ASE grabs copper wirebonding orders from second-tier players

Ingrid Lee, Taipei; Willie Teng, DIGITIMES Asia Wednesday 24 November 2010 0

With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier players such as Greatek Electronics, Taiwan IC Packaging (TICP)...

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