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Sources: Nanya PCB to further expand its flip-chip capacity in 2007

Amy Lee, Taipei; Jessie Shen, DIGITIMES Asia Monday 13 February 2006 0

Following its upcoming flip-chip (FC) substrate capacity expansion projects for this year, Nanya PCB plans to further increase its capacity in 2007, as demand for Intel’s dual-core processors and Sony's PS3 game consoles is expected to surge in...

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