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DRAM production cutbacks lead to lower utilization at packaging and testing firms in early 2009

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 7 January 2009 0

Memory IC packaging and testing houses ChipMOS Technologies, Formosa Advanced Technologies Company (FATC), Power ASE Technology and United Test and Assembly Center (UTAC) are said to be experiencing lower utilization rates since the beginning of the...

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