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Broadcom and Ralink to separately launch integrated chips for ultra-thin notebooks by 4Q09, say IC distributors

Hans Wu, Taipei; Meiling Chen, DIGITIMES Asia Wednesday 19 August 2009 0

Both Broadcom and Ralink Technology are seperately scheduled to roll out integrated chips that combine Bluetooth and WLAN capabilities for ultra-thin notebooks between the end of the third quarter and the fourth quarter, according to IC distributors.

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