As global healthcare systems evolve, preventive medicine and digital health technologies are becoming key drivers of medical innovation. Aging populations, rising healthcare costs, and increasing chronic diseases are accelerating the transition from treatment-oriented care toward preventive, personalized, and data-driven health management.Within this transformation, Traditional Chinese Medicine (TCM) is being re-examined beyond its historical and cultural role. Increasingly, TCM is discussed in the context of systems-based healthcare, lifestyle regulation, and long-term health management. Its emphasis on prevention, adaptation, and holistic regulation reflects growing global interest in healthcare models that focus on maintaining balance and improving overall well-being.TCM has traditionally emphasized the dynamic relationship between human health and environmental changes. Practices such as seasonal adaptation, sleep regulation, dietary management, and stress balance share conceptual similarities with modern healthcare research in areas including circadian rhythms, lifestyle medicine, and preventive care.Meanwhile, advances in digital technologies are reshaping healthcare delivery. Wearable devices, mobile health platforms, and artificial intelligence (AI)-based analytics now enable continuous monitoring of physiological indicators, including heart rate variability, sleep patterns, activity levels, and stress-related signals. These technologies create new opportunities to connect traditional health concepts with modern data-driven healthcare systems.The integration of TCM with digital innovation has become an emerging interdisciplinary field. AI-assisted diagnosis, wearable health monitoring, smart herbal medicine production, digital supply chains, and biotechnology applications are opening new pathways for the modernization of traditional medicine.This article series explores the evolving role of TCM in modern healthcare, covering preventive health, lifestyle management, wearable technologies, AI applications, herbal biotechnology, smart agriculture, and the globalization of traditional medicine.Taiwan’s development in biotechnology, information technology, precision agriculture, and healthcare innovation provides a unique foundation for advancing this integration. Emerging research in plant-derived biomaterials, intelligent cultivation systems, and herbal medicine applications demonstrates the potential of combining traditional knowledge with modern science and engineering.The modernization of TCM does not mean replacing traditional practices with technology. Instead, it represents a process of reinterpretation—using scientific validation and digital tools to enhance understanding, application, and global communication of traditional healthcare concepts.Challenges remain, including standardization, clinical validation, regulatory frameworks, and data integration. However, as healthcare continues to move toward predictive, personalized, and continuously monitored models, TCM may contribute valuable perspectives on preventive care, holistic health management, and system-oriented healthcare thinking.The convergence of traditional medicine and digital innovation will continue to shape new possibilities for the future of global healthcare.
SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth Flash (HBF), a next-generation storage technology.The announcement coincides with the opening of 'FMS (Future of Memory and Storage) 2026,' held at the Santa Clara Convention Center in California from August 4 to 6 (local time). The company is set to present HBF as a key technology to overcome memory bottlenecks in the AI era through keynote speeches and panel discussions during the event.HBF technology is a new memory layer between HBM and SSDs. It enables high-speed data transfer similar to HBM while significantly expanding capacity by leveraging NAND technology. With the expansion of AI inference driving a surge in data volumes to process, HBF is gaining attention as a technology that simultaneously resolves bandwidth and capacity scalability challenges.This milestone comes about six months after launching the consortium in February this year, following the initial standardization partnership with Sandisk in August 2025. Capacity specifications cover up to 512GB based on two stack configurations (8-high and 16-high NAND dies). Bandwidth is categorized into three grades (Grade1~3), delivering scalable performance from approximately 0.4TB/s to 3.0TB/s.A key highlight is the interconnect linking HBF technology and processors. HBF technology adopts UCIe, an industry standard connection interface, laying the groundwork to flexibly integrate HBF technology across different processor types, including GPUs and CPUs.The standard also outlines 1. connection interfaces and electrical characteristics, 2. reliability and packaging guidelines for HBF die stack process, 3. software I/O guidelines.The specification was disclosed through the Open Compute Project (OCP), world's largest open data center technology initiative, positioning it as an open standard for the entire industry rather than a proprietary technology.SK hynix plans to leverage this release to expand the adoption of HBF technology in the AI storage market and foster the surrounding ecosystem. With Google and Tenstorrent currently participating in the HBF consortium, the consortium aims to expand its reach while enhancing technical maturity and market acceptance based on open collaboration.On the opening day of FMS 2026 (August 4, local time), SK hynix Executive Vice President Kim Chun-sung (Head of Solution Development) and Vice President Kang Uk-song (Head of Next Generation Product Planning) will deliver a joint keynote address, titled 