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Kinsus FC CSP substrate utilization rate up on orders from Qualcomm

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia Tuesday 18 August 2009 0

Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the company expects it to reach 100% in the next two months mainly due...

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