Winbond ups capex for 2008

Hans Wu, Taipei; Rodney Chan, DIGITIMES Asia Monday 29 October 2007 0

Winbond Electronics will increase its capital expenditure (capex) for 2008 and plans to spend NT$19 billion (NT$586.35 million) next year chiefly on the migration from 90nm production to 75nm and 58nm processes.

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