'Orchestrating Efficient AI Infrastructure through Tiered Memory in the Era of Agentic AI.'As Agentic AI rapidly commercializes, the volume of data to process is surging alongside growing demands for higher speed and efficiency. Recognizing that a single memory type cannot address these complex challenges, both speakers will present the necessity and future direction of a next-generation architecture based on 'Tiered Memory' a framework that connects and optimizes diverse memory types into a unified system.On August 6, SK hynix Vice President Lim Eui-cheol (Head of Solution AT), Sandisk Vice President Rajeev Nagabhirava and Google DeepMind Senior Staff Engineer Xiaoyu Ma will join a panel discussion titled 'Breaking the Memory Wall with High Bandwidth Flash.' Bringing together key leaders across memory, storage and AI, the session will examine fundamental shifts in memory architecture across AI infrastructure and highlight the potential and role of HBF as a transformative solution.Furthermore, SK hynix will host an exhibition booth throughout FMS 2026, featuring a Partnership Zone, a Next-Generation Tech Zone and Tech Sessions.Notably, the company will publicly reveal for the first time its tenth-generation (V10) 375-layer 4D NAND wafer and products, which are currently under development. The 375-layer 4D NAND improves performance per watt by 2.5 times compared to the previous generation, making it optimized for AI infrastructure environments like data centers that demand high power efficiency and performance. The company plans to initiate mass production of high-performance, high capacity eSSDs based on the 375-layer 4D NAND early next year to reinforce its leadership in the AI NAND market.SK hynix will also display a versatile product lineup spanning mobile, PC, automotive and robotics, showcasing the company's competitive edge in memory technology and its collaborative achievements with customers in the AI era."With the rapid spread of AI applications, we are at a point where overall data processing structures must be redesigned," said SK hynix Executive Vice President and Head of Solution Development Kim Chun-sung, adding, "Through HBF, SK hynix will expand the boundaries between memory and storage and contribute to building new architectures that enhance overall system efficiency."SK hynix exhibition booth at FMS 2026. SK hynix
Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data center environments. Leveraging CXL technology, the MXC chip enables customers to build memory infrastructure with higher capacity, improved resource utilization, and greater flexibility.The CXL 3.2 MXC complies with CXL Type 3 specifications, including both CXL.mem and CXL.io protocols. It is designed with PCIe 6.x and CXL 3.2 protocol support, delivering data transfer rates of up to 64？GT/s. The chip integrates dual DDR5 memory controllers that support up to 8000？MT/s DDR5 memory. By converting host-side CXL memory requests into DDR commands in real time, it enables efficient data exchange between the host and backend memory, effectively breaking through the memory capacity limits of traditional servers.Additionally, the chip integrates PCIe 6.x PHY, DDR5 PHY, dual RISC-V processor subsystems, and a comprehensive set of management interfaces. It supports multiple CXL memory expansion form factors, including PCIe AIC cards and EDSFF modules, providing critical support for emerging memory applications such as memory expansion, pooling, and tiered memory architectures."The trial production of the CXL 3.2 MXC chip marks an important milestone in Montage Technology's pursuit of CXL innovation and commercialization," said Stephen Tai, President at Montage Technology. "As memory demands continue to surge in the AI era, we are providing our customers with high-bandwidth, large-capacity, and highly reliable memory expansion solutions, accelerating the large-scale adoption of CXL in data center and AI infrastructure."In addition to the chip, Montage Technology provides a complete software development kit (SDK) along with analysis and testing tools to help customers accelerate product development, compatibility validation, and mass production. The CXL 3.2 MXC has already been integrated into next-generation CXL products by leading memory module manufacturers, including Samsung and SK hynix, with initial validation successfully completed. The solution is designed to align with leading server platforms, including Intel Xeon and AMD EPYC, to ensure broad interoperability and optimal performance.Customer and Partner Feedback:Jangseok Choi, VP of Memory Product Planning at Samsung Electronics stated: "The combination of CXL 3.2 MXC with DDR5 memory technology offers data center customers a solution that balances performance and capacity. Our collaboration validates the value of CXL in increasing system memory capacity and resource utilization, and provides additional options for next-generation AI infrastructure."Uksong Kang, Head of Next Gen Product Planning&Std at SK hynix noted: "With the rapid adoption of large language models and generative AI, memory has become a critical factor in system performance. Montage Technology's MXC product demonstrates strong potential for supporting high-capacity memory expansion and resource sharing. We look forward to deeper collaboration in ecosystem validation and product innovation."Dr. Debendra Das Sharma, Senior Fellow and Chief I/O Architect at Intel remarked: "AI, next-gen cloud systems, and today's industry economics are reshaping server memory architecture and driving demand for CXL. Montage Technology's CXL 3.2 MXC demonstrates how the maturing CXL ecosystem delivers protocol support, compatibility, and performance, helping to unlock the memory expansion capabilities of