CONNECT WITH US

IC substrate makers see improving outlook

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia 0

A better market outlook is foreseen by IC substrate makers thanks to warming-up handset demand that is expected to spur chip-scale packaging (CSP) and flip-chip (FC) IC substrate demand, with a shortage for FC substrates possibly emerging in the third...

The article requires paid subscription. Subscribe Now