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Kinsus to benefit from Broadcom adoption of FC-CSP for 65nm chips, paper says

Commercial Times, November 21; Rodney Chan, DIGITIMES Asia 0

Taiwan-based Kinsus Interconnect Technology is expected to benefit from Broadcom's decision to adopt flip-chip chip scale package (FC-CSP) for all of its 65nm chips, as it is so far the only Taiwan FC-CSP substrate supplier that has received certification...

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