Texas Instruments 45-nm chip making process doubles output per wafer, lowers power and boosts performance

Press release, June 13; Eric Mah, DIGITIMES Asia Tuesday 13 June 2006 0

Texas Instruments (TI) on June 12 unveiled details of a 45nm semiconductor manufacturing process that leverages a "wet" lithography process to double the number of chips produced on each silicon wafer, increase processing performance and reduce...

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