIC total solution, please contact GUC sales representative via email (https://www.guc-asic.com/en/contact)

Over 100 business and technology leaders from across our customer and partner network gathered for the EdgeOpen Consortium APAC 2025 event, held at ADLINK headquarters in Taoyuan, Taiwan, on May 19-20, 2025.Credit: CompanyStephen Huang, ADLINK's President and Chief Operating Officer, officially commenced the event with a keynote titled "Empower AI at the Edge: Scale by Industrial Application." He emphasized the critical role of customer insights in shaping ADLINK's strategic direction.By staying close to customer needs, Stephen Huang explained, ADLINK has critical insight into key challenges, especially the need for faster deployment, greater system intelligence, and reduced complexity. These insights have shaped ADLINK's response to global uncertainties: rather than simply delivering hardware, ADLINK focuses on integrated solutions that add software value to unlock the full potential of AI at the edge.ADLINK transforms market risks into business momentumStephen Huang acknowledges the growing challenges in today's global landscape, including trade tariffs, geopolitical tensions, overcapacity, and currency fluctuations. But rather than viewing these as roadblocks, ADLINK sees them as catalysts for innovation and momentum. Outlined key initiatives in response to these challenges:*Supply Chain Resilience: In response to global disruptions, ADLINK has established dual-site manufacturing in Taiwan and China, ensuring agility and continuity. *Operational Efficiency: With an integrated supply and value chain, ADLINK has streamlined operations to adapt quickly and reduce costs. Innovative *Breakthroughs: ADLINK is driving deeper capabilities in its proven solutions, such as the OSM module, SMU tester, rugged panel PCs, and Soft Motion software, to support more complex and connected edge scenarios.Credit: CompanyOver the past decades, ADLINK has evolved by creating a robust lineup of products designed for edge AI applications. This strong foundation now supports a new phase of innovation, software-integrated solutions that meet the growing demand for intelligent, connected systems. Looking ahead, General Manager Stephen Huang emphasized ADLINK's focus on key technology innovation and its continued close collaboration with industry leaders to develop core technologies that shape the future jointly.Concluding his keynote, he shared a vision of collaboration: "I hope that not only ADLINK, but also our partners, will continue to support and co-create Edge AI solutions, so we can unlock more opportunities and drive real business growth together."Global technology leaders share edge AI strategiesFollowing the opening keynote by Stephen Huang, ADLINK's President and COO, global technology leaders took the stage to share their strategic insights on the future of edge AI. The partner keynote series began with Intel, which highlighted how open ecosystems and scalable platforms are accelerating innovation at the edge. MediaTek followed with its perspective on enabling the next generation of AIoT applications across a wide range of industries. AUO Display Plus showcased how advancements in green display technologies are reshaping visual experiences in both industrial and commercial environments. NXP explored the role of machine learning in transforming smart factory operations and strengthening secure edge connectivity. Phison introduced breakthroughs in high-performance and endurance flash storage that not only reduce GPU cost but also enhance the inference performance of private generative AI. SynaXG concluded the session with a forward-looking perspective on expanding AI from centralized infrastructure to mobile and autonomous systems, such as robotics, connected vehicles, and drones. These strategic contributions set the tone for a day centered on real-world edge AI innovation and collaborative momentum.Credit: CompanyEcosystem collaboration with leading solution partnersComplementing the presence of global technology leaders, and prominent channel partners from across the Asia-Pacific region, including Macnica Altima Company, HF Technology, RTC Technology, and PB Technology, shared market insights, success stories, and collaborative achievements with ADLINK. Their involvement highlighted the strength of regional partnerships in accelerating edge AI adoption.Several solution partners also took the stage to present how their technologies integrate with ADLINK hardware to deliver real-world solutions. These included AUO, Elma Electronic Taiwan, Phenikaa-X, Tallgeese AI, Hailo, CyberLink, Wind River, Delta Electronics, AUO Display Plus, and Euresys. Their presentations demonstrated the power of ecosystem collaboration in delivering reliable, high-performance edge AI solutions tailored to a wide range of vertical markets, including manufacturing, healthcare, transportation, and smart cities.Accelerating edge AI adoption with scalable solutionsThe exhibition featured an application-focused showcase area, highlighting real-world implementations of ADLINK's edge AI solutions. From modular hardware and ruggedized devices to intelligent systems, the demonstrations illustrated how