next-generation Intel Xeon platforms."Amit Goel, corporate vice president, Compute and Enterprise AI Platform Solutions Engineering, AMD added: "AI and data center workloads are driving continuous evolution of system architecture, making memory a key factor in performance and scalability. We look forward to our continued collaboration with Montage Technology on CXL technologies to deliver a foundation for building more flexible and efficient memory architectures."Upcoming Events:Montage Technology will showcase its CXL 3.2 MXC solutions at the CXL DevCon on August 3, 2026, at the Santa Clara Marriott, and at the FMS (Future of Memory and Storage) exhibition from August 4–6, 2026, at the Santa Clara Convention Center (Booth #845), both in Santa Clara, USA. We warmly invite our customers, industry peers, and partners to visit our booth for in-depth exchanges on industry trends and potential collaboration opportunities.Montage Technology Announces Industry-First Trial Production of CXL 3.2 MXC Chip. Credit: Montage Technology
？Connected and digitized vehicles, machines, and energy systems place new demands on electronics. From now on, electronics must not only deliver high-performance but also detect cyberattacks, contain disruptions, and enable secure updates. Cyber resilience is therefore becoming a key factor for trust, availability, and market success. electronica 2026, taking place in Munich from November 10 to 13, will showcase the technologies that are essential for this.？Industrial systems, vehicles, and energy systems are increasingly evolving into networked electronic systems that are controlled, updated, and secured via software. Security mechanisms can therefore no longer be added as an afterthought but must instead be integrated right from the start into the system design, particularly for interfaces, updates, and software-defined functions.？At the same time, customers, regulators and operators expect solid proof of the security and updatability of electronic systems. "As the world's leading electronics trade fair, electronica 2026 in Munich brings together key players from across the entire value chain. In doing so, it creates a framework for addressing cybersecurity not in isolation, but as a shared architectural challenge for the electronics industry", explains Caroline Pannier, Exhibition Director of electronica.？Studies show growing pressure to act？Recent studies show how important an issue this is. The ENISA Threat Landscape 2025 report, for example, identifies attacks on public administration and the transport sector as the most common targets of cyberattacks, with phishing being the most frequently used method. In many cases, hackers target companies' operational technology (OT).？However, according to a PwC study, only about 15 percent of German companies have so far invested specifically in proactive security and resilience measures. The vast majority remain reactive: Investments are only made after incidents occur or as part of regular updates, without a systematic transformation concept for prevention.？Increasing regulation of cybersecurity？To encourage companies to take action and integrate security into products from the outset, the European Union has enacted the Cyber Resilience Act (CRA). It specifically regulates products that companies place on the European market. Among other things, it requires that products with digital components remain secure throughout their expected service life and address vulnerabilities throughout their lifecycle. It covers a wide range of electronic products, not just internet-enabled devices, but essentially all products with a direct or indirect logical or physical connection to a device or network.？Effectively countering cyberattacks？As a result, the CRA makes security a key development requirement. At the same time, AI-based systems give rise to new risks: data poisoning, model poisoning, and adversarial attacks can manipulate AI models and lead to incorrect decisions. Developers are responding to this with "security by design"—that is, with security mechanisms integrated from the outset into the architecture, secure firmware, and verifiable updates.？At the component level, this includes a hardware root of trust, Secure Boot, and Trusted Platform Modules (TPMs). Secure microcontrollers (MCUs) implement security functions directly within the device, ensuring, for example, that only authenticated firmware or signed code is executed during system startup.？Exhibitors showcase relevant technologies？At electronica, numerous exhibitors will present their innovations and solutions for resilient electronics. Infineon, for example, will address the issue of cyber resilience with, among other things, its "Optiga" security solutions for embedded security. In the context of secure, connected devices, Renesas primarily offers its secure "RA" microcontrollers, including isolated cryptographic operations, secure key storage, Arm TrustZone technology, and protection measures against side-channel attacks. Texas Instruments is expanding its product portfolio with its AM263x Sitara MCUs, providing, among other things, Secure Boot, cryptographic keys, and a hardware security module.？electronica as a platform for resilient electronics？The supporting program at electronica will also focus on cyber resilience, for example in the Cyber Security Forum and in a series of presentations and workshops on the Cyber Resilience Act. Industry experts will provide insights into the latest technologies as well as practical approaches and strategies for resilient electronic products. With this framework, electronica 2026 will provide developers, technical decision-makers, and CEOs with concrete guidance on how to make their companies more resilient against cyberattacks.
