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Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 30 June 2009 0

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and packaging for 12-inch wafers from Japan-based IDMs as a contributing...

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