innovation is translated into practical solutions that help customers address frontline challenges.In smart manufacturing, ADLINK showcased its Soft-landing solution, empowered by SoftMotion EtherCAT controllers, along with a high-speed AI AOI inspection solution, enabling precise, multi-axis motion control and enhancing real-time, reliable quality management. For intelligent vision applications, ADLINK demonstrated a plug-and-play AI OCR solution powered by Euresys Open eVision software and the NEON smart camera, which adapts easily to diverse lighting conditions and requires no pre-training. In the area of interactive AI, ADLINK collaborated with Avalanche Computing, OSENSE, and Phison to launch an edge AI solution supporting private, offline LLM deployment. This enables the fast and low-cost implementation of AI assistants, smart customer service, and on-premises knowledge retrieval, ensuring both data privacy and system flexibility.ADLINK also introduced advanced AI-based safety applications and smart display technologies. In partnership with TeamMax, it presented an AI-powered fire and smoke detection solution for real-time monitoring and early warning in industrial and public spaces. Collaborating with AUO Display Plus, ADLINK showcased an energy-efficient HiRaso Panel PC and passenger information display systems (PIDS), highlighting the synergy between edge computing and next-generation smart displays. Additionally, in collaboration with its partner EGK, ADLINK developed a solution to enhance the in-vehicle experience, further advancing intelligent transportation systems. These comprehensive solutions demonstrate ADLINK's ability to deliver deployable, cross-industry edge innovations that accelerate AI adoption and drive digital transformation across sectors.

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing.Comprehensive Showcases: From Hardware to Data Center ManagementASUS's booth centered around a diversified server product line and integrated hardware-software systems. These are paired with data center management and monitoring solutions, presenting a well-rounded, detailed exhibit. In particular, ASUS features purpose-built architectures aligned with the NVIDIA AI Factory concept, designed to optimize next-generation data center infrastructure.As future AI applications require increasingly massive token processing capabilities, computing demands grow significantly. ASUS's new design architecture focuses on boosting performance and AI processing power while simultaneously addressing the challenges of thermal management. The booth highlighted versatile cooling options, including air- and liquid-cooled cabinet systems, making this one of the key attractions for visitors.Complete Lineup: NVIDIA HGX, NVIDIA MGX, and NVIDIA Blackwell Architectures for Rapid AI Infrastructure GrowthAt the entrance of the exhibition space, ASUS showcased its AI POD full-rack system based on NVIDIA HGX systems, supporting NVIDIA Blackwell and Blackwell Ultra GPUs. Known for its scale-up capabilities in a single server, the HGX system is a critical solution for high-performance computing needs.Next comes the NVIDIA MGX-based solutions, utilizing PCIe to deliver scalable and flexible AI computing power. ASUS emphasizes its certified, reference-architecture-based product line, validated by NVIDIA for performance and reliability, helping customers build independent, tailored AI infrastructure suited for various use cases.This year's highlight is the latest NVIDIA Grace Blackwell architecture. ASUS presents its NVIDIA GB200 NVL72 rack solution, targeting high-end AI POD full-rack systems featuring the NVIDIA GB200 and GB300 platforms. This powerful setup includes 72 Blackwell Ultra GPUs and 32 NVIDIA Grace CPUs, forming a system with 18 compute trays and 9 switch trays. Notably, the entire rack is equipped with a full liquid cooling system, maximizing computing density and energy efficiency, showcasing the next generation of performance-driven design.Software Tools Empower Enterprise AI DevelopmentOn the software front, ASUS supports customers from the early planning and deployment of AI server racks through infrastructure management and monitoring. Solutions such as ACC and AIDC offer one-stop deployment and operations support, addressing the entire data center lifecycle.ASUS also presented its collaboration with NVIDIA in deploying Agentic AI systems, custom AI agents capable of reasoning, planning, and action-taking. The integration of NVIDIA AI Workbench enables development teams to flexibly build applications on local or remote GPUs, streamlining workflows from experimentation and prototyping to proof-of-concept. This delivers an accessible, robust toolkit for enterprise AI development.Additionally, inspired by ChatGPT, ASUS introduces AI Hub, a software solution that simplifies LLM (Large Language Model) usage for enterprise teams. Now part of ASUS's AI infrastructure portfolio, AI Hub provides pre-integrated tools, open-source software, and LLM resources. It also supports collaboration with AI model developers, cloud service providers, and system integrators, helping enterprises more easily build and scale their AI applications and accelerate their innovation journey.

