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LED chipmakers develop new substrates to improve heat dissipation

Siu Han, Taipei; Willie Teng, DIGITIMES Asia Friday 16 July 2010 0

LED chipmakers are developing new substrates based on copper-tungsten, ceramic or diamond thin-film to replace sapphire substrates to improve heat dissipation amid the surging demand for high-power LEDs used in LED lighting and TV backlighting, according...

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