？Manufacturers are driving energy efficiency in electronics, automation and industrial applications？Energy efficiency is not a new trend in the electronics industry. However, demands are growing, driven by rising electricity prices, regulatory pressure as well as the increasing need for energy-efficient components for systems, power electronics, and IoT devices. From November 10 to 13, 2026, the international electronics industry will gather at electronica to discuss the latest trends in energy efficiency.？The debate over energy efficiency now encompasses the entire electronics value chain. It ranges from semiconductors, power supply and embedded systems to electromechanics and industrial connection technology. The question of how best to achieve energy efficiency is a recurring theme across nearly all application areas, from consumer electronics and automotive electronics to industrial systems and devices.？As the world's leading trade fair and conference for electronics, electronica brings together companies from across the entire value chain to discuss technical challenges and current trends in using energy efficiently. "Energy efficiency is becoming a key requirement for the electronics industry. At electronica, it's clear that efficient products are in demand today in virtually every sector—from electromechanics and automation to connected industrial applications," says Caroline Pannier, Exhibition Director for electronica.？Energy costs are falling thanks to efficient electronicsRecent studies show that energy efficiency is becoming increasingly important across various industries. In the automotive sector, the IEA's Global EV Outlook 2026 shows that electric mobility continues to gain momentum: in 2025, more than 20 million electric cars were sold worldwide, meaning that roughly one in four new cars sold is already electric. As a result of this trend, the demand for energy-efficient electronics is growing—from power electronics and charging infrastructure to battery technology.？A study by Fraunhofer IZM shows that modern technologies are improving energy efficiency. Because of this, the energy requirements of mobile networks will increase only moderately in the coming years despite rising data volumes. Energy efficiency is also becoming a greater focus in other sectors, such as electronics manufacturing. McKinsey concludes that it is possible to reduce energy costs for semiconductor factories by 20 to 30 percent through efficiency measures.？Energy efficiency often stems from the system？For the electronics industry, this means that energy efficiency is becoming a strategic factor both in the product itself and in the manufacturing process. This is particularly evident in the field of electromechanics. This field doesn't just deal with individual components, but also with the way connectors, housings, cable routing and interfaces interact with each other.Low contact resistance, robust connection technology, EMC-compliant design and maintenance-friendly systems reduce losses, enhance operational reliability and simplify maintenance. The focus is therefore increasingly shifting toward the system as a whole, which has to be designed to be energy-efficient in order to conserve energy directly at the source.？electronica provides a platform for efficient electromechanics？electronica covers the entire electronics value chain, which is the reason for the focus on electromechanics. Exhibitors such as Harting, Phoenix Contact and Weidmüller will be showcasing connectors, relays, switches and enclosure technology, among other products. Harting, for example, specializes in industrial connectivity solutions for the transmission of data, signals and power, and focuses on applications in the fields of electric mobility, renewable energy, automation and mechanical engineering.？Phoenix Contact also demonstrates that energy efficiency begins right at the electromechanical level, for example in connectors, terminals, enclosures, power supplies and interface solutions for electrification and automation. Weidmüller's product portfolio includes the likes of terminal blocks, connectors, PCB connectors and other components for the safe transmission of power, signals and data. Meanwhile, the distributor Arrow Electronics, together with its partners, focuses on electromechanical components and high-performance passive components, which are designed to improve energy storage and efficiency and reduce losses in applications such as electric mobility, renewable energy systems and industrial automation.？This clearly demonstrates that any visitors looking for energy efficiency at electronica will find it not only in semiconductors and power electronics, but also in the field of electromechanics.？At electronica 2026, around 3,500 exhibitors from some 60 countries will showcase their latest solutions for the All Electric Society. Topics such as energy efficiency, automation and the circular economy will also be addressed in the supporting program and in the forums, where participants will discuss technological developments, regulatory issues and sustainable concepts for the future.