Various generative AI tools and services have gradually permeated everyday life and the workplace, driving rapid market growth and attracting startup teams to enter the field. Founded in Seattle in 2020, Seasalt.ai is one of the rising stars that began developing intelligent voice solutions even before the current generative AI boom.With a focus on the linguistically diverse and densely populated Southeast Asian market, the company has established Taiwan as its development and support center, offering AI-powered customer service agents and meeting assistant tools that excel in accurately recognizing local accents and understanding nuanced semantics.Co-founded by CEO Xuchen Yao and CTO Guoguo Chen, Seasalt.ai marks their second entrepreneurial collaboration. Instead of competing in dominant markets like the U.S. and China, the duo chose to focus on Southeast Asia - a region often overlooked by major tech giants."Our company name, Seasalt AI, not only comes from our roots in Seattle but also reflects our target market - Southeast Asia (SEA)," said Yao. He noted that most AI voice tools on the market tend to overlook the less widely spoken languages in the Southeast Asian region. "But these underrepresented areas are home to large populations and many businesses in need of support. Filling in the gaps left by the tech giants has become a unique opportunity for us."Seasalt.ai offers an AI meeting assistant, SeaMeet Copilot, which provides real-time meeting transcripts, structured summaries, and action items for each meeting. It seamlessly integrates with Google Meet - popular among local users - and is specifically optimized to recognize Taiwanese accents, accurately understanding complex sentences that mix both Chinese and English.Cloud-Based and Subscription: Ensuring Security and Product FlexibilitySeasalt.ai also offers the SeaX platform - an all-in-one omnichannel solution for businesses. It integrates voice and text to support AI-powered messaging and phone-based voice calls, with a focus on outbound marketing. The platform enables natural language Q&A summaries, bilingual Chinese-English interaction, and smooth integration with existing workflows.According to Seasalt.ai, SeaX empowers companies to book appointments via AI voice assistants, engage in two-way conversations, track marketing campaigns across SMS, WhatsApp, and phone, discover customer buying intent, analyze user behavior, and conduct surveys - bringing automation and personalization into one seamless system.Another key advantage is the speed of deployment. According to Yao, in the case of assisting the Taiwan External Trade Development Council (TAITRA) with building a customer-facing chatbot with GenAI, Seasalt.ai successfully launched it in just three months, compared to competing solutions with last-generation technology (such as Natural Language Understanding) that would have taken up to two years.Chen highlighted the usability of Seasalt.ai's tools, stating: "Approximately 70% to 80% of users are able to set up and maintain their AI chatbots independently using our documentation and examples. Only about 10% to 20% of large enterprise clients necessitate custom development."Regarding deployment strategy, it is important to keep product features up to date due to the rapid advancement of generative AI. Therefore, a cloud-first approach is often recommended, supplemented by customized private cloud solutions for clients with stricter data security requirements.Rapid Tech Growth: Pros and Cons for AI StartupsSeasalt.ai was born during the global outbreak of COVID-19. At that time, Taiwan's strict pandemic control measures and its startup-friendly environment made it an ideal springboard for the company's expansion into the Southeast Asian market.As one of the standout alumni of SparkLabs Taiwan, Seasalt.ai also benefited greatly from its collaboration with Taiwan Tech Arena (TTA), gaining valuable resources for growth. In December 2024, the company announced the completion of its seed funding round, raising NT$130 million. Investors included Z Venture Capital (ZVC), the corporate venture arm of LINE.In view of the rapid advancements in AI technology and the fast-evolving market landscape, Chen stated, "We began early and possess extensive knowledge of the field, allowing us to swiftly integrate new technologies. However, much of our initial work needs to be revised." He added that the plethora of new technological resources has also empowered Seasalt.ai to quickly update product features and improve user experience, thereby maintaining market competitiveness.Chen observed that the rapid advancement of generative AI technology has reduced development barriers, enabling startup teams to create prototypes and test the market at lower costs and within shorter timeframes. However, the reduced entry barriers have resulted in an increase in competitors, making it more challenging for new players to distinguish themselves in the market.Looking forward, Yao articulated that Seasalt.ai aspires to establish itself as the market leader in Taiwan while simultaneously innovating new products. One such product is SeaHealth, an AI-powered assistant intended as a front office solution for hospitals and clinics to facilitate proactive healthcare messages and communications for patients with chronic illnesses or elderly individuals living alone. The company's vision is to provide more convenient and accessible AI tools to a broader range of users.SeaMeet Copilot supports multilingual meetings and audio uploads. Credit: Company

