ASE said to resume DRAM packaging at PSC request

Commercial Times, June 5; Esther Lam, DIGITIMES Asia Monday 5 June 2006 0

Advanced Semiconductor Engineering (ASE) is said to have budgeted NT$3.5 billion to invest in DDR2 packaging at the request of DRAM maker Powerchip Semiconductor Corporation (PSC), according to a Chinese-language Commercial Times report. Capacity...

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