？"Empowering the All Electric Society" – that is at the heart of electronica 2026, which will open its doors at the Munich Exhibition Center from November 10 to 13. The world's leading trade fair for electronics will once again present the industry's entire spectrum of technologies, products and solutions helping to pave the way for an All Electric Society. In this interview, electronica's new Exhibition Director Caroline Pannier provides an insight into the upcoming trade fair and the results of a long-term analysis of the industry's assessment of the economic situation.？There are still a good nine months to go before electronica 2026, but preparations are already in full swing. What can you already tell us about the upcoming trade fair, which you will be accompanying for the first time as Exhibition Director?？We are delighted that electronica 2026 will once again occupy all 18 halls of the Munich exhibition center, together with SEMICON Europa, taking place at the same time in two and a half halls. That means that electronica once again covers the entire spectrum of the industry, which makes it unique worldwide. To keep track of everything amid this diversity, we have made the hall layout even more coherent and clear. The semiconductor area has also been extended by an entire hall.As far as exhibitor registrations are concerned, we are at the same high level as for the previous event. All the key players are back on board. There will be a very strong European presence, and we are seeing significant growth in part, from France, Italy, Poland and the UK, for example. There's also been a high level of interest from exhibitors from the U.S. and Asia.？What topics will the trade fair focus on in particular?？In discussions with industry representatives, we have identified three overarching key topics that are currently in the spotlight and that all ultimately contribute to the All Electric Society: artificial intelligence, cyber resilience and energy efficiency. We are currently in the process of refining these themes and identifying sub-topics that are particularly relevant to the electronics industry right now from the user's point of view.？What will be new at the trade fair, and what highlights can you already reveal to us?？As you know, we attach great importance to offering a very extensive supporting program that leaves plenty of room for sharing expertise and ideas, and for networking. That's why the electronica stages, for experts to provide practical knowledge in talks on almost all fields of application, will once again be set up in the respective exhibition areas. A new addition, for example, is edge lab LIVE, a special area on edge computing that is very practice-oriented with workshops and lectures. There are also award ceremonies, pitch formats and several career initiatives. The CEO Roundtable with top-class speakers will kick off the event on Monday evening before the trade fair starts. The electronica Automotive Conference, where trends and challenges in the automotive value chain will be discussed, will also be held on Monday.？Messe München recently published a Future Monitor based on exhibitor surveys from the past 13 years. The companies were asked to assess the current and expected future economic situation in their sector. How do electronica exhibitors see the future?？The evaluation of the long-term analysis produced exciting results for our industry. The electronics companies surveyed are remarkably confident about the future and are far more positive about the economic prospects than the current situation. This optimism clearly shows the key role of the electronics industry. With its solutions and innovative strength, it is helping to tackle current social challenges. Our excellent booking situation underscores just how important world-leading trade fairs such as electronica are. They bring the entire world of electronics together in one place and offer a stage for new products, professional exchange and new impetus.？The next electronica takes place from November 10 to 13, 2026.Caroline Pannier is the new Exhibition Director of electronica. Messe München GmbH
？From November 10 to 13, 2026, the international electronics industry will gather at electronica. This year, the world's leading trade fair for electronics will focus, among other topics, on Artificial Intelligence. From Edge AI to AIoT and machine learning—in Munich, a spirit of innovation, key technologies, and industry expertise will come together in one place to showcase, discuss, and further develop the technologies of tomorrow.？Today, Artificial Intelligence (AI) ranges from Edge and Cloud AI to AI-powered quality control in manufacturing and robotics to smart mobility. AI has long become a strategic competitive factor, helping companies make their processes faster, more precise, and more cost-effective. At the same time, however, the demands on data quality, IT security, and integration into processes and products are increasing. The electronics industry is systematically driving the transformation through AI and strengthening its international competitiveness as a result. "This transformation is visible at electronica, which brings together top decision-makers and developers from around the world, and showcases the entire electronics value chain," explains Caroline Pannier, Exhibition Director of electronica.？Semiconductor industry benefits from AI boom？Recent studies confirm the trend that AI is emerging as the key driver of growth and innovation in the industry. The Capgemini study The Semiconductor Industry in the AI Era, for example, shows that the widespread adoption of AI and generative AI is driving up demand for semiconductors. At the same time, downstream industries expect chip demand to rise by 29 percent by the end of 2026. A study by McKinsey also shows that semiconductor segments that produced components for AI applications grew by 21 percent annually from 2019 to 2023, while the industry as a whole achieved growth of just 6 percent.？Edge AI and AIoT are becoming key factors in the electronics industry？The trending topics of Edge AI and AIoT, in other words, the use of Artificial Intelligence directly on devices and in connected systems, are currently particularly relevant for the electronics industry. Both approaches enable data to be processed in real time where it is generated, such as in sensors, controllers, or embedded systems. That reduces latency, takes the load off the cloud, and improves data privacy, energy efficiency, and reliability.？