In recent years, we have seen a rise in attacks of a previously unheard-of type – supply chain attacks. As attack prevention in systems becomes more and more sophisticated, including dedicated hardware and software, rogue players are moving to supply chain attacks to overcome systems before they have a chance to install and operate such protections.Supply chain attacksIn a nutshell, supply chain attacks target the systems during their production or shipment in order to install weaknesses before they reach their final destination. When an affected system is installed, it is already compromised. The weaknesses can then be used by the attackers at their will to infiltrate the systems, bypass protection mechanisms, and perform preplanned malicious actions.Since modern systems are created in multiple steps with components and processes sourced from global vendors, it is extremely hard for the vendors and the intended users to ensure everything is in perfect security order.In the past, it was sufficient to use logging and tracking, and in extreme cases, tamper-evident tapes and locks. It was a common belief that once a machine is assembled at the factory and put in a box, as long as that box reaches its destination intact, all is well.This is no longer true. Rogue organizations and even nations are using sophisticated technologies to mount hidden attacks at very early stages of the supply chain. This goes far back into the assembly process, component shipping, mass programming, and even component production. When looking at an electronic component with the naked eye, it's hard to tell an original from a counterfeit. And when that component is an essential part of the system operation and security, its replacement with a forged, potentially harmful one poses a serious security threat.We have learned of mystery components finding their way into high-profile servers, but this only tells part of the story. What if an attacker manages to create what looks like a genuine part and has that part assembled in an otherwise legitimate system? What will happen if that part holds code that the system will run? What if a remote attacker can use that to mount and unleash an attack at any given time?System makers are striving for a solution that is strong yet affordable, allowing them to verify authenticity and integrity of key components in the system at any stage of the supply chain, before and after assembly, before and after shipping, before and after deployment, and at any other time during the life cycle of that system.Securing the root of trustA Root of Trust (RoT) is a concept where a system starts from a known and secure state and measures every next stage of the execution chain before it is used, ensuring that only genuine code runs on genuine hardware. However, the root of trust must rely on some secure hardware and code that must be genuine, unaltered, and whole. If that RoT is compromised or replaced during some stage of the supply chain, there is no way of assessing the security state of the system.One solution that has been used before is a TPM (Trusted Platform Module) or some Secure Element. These are secure hardware devices with cryptographic capabilities that may be used to ensure the validity of the system. However, these components have many limitations. Their operation is strongly tied to the system software that they need to protect. Since these are discrete devices, they may also be replaced or bypassed. They are expensive and require more technical effort to be integrated, and they may not be adapted for all cases.Robust solution for securing the supply chainIf we can ensure that the system executes the original boot code, unmodified, and will not replace it at any stage with rogue code, and if we can remotely authenticate the code and the storage medium it is stored in, we can ensure that the system will be much less prone to the types of supply chain attacks we have described here. To do so, we need to add a mechanism to identify the storage medium in a cryptographically secure way and to ensure that it holds genuine, unmodified, and recent boot code.Boot code measurement and signature verification when done by software, is a known method which, as earlier noted, is not as safe as it should be since the software essentially measures itself.The stronger alternative is designing the storage medium to have these required capabilities. One way of doing so is to add a hardware based challenge-response enquiry mechanism to the storage medium, following a PKI (Private-Public Key Infrastructure) scheme, where the storage medium holds a unique private key that can be used to exclusively sign the challenge. The vendor can use this