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STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Commercial Times; Jessie Shen, DIGITIMES Asia Monday 14 November 2011 0

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17), according to a Chinese-language Commercial Times report.

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