At the same time, AI and robotics are becoming increasingly important in industrial automation, above all in the field of AI-based quality control. Automatic detection of the smallest deviations and defects on components, printed circuit boards, or in production processes helps reduce scrap, speeds up inspection processes, and ensures more stable operation of production lines. Another focus is on AI on microcontrollers: Advances in TinyML and optimized embedded AI models make it possible to provide intelligent AI functions even on hardware with limited resources.？Bringing hardware and software closer together through AI？At electronica 2026, Infineon, STMicroelectronics, and NXP Semiconductors rank among the particularly relevant exhibitors in the AI sector. Infineon is primarily driving the development of Edge AI and IoT solutions for smart, energy-efficient devices. STMicroelectronics combines embedded processing, Edge AI, and mobility-related applications. NXP Semiconductors demonstrates how solutions for automotive, industrial & IoT, and communications infrastructure can be integrated into embedded systems, microcontrollers, and microprocessors. In the automotive sector in particular, the focus is shifting toward the AI-Defined Vehicle (AIDV): a vehicle in which AI not only optimizes individual functions but also increasingly shapes perception, assistance, interaction, and driving behavior. Together, these companies demonstrate that AI is increasingly being integrated directly into sensors, embedded systems, and industrial applications.？This semiconductor environment is complemented by traditional embedded systems providers such as Advantech and Kontron, which are driving the practical application of AI. Advantech explicitly describes its portfolio as the foundation for AIoT solutions—from sensor nodes to embedded PCs, gateways, and IoT cloud platforms. With its expanded portfolio of IoT, and industrial control and communication solutions, Kontron covers the entire spectrum from modules to complete systems, including software. Both companies are thus creating infrastructural conditions needed to operate AI-based solutions in industrial environments in a reliable, connected, and scalable manner.？A platform that brings together embedded computing, edge technologies, and IoT—as well as developers, decision-makers, and system architects—is edge lab LIVE, which is making its debut at electronica this year. It combines the latest embedded technologies with practical applications and allows visitors to interactively experience edge environments.？Knowledge transfer and networking？At electronica 2026, about 3,500 exhibitors from around 60 countries will showcase their cutting-edge applications and solutions that are paving the way to the All Electric Society. Visitors can learn firsthand about all aspects of Edge AI, AIoT, and related topics across 18 halls at the Munich Trade Fair Center. In addition, a top-class supporting program, featuring an Executive Event with CEO roundtable, expert lectures, or networking events, will contribute to knowledge transfer. The numerous forums, such as the IIoT Forum and the Circular Economy Forum, will also encourage open discussion. SEMICON Europe, taking place in parallel across two and a half halls, will offer insights into the entire semiconductor industry value chain.
Corning's long-running intellectual property (IP) dispute with China-based IRICO has entered a new phase after the U.S. International Trade Commission (ITC) issued what Corning views as a fair and critical Initial Determination in the company's trade secret case.The ruling marks a critical legal moment in Corning's broader effort to defend its display glass compositions and fusion manufacturing technology against IRICO's unauthorized use of Corning's patented technology, the misappropriation of trade secrets, like engineering drawings, and the deployment of Corning's proprietary technology across its manufacturing lines.For Corning, the dispute is not merely a matter of one product line or one regional market. It is a direct defense of research, process expertise, and IP that underpin its position in high-precision display glass. "This latest decision from the International Trade Commission is clearly affirms our unwavering commitment to innovation," said Brendan Mosher, International Vice President and General Manager, Corning Display Technologies."We believe strong intellectual property protection, fair competition, and trusted partnerships are fundamental to a healthy innovation ecosystem. As a 175-year-old company, Corning is continuously advancing and protecting innovation so our customers across Asia can collaborate with confidence and compete successfully in global markets."April Wins Set the StageThe July 24 outcome follows two important legal wins for Corning in April. On April 7, an Administrative Law Judge at the ITC issued an Initial Determination in a separate glass-composition patent case, finding that IRICO infringed both asserted Corning patents and that the patents are valid.The determination also recommended a Limited Exclusion Order against IRICO, including certification requirements and a prohibition on importing IRICO-manufactured LCD glass substrates that fall within Corning's proprietary composition space, as well as products, such as LCD TVs and monitors, containing such glass.Corning stated that it sought the ruling to protect its proprietary display glass substrates and technology and enforce its intellectual property against infringing products imported into the United States.Corning secured another favorable result in Europe. On April 16, a judge at the Unified Patent Court in Germany ruled in a composition patent case that IRICO infringed Corning's patent and further confirmed the patent's validity. The ruling allows Corning to seek damages and enforcement of an order that could block televisions using IRICO's infringing glass from entering Germany.Together, the April rulings gave Corning added legal momentum ahead of the July 24 trade secret determination and reinforced its stated position that its display glass IP portfolio remains valid, enforceable, and