mechanism to query the storage medium at any time to verify that it's the genuine component arriving from the original manufacturer and assembled in the correct target system.A second, important mechanism, allows the vendor to verify the code stored in the device to ensure it is genuine unmodified and recent.Role of Post-Quantum Cryptography in supply chain protectionAs mentioned above, supply chain protection is based on PKI (Private-Public Key Infrastructure). Traditional crypto schemes such as RSA and ECC are no longer allowed for new designs. For that reason, Post Quantum schemes should be employed. One scheme that was adopted by NIST and CNSA is the Leighton-Micali (LMS) algorithm. This is a hash-based signature algorithm that is stateful, and as such, at the time of writing this, is practically impossible to break.Authenticated Code UpdateThe last piece of the puzzle has to do with secure update of the firmware code. Ensuring genuine code and code storage device is only good as long as the code does not need to be updated. When an update is deployed, it's essential to have the same level of protection as the rest of the supply chain. For that reason, code updates must also be signed and authenticated using PQC based algorithms and LMS algorithm was chosen for that purpose as well. It is used to sign the code updated, only this time the public key is stored in the storage medium, and the private key is used to sign the updates.To conclude, ensuring supply chain security requires robust measures such as remote attestation and cryptographic verification. Winbond Secure Flash enhances supply chain protection by integrating Post-Quantum Cryptography (PQC)-based remote attestation, ensuring that only authentic, unaltered flash device and firmware operates within systems. To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

To advance its digital transformation strategy and embody the CA-PDCA continuous improvement philosophy, ZDT (Zhen Ding Technology Group) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference. This event aimed to enhance corporate competitiveness. General Manager Chen-Fu Chien and senior executives from various units led the charge in promoting company-wide participation in lean and digital transformation improvements.In his opening remarks, General Manager Chen-Fu Chien emphasized that the proposal improvement conference is integral to ZDT's innovative culture. He stated that lean management and digital transformation serve as cornerstones for the Group's sustainable development. He urged all colleagues to proactively engage in improvements, participate fully, and focus on details, embodying the spirit of "never neglecting a good deed because it seems small" to achieve cumulative, long-term results.Organized by the Industrial Engineering Department, with participation from plant managers and judging committee members, the conference rigorously selected 8 outstanding proposals for the final presentation round. Presenters enthusiastically shared their experiences and achievements. Judges provided expert feedback from multiple perspectives, encouraging departments to amplify the benefits of these initiatives.The Gold Award of the 2025 Lean & Digital Initiative Presentation Conference was presented to the HB06 Laser Section team from the Flexible Printed Circuit Board (FPCB) Business Unit. Their winning proposal, "ESI Laser Efficiency Enhancement Improvement," utilized OEE big data analysis, process streamlining, and innovative improvement methodologies. It optimized laser precision calibration, delivered concrete benefits, and has been implemented in other plants. Notably, the number of proposals submitted in 2025 increased by 2.35 times compared to the same period last year, with cost improvement savings doubling. Digital platforms facilitated greater efficiency and transparency throughout the initiative.ZDT also promoted cross-unit benchmarking. Approximately 90 top-performing benchmark individuals were recognized and incentivized from various teams. They received cups personally inscribed by Chairman Charles Shen with the words "Kindness, Perseverance, Benefiting Others, and Gratitude," embodying the core ZDT culture that the Chairman expects all awardees to practice.General Manager Chen-Fu Chien commended all colleagues for their tangible improvement results and the excellent presentations during the finals. He directed plant managers and unit heads to prioritize and lead continuous improvement efforts. Furthermore, he instructed the Digital Transformation Center to conduct an in-depth analysis of the enabling improvement cases, develop systematic solutions to ensure realized benefits, disseminate successful practices to other units, and deepen the impact of the results. He also called for establishing a knowledge base of success stories, encouraging diverse innovation improvements such as cross-unit collaboration, industry-academia partnerships, and more. This ongoing effort aims to continuously deepen the Group's digital transformation and organizational evolution.

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