strategically important.Trade Secrets Case Expands the StakesThe trade secret case carries broader significance because it goes beyond a single glass composition. According to Corning, the company had expected a favorable result based on what it described as clear evidence that IRICO stole engineering drawings and improperly used Corning's proprietary technology across its manufacturing footprint.Corning also stated that the trade secret case is important because it could restrict imports of all IRICO glass compositions manufactured using Corning technology, including the 616 composition that closely mirrors Irico's 615 composition found to violate Corning's patents.With the latest ITC ruling now in place, the dispute moves from a composition-patent fight toward a broader question of manufacturing know-how.In advanced materials, this distinction matters. The value of a technology platform is rarely limited to a formula or a finished product; it is embedded in process control, equipment engineering, production discipline, and accumulated know-how developed over decades.A favorable trade secret determination therefore strengthens Corning's ability to argue that the dispute concerns the core of display glass manufacturing, not merely the outer boundary of one patent claim.IP Protection as an Industrial DisciplineCorning's robust legal defense reflects a broader IP philosophy. The company states that invention and innovation have been central to its success for 175 years, and that its leadership in the LCD industry is built on investment, innovation, collaboration, and trusted customer relationships.It also emphasizes that IP protection is not only about safeguarding invention; it is about defending the long-term R&D investment that enables industry-changing products, sustainable customer success, and technologies that enhance people's lives.With a global patent portfolio spanning more than 30 countries and decades of experience and investment in technology commercialization and compliance, Corning frames IP protection as a foundation for trusted innovation in high-standard global markets.This is also where Corning draws a hard line. Its IP philosophy states that when the company finds unauthorized use or misappropriation of its technology, it will take action and will not tolerate situations where its IP is compromised or infringed.And Corning's message to the industry is direct: advanced materials innovation depends on intellectual property protection and fair competition.From Fusion Process to Industry-Wide ImpactThe dispute ultimately points back to the technology at the center of Corning's display glass leadership: the fusion process. Developed more than 60 years ago, the process was created to solve one of the most difficult challenges in precision glassmaking — how to produce large, thin, exceptionally flat glass sheets at industrial scale without compromising surface quality.Unlike conventional glass-forming approaches that may require contact with forming surfaces or extensive post-processing, Corning's fusion process allows molten glass to flow over both sides of a forming structure, meet at the bottom, fuse in midair, and be drawn into a pristine sheet. Because the exterior surfaces remain untouched during formation, the process can deliver the surface quality, dimensional stability, and thickness control required for advanced display manufacturing.Over decades, this manufacturing platform became a key enabler of the flat-panel display industry. Fusion-formed glass helped support the transition from bulky cathode-ray tube (CRT) displays to thin, flat, high-resolution screens, while giving panel makers the precision substrate needed for increasingly complex LCD and TFT processes.Its impact was not limited to material performance. By enabling larger substrates, higher productivity, and more advanced panel architecture, the fusion process also helped change the economics of display manufacturing.For Corning, defending the IP behind fusion-based display glass is therefore not a peripheral legal exercise. It is a direct defense of the technological foundation that helped reshape the global display industry.
Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) on July 21 held an investment briefing in Taiwan on its Mexico science park plan, bringing together representatives from Mexico and Sonora state as it advanced a project aimed at helping Taiwanese small- and medium-sized enterprises expand overseas. The initiative was highlighted as part of a broader push to give smaller suppliers a more direct path into foreign markets.TEEMA said the overseas science park concept took shape two to three years ago after executives identified a gap between the support available to large manufacturers and the barriers faced by smaller firms abroad. The association said local governments overseas also have limited resources when courting investment, since officials must approach companies one by one and can only match with a limited number of firms.As a result, TEEMA wants to act as an intermediary platform that connects small businesses with resources while also easing the workload for host governments. The association said Mexico responded faster than other countries and showed the strongest support, making it the first location selected for the overseas science park plan.TEEMA outlined three priorities for the park: giving large, medium and small tenants similar treatment; creating a single service window so companies can handle permits and local government coordination more easily; and building Taiwan-style living services, including familiar food and daily amenities, to reduce adjustment costs for staff posted overseas. The association said the park is designed to bring together large companies, small firms, governments, financial institutions, and overseas partners into an industrial cluster that can lower barriers to overseas investment.The association also said the effort comes as global industry is being reshaped by geopolitics, tariffs, supply chain restructuring, and the rapid rise of AI. TEEMA said competition is increasingly determined by the integration of supply chains, manufacturing, energy, logistics, talent, and services, and that Taiwanese companies need to expand overseas together rather than operate alone to preserve global competitiveness.
The Best AI awards were given out in two categories: artificial intelligence (AI) applications and integrated circuit (IC) design. AIYO was entered in the IC design category, but their concept – AI-powered acceleration of IC design – really straddles the two categories.Chip design is a long, arduous process. Today's chips contain billions of transistors, and designers not only have to design them to do what they want them to do, but have to ensure that the design satisfies a large number of rules and can actually be physically produced in a foundry. Since 2010, the number of transistors and gates has increased by nearly a hundredfold, but engineering productivity (as measured by the number of gates that a chip designer can design in a day) has increased by only about three times. This 29-times gap is set to widen even further over the next few years. In other words, it takes chip engineers more time than ever before to do their job.The problem lies not solely in the number of components on a chip but in the complexity in how they interact. The demand for custom silicon – ICs specially designed and optimised for specific applications or customers – and the sheer number of use cases now being designed for is growing, but it is getting harder and harder to find the engineering talent for custom silicon. Specialised silicon requires specialised talent.Tier-one design houses, like NVIDIA or MediaTek, can still find talent, but it's a different story for tier-two companies. Chip design is increasingly a bottleneck for technology companies to implement their AI-powered (and non-AI-powered) solutions.AIYO thinks that AI can help with that. It aims to reduce the gap between tier one and tier two companies, without completely replacing human design and the need for engineers. Engineers use natural language to provide their design specifications, including the constraints and requirements that the chip must satisfy. AIYO's AI agent then generates Verilog, which is a piece of code that describes the design of digital circuits.This Verilog must satisfy the specifications that the user set out. AIYO's agent can also optimise it along various metrics, such as for a lower power consumption, a higher performance (in other words, how fast the chip operates, as measured by its clock speed or data throughput), or a smaller area (PPA) are the most commonly invoked. Different chips prioritise these three factors (collectively known as PPA) differently, but AIYO can trade off, for example, a lower performance for a lower area and less power consumption.AIYO's agent then performs a closed-loop verification of the design to ensure that it is feasible. The agent reviews the error logs and iterates the design until the design passes all tests. Then – at least theoretically – the design is ready for tape-out, or actual production of the circuit at the foundry. Tape-out is an expensive process, costing in the millions of dollars, so it is essential that the finalised design performs as expected.AIYO uses RISC-V, an open-source instruction set architecture (ISAs) that has grown exponentially in popularity since its introduction in 2014; it has already been used in more than 20 billion cores. This avoids the need to pay a licensing fee to the more common (but not open-source) ISAs in use today, such as ARM or x86.The performance of IC-design agents can be measured using a standard set of test problems. Can the agent solve the problems (i.e., design a suitable IC) on the first pass? And can it solve a different set of IC design problems eventually, after however many iterations? AIYO performs at the head of the pack in both models, a little bit ahead of NVIDIA's VerilogCoder agent and far ahead of ChatGPT, DeepSeek, and Claude. One to two engineers are now required to design a chip, where three to five would have been needed before. Furthermore, it now takes these one or two engineers two months to design a chip (and they can test multiple designs simultaneously), whilst those three to five engineers in a traditional design house would have needed six months. This is an improvement in efficiency of roughly an order of magnitude.AIYO is still a work in progress, and humans are needed to check for any mistakes the engine might make – human engineers' jobs are safe, at least for now. But AIYO does makes it possible to compress the iteration cycle and for even tier-two chip design companies to realise their designs with limited human resources.One of AIYO's most pressing next steps is expanding its customer base – not only for commercial reasons, but also because this will expand their training data and thus improve their AI engine. AIYO currently has one customer who needs help designing custom FPGA (field-programmable gate array) integrated circuits. AI is, by default, a generalist, and its large language models can fail when faced with very specific use cases that it has yet to see. Helping this customer with its specific use cases can help the AI engine gain specialist skills, and the more customers that AIYO can obtain, the more versatile the tool will be.To this end, the team is expanding the set of design problems. A large set of open-source IC design problems already exists, but AIYO is also working on building their own set of synthetic design problems.The money from the Best AI Awards is great, says Ballard, but realistically, it is not even enough for one year's access to a top EDA (electronic design automation) tool – training AI models is expensive. He says that the biggest benefit from the awards is the people it has allowed them to meet, and in particular, the conversations they've been able to have. "They'll ask, 'Did you consider X, Y, and Z?' Sometimes yes, we have, but sometimes, we have an action item for the future."This also gives them an opportunity to enter talks with various venture capital investors and potential Taiwanese partners. AIYO is currently working with funding provided by the co-founders themselves, but they're hoping to find a Taiwanese venture capital investor in the next few months.Tang-Hung Po and Austin Ballard have been working on AIYO for only roughly a year. Po, originally from Taiwan and now based back in the country, obtained his master's in electrical engineering and computer science from the University of Michigan; he is the company's primary engineering lead. He brings more than 20 years of experience in SoCs (systems on a chip) and ASICs (application-specific integrated circuits) to AIYO, and was previously a director and a chief technical officer at other companies.Ballard, an American based in Seattle but with a Taiwanese mother, brings his experience scaling operations at Meta, Amazon and TikTok to now handle anything at AIYO not related to engineering, The time difference allows them to collaborate during Ballard's evenings and Po's mornings, and their almost diametrically opposite locations, along with their different skill sets, facilitates engagement with all sorts of partners on both sides of the world. (As a side benefit, Ballard now has a business reason to visit Taiwan!)The Best AI Awards celebrate global excellence in artificial intelligence and IC design, welcoming submissions from innovative companies and brilliant student teams. Following the success of the 2026 edition—advised by the MOEA, organized by DoIT, and executed by TCA—the prestigious competition is officially transitioning into an annual tradition.Offering substantial grand prizes and unmatched industry exposure, the countdown to Best AI Awards 2027 has already begun. Details on the next submission cycle, prize tiers, and eligibility rules will be released soon. Connect with us on LinkedIn for the latest official updates and application alerts.
